Microfluidic Module Including An Adhesiveless Self-Bonding Rebondable Polyimide

• US 20110132870A1
• Filed: 02/16/2011
• Published: 06/09/2011
• Est. Priority Date: 09/17/2007
• Status: Active Grant

• Current Assignee: YSI Incorporated (Xylem, Inc.)
• Original Assignee: YSI Incorporated (Xylem, Inc.)
• Inventors: Moles, Donald R.
• Granted Patent: US 8,137,641 B2
• Time in Patent Office: Days
• US Class Current: 216/47
• CPC Class Codes: B01L 2200/0689 Sealing
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0627 Sensor or part of a sensor is integrated
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0887 Laminated structure
• CPC Class Codes: B01L 2300/12 Specific details about materials
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A method of making a microfluidic module is disclosed that includes forming a fluid flow channel in a self-bonding rebondable polyimide film to provide a channel sheet, the self-bonding rebondable polyimide film having a first mask layer self-bonded thereto; removing the first mask layer from the channel sheet after forming the fluid flow channel; and self-bonding the surface of the channel sheet exposed by removal of the first mask layer to a cover sheet.

Claims

1. A method of making a microfluidic module comprising:

forming a fluid flow channel in a self-bonding rebondable polyimide film to provide a channel sheet, the self-bonding rebondable polyimide film having a first mask layer self-bonded thereto,

removing the first mask layer from the channel sheet after forming the fluid flow channel; and

self-bonding the surface of the channel sheet exposed by removal of the first mask layer to a cover sheet.

2. The method of claim 1 wherein the forming of the fluid flow channel includes etching the first mask layer with a fluidic pattern and etching the fluid flow channel into the self-bonding rebondable polyimide film through the etched mask layer.

3. The method of claim 1 wherein the self-bonding rebondable polyimide film is a composite film that includes a thermoplastic polyimide in at least a top surface and a bottom surface of the film.

4. The method of claim 1 wherein the self-bonding step includes application of heat and/or pressure.

5. The method of claim 4 wherein the self-bonding step includes heating at about 275°

C. to about 325°

C. for about 5 minutes to about 3 hours.

6. The method of claim 5 wherein the self-bonding step includes applying pressure of about 300 to about 400 psi.

7. The method of claim 1 wherein the cover sheet is plastic, polyimide, self-bonding rebondable polyimide, or metal.

8. The method of claim 1 wherein the mask layer includes metal, silicon, or glass.

9. The method of claim 1 wherein the self-bonding rebondable polyimide film includes a second mask layer self-bonded thereto on a side opposite the first mask layer.

10. The method of claim 9 wherein at least one of the first and second mask layers is metal.

11. The method of claim 10 wherein the first mask layer includes copper.

12. The method of claim 11 wherein the second mask layer includes stainless steel.

13. The method of claim 9 further comprising removing the second mask layer after self-bonding the channel sheet to a first cover sheet.

14. The method of claim 13 further comprising self-bonding the surface of the channel sheet exposed by removal of the second mask layer to a second cover sheet.

15. The method of claim 1 wherein the removing of the mask layer includes exposing the mask layer to a chemical solution.

16. The method of claim 9 wherein the removing of the mask layer includes exposing the mask layer to a chemical solution that removes the first mask layer without removing the second mask layer.

17. The method of claim 1 further comprising self-bonding the self-bonding rebondable polyimide film to at least one mask layer.

18. The method of claim 1 further comprising self-bonding the self-bonding rebondable polyimide film simultaneously to the first mask layer and a second mask layer that are positioned on opposite sides of the self-bonding rebondable polyimide film.