1-D TIRE PATCH APPARATUS AND METHODOLOGY

• US 20110132649A1
• Filed: 04/30/2009
• Published: 06/09/2011
• Est. Priority Date: 08/29/2008
• Status: Active Grant

• Current Assignee: Compagnie Generale DES Etablissements Michelin SCA, Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Original Assignee: Michelin Recherche et Technique SA (Compagnie Generale DES Etablissements Michelin SCA)
• Inventors: Hodgkinson, Raymond Leslie, Weston, David Alan
• Granted Patent: US 8,742,265 B2
• Time in Patent Office: Days
• US Class Current: 174/260
• CPC Class Codes: B29D 2030/0072 Attaching fasteners to tyres, e.g. patches, in order to connect devices to tyres
• CPC Class Codes: B60C 23/0411 Piezoelectric generators
• CPC Class Codes: B60C 23/0493 for attachment on the tyre
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Disclosed is a tire mountable apparatus and method that includes a substrate defining a longitudinal direction, a top surface and a bottom surface. The substrate has a plurality of conductor terminals arranged in a substantially linear relationship. A first support element is located below the bottom surface of the substrate and a second support element is located above the top surface of the substrate. The plurality of conductor terminals are positioned between the first and second support elements. The substrate may be a piezoelectric device having a piezoelectric layer arranged between first and second conductive layers. The plurality of conductor terminals may be arranged in a substantially linear relationship along a line about 80° to about 100° to the longitudinal direction of the substrate, and the longitudinal direction of the substrate being substantially perpendicular to the direction of rotation of the tire.

Claims

1. A tire mountable apparatus, comprising:

a substrate defining a longitudinal direction, a top surface and a bottom surface, the substrate comprising a plurality of conductor terminals arranged in a substantially linear relationship;

a first support element located below the bottom surface of the substrate; and

a second support element located above the top surface of the substrate;

wherein the plurality of conductor terminals are positioned between the first and second support elements.

2. The tire mountable apparatus of claim 1, wherein the substrate comprises a piezoelectric device comprising a piezoelectric layer arranged between first and second conductive layers.

3. The tire mountable apparatus of claim 1, wherein the plurality of conductor terminals are arranged in a substantially linear relationship along a line about 80°

to about 100°

to the longitudinal direction of the substrate, and the longitudinal direction of the substrate being substantially perpendicular to the direction of rotation of the tire.

4. The tire mountable apparatus of claim 1, wherein the first support element comprises a pair of first and second posts extending from the first support element, the first and second posts each extending through one of the plurality of conductor terminals of the substrate.

5. The tire mountable apparatus of claim 4, wherein the first and second posts each extend through the second support element and are operably connected to a printed circuit board located above the second support element, the first and second posts each providing an electrical connection between the printed circuit board and the substrate and providing mechanical support for the printed circuit board.

6. The tire mountable apparatus of claim 4, wherein the tire mountable apparatus comprises an electrical connector configured to provide an electrical connection between the printed circuit board and at least one of the plurality of conductor terminals on the substrate.

7. The tire mountable apparatus of claim 1, wherein the plurality of conductor terminals comprises a pair of outer conductor terminals and a pair of inner conductor terminals, the outer conductor terminals being operably connected to a first piezoelectric device within the substrate, and the inner conductor terminals being operably connected to a second piezoelectric device within the substrate.

8. The tire mountable apparatus of claim 7, further comprising a pair of first and second posts extending from the first support element and through the pair of outer conductor terminals and the second support element, the posts being operably connected to a printed circuit board so as to provide an electrical connection between the printed circuit board and the outer conductor terminals and to provide mechanical support for the printed circuit board.

9. The tire mountable apparatus of claim 5, wherein the tire mountable apparatus comprises solder at an interface between the first support element, the second support element, and the plurality of conductor terminals.

10. The tire mountable apparatus of claim 9, wherein the first and second posts provide a compression load to the interface between the first support element, the second support element, and the plurality of conductor terminals.

11. The tire mountable apparatus of claim 1, wherein the second support element and the first support element each have a width, the width of the second support element being less than the width of the first support element.

12. The tire mountable apparatus of claim 1, wherein the first support element is located in an elastomeric patch having a first surface and a second surface separated by a mesa, the second surface of the elastomeric patch being adhered to the bottom surface of the substrate.

13. The tire mountable apparatus of claim 12, wherein the first support element has rounded edges.

14. A method for reducing strain in a tire mounted assembly, comprising:

providing a substrate defining a longitudinal direction, a top surface and a bottom surface, the substrate comprising a plurality of conductor terminals arranged in a substantially linear relationship;

positioning a first support element beneath the bottom surface of the substrate so that the first support element overlaps the plurality of conductor terminals of the substrate; and

positioning a second support element above the top surface of the substrate so that the second support element overlaps the plurality conductor terminals of the substrate.

15. The method of claim 14, comprising:

positioning the conductor terminals of the substrate along a line about 80°

to about 100°

to the longitudinal direction of the substrate; and

mounting the substrate in a tire so that the longitudinal direction of the substrate is aligned substantially perpendicular to the direction of rotation of the tire.

16. The method of claim 14, wherein the substrate comprises a piezoelectric device comprising a piezoelectric layer positioned between a first conductor layer and a second conductor layer.

17. The method of claim 14, where in the method comprises:

providing a pair of first and second posts extending from the first support element;

connecting each of the first and second posts to one of the plurality of conductor terminals arranged on the substrate; and

securing a printed circuit board to the pair of first and second posts such that the printed circuit board is supported above the second support element.

18. The method of claim 14, wherein the method comprises providing solder at an interface between the first support element, the second support element, and the plurality of conductor terminals.

19. The method of claim 18, wherein the method comprises providing a compression load to the interface between the first support element, the second support element, and the plurality of conductor terminals.

20. The method of claim 19, wherein the method comprises providing the compression load by tightening the connection between the printed circuit board and the first and second posts.