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MICRO ELECTROMECHANICAL SYSTEMS (MEMS) HAVING A GAP STOP AND METHOD THEREFOR

  • US 20110133294A1
  • Filed: 12/08/2009
  • Published: 06/09/2011
  • Est. Priority Date: 12/08/2009
  • Status: Active Grant
First Claim
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1. A method of forming a micro-electromechanical system (MEMS) comprising:

  • providing a cap substrate;

    providing a support substrate;

    depositing a conductive material over the support substrate;

    patterning the conductive material to leave a conductive portion that forms a gap stop and a contact, wherein the gap stop is separated form the contact by an opening;

    forming a bonding material over the contact and in the opening, wherein the gap stop and the contact prevent the bonding material from extending outside the opening; and

    attaching the cap substrate to the support substrate by the step of forming the bonding material;

    wherein forming the bonding material comprises;

    forming a semiconductor layer over the conductive material; and

    heating the cap substrate and the semiconductor layer to form the bonding material and bond the cap substrate to the support substrate; and

    further comprising forming a stack over the conductive material wherein the step offorming the semiconductor layer is part of the step of forming the stack.wherein the step of forming the stack over the conductive portion further comprises;

    forming a seed layer comprising silicon over the conductive portion; and

    forming a first layer comprising silicon and germanium over the seed layer; and

    wherein the step of forming the semiconductor layer further comprises forming a second layer comprising germanium over the first layer.

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