Circuit Board with Radio Frequency Identification for Collecting Stage-by-Stage Manufacturing Metrics
First Claim
1. A multi-layer substrate, comprising:
- one or more circuits boards defined on the multi-layer substrate;
one or more automated optical inspection holes formed on the substrate and configured to identify the position and orientation of the one or more circuit boards; and
a radio frequency identification (RFID) tag coupled to the multi-layer substrate inside at least one of the automated optical inspection holes, the RFID tag configured to identify the one or more circuit boards as they pass through a plurality of stages of a manufacturing process.
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Accused Products
Abstract
A radio frequency identification (RFID) tag is coupled to a circuit board to track the specific operating and environmental conditions of each manufacturing stage as the circuit board passes through the manufacturing stages. An RFID reader and data collector are used at each stage to read the RFID tag and store its identifying information along with processing information, operating conditions, and results for each stage. This permits to quickly and accurately collect manufacturing information for each circuit board at various manufacturing stages as well as the operating conditions for each stage at a particular time. Such manufacturing metrics can then be retrieved on a stage-by-stage basis for a particular circuit board by an identifier printed on the circuit board.
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Citations
19 Claims
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1. A multi-layer substrate, comprising:
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one or more circuits boards defined on the multi-layer substrate; one or more automated optical inspection holes formed on the substrate and configured to identify the position and orientation of the one or more circuit boards; and a radio frequency identification (RFID) tag coupled to the multi-layer substrate inside at least one of the automated optical inspection holes, the RFID tag configured to identify the one or more circuit boards as they pass through a plurality of stages of a manufacturing process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A multi-layer circuit board, comprising:
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a substrate defining one or more electrical circuits; one or more automated optical inspection holes formed along non-circuit portions of the substrate; and a radio frequency identification (RFID) tag positioned inside at least one of the automated optical inspection holes, the RFID tag configured to identify the circuit board as it passes through each stage of its manufacturing process. - View Dependent Claims (12, 13, 14, 15)
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16. A circuit board, comprising:
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a multi-layer substrate defining one or more electrical circuits; and a radio frequency identification (RFID) tag embedded between two layers of the multi-layer substrate during a manufacturing process, the RFID tag configured to identify the circuit board as it passes through each stage of its manufacturing process. - View Dependent Claims (17, 18, 19)
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Specification