INTEGRATED CIRCUIT PACKAGE SYSTEM FOR ELECTROMAGNETIC ISOLATION AND METHOD FOR MANUFACTURING THEREOF

• US 20110133316A1
• Filed: 02/16/2011
• Published: 06/09/2011
• Est. Priority Date: 12/07/2007
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Byung Tai Do, Heap Hoe Kuan, Rui Huang, Seng Guan Chow
• Inventors: Do, Byung Tai, Kuan, Heap Hoe, Chow, Seng Guan, Huang, Rui
• Granted Patent: US 8,269,320 B2
• Time in Patent Office: Days
• US Class Current: 257/659
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18301 : being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A method for manufacturing an integrated circuit package system includes: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.

Claims

1. A method for manufacturing an integrated circuit package system comprising:

providing a lead frame;

forming an integrated circuit package including the lead frame;

providing a selectively exposed area on the lead frame; and

coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.

2. The method as claimed in claim 1 wherein forming the integrated circuit package includes:

providing a leadfinger in the lead frame; and

forming an insulation step on the leadfinger for insulating the leadfinger from the conductive shielding layer.

3. The method as claimed in claim 1 wherein providing the lead frame includes forming a die attach pad on the lead frame for providing the selectively exposed area.

4. The method as claimed in claim 1 in which forming the integrated circuit package includes molding an insulating compound on the lead frame having an inverted die attach pad.

5. The method as claimed in claim 1 wherein providing the selectively exposed area includes providing a selectively exposed lead, a stepped lead, a conductive bead, an inverted die attach pad, a tie bar selectively exposed, or a combination thereof.

6. A method for manufacturing an integrated circuit package system comprising:

providing a lead frame having a leadfinger;

forming an integrated circuit package including the lead frame by molding an insulating compound;

providing a selectively exposed area on the leadfinger by blocking a selectively exposed lead from the insulating compound;

coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area including electrically coupling the selectively exposed lead; and

singulating an integrated circuit package system from the lead frame.

7. The method as claimed in claim 6 wherein forming the integrated circuit package includes:

coupling an integrated circuit to the leadfinger; and

forming an insulation step on the leadfinger for insulating the leadfinger from the conductive shielding layer including isolating a signal lead from the conductive shielding layer.

8. The method as claimed in claim 6 wherein providing the lead frame includes forming a die attach pad on the lead frame for providing the selectively exposed area including extending a tie bar from the die attach pad.

9. The method as claimed in claim 6 in which forming the integrated circuit package includes molding the insulating compound on the lead frame having an inverted die attach pad including bonding an electrical interconnect between the inverted die attach pad, a leadfinger, an integrated circuit, or a combination thereof.

10. An integrated circuit package system comprising:

a leadfinger singulated from a lead frame;

an integrated circuit package includes the leadfinger;

a selectively exposed area on the leadfinger; and

a conductive shielding layer, on the integrated circuit package, coupled to the selectively exposed area.

11. The system as claimed in claim 10 wherein the integrated circuit package includes an insulation step formed on the leadfinger for insulating the leadfinger from the conductive shielding layer.

12. The system as claimed in claim 10 further comprising a die attach pad in the integrated circuit package for providing the selectively exposed area.

13. The system as claimed in claim 10 in which the integrated circuit package includes an insulating compound on an inverted die attach pad and the leadfinger.

14. The system as claimed in claim 10 wherein the selectively exposed area includes a selectively exposed lead, a stepped lead, a conductive bead, an inverted die attach pad, a tie bar selectively exposed, or a combination thereof.

15. The system as claimed in claim 10 further comprising:

a selectively exposed lead formed on the integrated circuit package by an insulating compound blocked; and

wherein;

the selectively exposed lead coupled to the conductive shielding layer.

16. The system as claimed in claim 15 wherein the integrated circuit package includes:

an integrated circuit coupled to the leadfinger; and

an insulation step formed on the leadfinger to insulate the leadfinger from the conductive shielding layer for isolating a signal lead from the conductive shielding layer.

17. The system as claimed in claim 15 wherein the integrated circuit package includes:

a die attach pad for providing the selectively exposed area including extending a tie bar from the die attach pad.

18. The system as claimed in claim 15 in which the integrated circuit package includes an inverted die attach pad including an electrical interconnect bonded between the inverted die attach pad, a leadfinger, an integrated circuit, or a combination thereof.