METHODS AND APPARATUS FOR ENHANCED FREQUENCY RESPONSE OF MAGNETIC SENSORS

• US 20110133732A1
• Filed: 12/03/2009
• Published: 06/09/2011
• Est. Priority Date: 12/03/2009
• Status: Abandoned Application

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: Sauber, John B.
• Application Number:
  US12/630,362
• Publication Number:
  US 20110133732A1
• Time in Patent Office: Days
• US Class Current: 324/251
• CPC Class Codes: G01R 33/0023 Electronic aspects, e.g. circuits for stimulation, evaluation, control; Treating the measured signals; calibration G01R33/0017 takes precedence
• CPC Class Codes: G01R 33/0047 Housings or packaging of magnetic sensors packaging of semiconductor devices H01L23/00; Holders

Abstract

Methods and apparatus for providing an integrated circuit package device, comprising a conductive leadframe, a magnetic sensor element disposed on the leadframe, wherein the leadframe includes a slot configuration to reduce eddy current flow about the magnetic sensor, the slot configuration including a first slot generally perpendicular to a second slot, wherein the first slot extends under the sensor element.

Claims

1. An integrated circuit package device, comprising:

a conductive leadframe; and

a magnetic sensor element disposed on the leadframe;

wherein the leadframe includes a slot configuration to reduce eddy current flow about the magnetic sensor, the slot configuration including a first slot generally perpendicular to a second slot, wherein the first slot extends under the sensor element.

2. The device according to claim 1, wherein the second slot is generally parallel to an edge of the sensor element.

3. The device according to claim 1, wherein the first slot extends to an edge of the leadframe.

4. The device according to claim 1, wherein the first slot is longer than the second slot.

5. The device according to claim 1, wherein the second slot is not under the sensor element.

6. The device according to claim 1, wherein a portion of the second slot is under the sensor element.

7. The device according to claim 1, wherein ends of the second slot are rounded.

8. The device according to claim 1, wherein the device provides a generally uniform magnetic flux intensity over a width of the sensor element.

9. A method, comprising:

providing an integrated circuit package device, including;

providing a conductive leadframe; and

providing a magnetic sensor element disposed on the leadframe;

wherein the leadframe includes a slot configuration to reduce eddy current flow about the magnetic sensor, the slot configuration including a first slot generally perpendicular to a second slot, wherein the first slot extends under the sensor element.

10. The method according to claim 9, wherein the second slot is generally parallel to an edge of the sensor element.

11. The method according to claim 9, wherein the first slot extends to an edge of the leadframe.

12. The method according to claim 9, wherein the first slot is longer than the second slot.

13. The method according to claim 9, wherein the second slot is not under the sensor element.

14. The method according to claim 9, wherein a portion of the second slot is under the sensor element.

15. The method according to claim 9, wherein ends of the second slot are rounded.

16. The method according to claim 9, wherein the device provides a generally uniform magnetic flux intensity over a width of the sensor element.