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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

  • US 20110133309A1
  • Filed: 08/06/2009
  • Published: 06/09/2011
  • Est. Priority Date: 08/12/2008
  • Status: Active Grant
First Claim
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1. A semiconductor device where a first device where a number of first semiconductor chips and a second semiconductor chip for controlling communication between said first semiconductor chips and the outside or communication between said first semiconductor chips are stacked and a second device having at least one third semiconductor chip that communicates with said second semiconductor chip are mounted on a substrate, wherein said third semiconductor chip functions to substitute a first semiconductor chip, there are at least the same number of third semiconductor chips as there are first semiconductor chips that do not operate normally, from among said first semiconductor chips within said first device, and the third semiconductor chips are stacked so as to substitute the functions of said first semiconductor chips that do not operate normally.

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