FABRICATION OF TOUCH SENSOR PANEL USING LASER ABLATION

• US 20110134050A1
• Filed: 12/18/2009
• Published: 06/09/2011
• Est. Priority Date: 12/07/2009
• Status: Abandoned Application

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: HARLEY, Jonah A.
• Application Number:
  US12/642,466
• Publication Number:
  US 20110134050A1
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

Fabrication of a touch sensor panel using laser ablation is disclosed. The fabricated touch sensor panel can have its touch sensors formed on an under surface of its cover substrate. A fabrication method can include depositing a conductive layer onto a substrate, depositing a dielectric material onto the conductive layer, ablating the conductive layer to define different regions for the touch sensors, and depositing a conductive material on the dielectric material. Another fabrication method can include sputtering a conductive material onto a substrate at discrete locations on the substrate, printing a dielectric material on the conductive material at the discrete locations, depositing a conductive layer over the substrate, and selectively ablating the conductive layer at the discrete locations to define different regions for the touch sensors. The touch sensor panel can be incorporated into a mobile telephone, a digital media player, or a personal computer.

Claims

1. A method comprising:

depositing a conductive layer onto a substrate;

depositing dielectric material onto the conductive layer;

ablating the conductive layer to define different regions of touch sensors; and

depositing a conductive material on the dielectric material.

2. The method of claim 1, wherein ablating the conductive layer comprises removing portions of the conductive layer to form gaps between the different regions.

3. The method of claim 1, wherein the different regions comprise rows and columns, the rows and columns being electrically isolated from each other, the rows having discontinuities therein and having contact with the conductive material to bridge the discontinuities.

4. The method of claim 1, wherein depositing the dielectric material comprises forming electrical insulators between the different regions.

5. The method of claim 1, wherein depositing the conductive material comprises forming electrical conductors between the different regions.

6. The method of claim 1, comprising ablating the dielectric material and the conductive material to reduce visibility of the dielectric material and the conductive material.

7. The method of claim 1, wherein the touch sensors are configured to sense a touch on a surface of the substrate that is opposite a surface with the conductive layer, the dielectric material, and the conductive material disposed thereon.

8. A method comprising:

depositing a conductive material onto a substrate at discrete locations on the substrate;

printing a dielectric material on the conductive material at the discrete locations;

depositing a conductive layer over the substrate; and

selectively ablating the conductive layer at the discrete locations to define different regions of touch sensors.

9. The method of claim 8, comprising ablating the deposited conductive material to remove portions of the conductive material and reduce a size thereof, wherein the conductive material is either transparent or opaque.

10. The method of claim 8, wherein printing the dielectric material comprises printing an electrical insulator between the conductive material and the conductive layer.

11. The method of claim 8, wherein selectively ablating the conductive layer comprises removing portions of the conductive layer to form gaps between the different regions without removing at least some of the underlying dielectric material and conductive material.

12. The method of claim 8, wherein the different regions comprise rows and columns, the rows and columns being electrically isolated from each other, the columns having discontinuities therein at the discrete locations and having contact with the conductive material to bridge the discontinuities.

13. The method of claim 8, wherein the deposited conductive material is configured to electrically connect at least some of the different regions.

14. The method of claim 8, comprising depositing a passivation layer on the conductive layer.

15. A method comprising:

depositing a first material onto a substrate;

depositing a second material onto the substrate;

ablating at least some of the deposited second material to define touch sensors; and

associating at least some of the deposited first material with connections to the touch sensors.

16. The method of claim 15, wherein:

depositing the first material comprises depositing at least some of the first material around a border of the substrate, the first material being conductive and opaque, and

depositing the second material comprises depositing at least some of the second material around the border of the substrate, the second material being conductive and transparent, the method comprising;

ablating the deposited second material and the deposited first material around the border of the substrate to define the connections to the touch sensors.

17. The method of claim 15, wherein depositing the first material comprises depositing at least some of the first material around a border of the substrate, the first material being dielectric and opaque, the method comprising:

depositing a third material onto the deposited first material around the border of the substrate, the third material being conductive; and

ablating the deposited third material to define the connections to the touch sensors.

18. The method of claim 17, comprising:

ablating at least some of the deposited first material around the border of the substrate during the ablating of the deposited third material; and

depositing a fourth material into gaps formed by the ablating of the deposited first material, the fourth material being dielectric and opaque.

19. A touch sensor panel comprising:

a cover substrate having a touchable surface;

multiple touch sensors formed on a surface of the cover substrate opposite the touchable surface, the touch sensors having been formed by ablating and printing at least one of conductive material or dielectric material; and

multiple connections formed on the surface of the cover substrate opposite the touchable surface to connect to the touch sensors, the connections having been formed by ablating and printing at least one of the conductive material or the dielectric material.

20. The panel of claim 19, wherein the ablating comprises laser ablating.

21. The panel of claim 19, wherein the printing comprises ink-jet printing or screen printing.

22. The panel of claim 19 incorporated into at least one of a mobile telephone, a digital media player, or a personal computer.

23. A structure comprising:

a substrate having been strengthened and formed into a shape;

a conductive pattern formed on a first surface of the substrate into touch sensors, the conductive pattern having been ablated and printed onto the first surface; and

a masking pattern formed on the first surface of the substrate in contact with the conductive pattern, the masking pattern having been ablated and printed onto the first surface.

24. The structure of claim 23, comprising:

another conductive pattern formed on a second surface of the substrate, the other conductive pattern having been ablated and printed onto the second surface,

wherein the second surface is opposite the first surface.

25. The structure of claim 23, wherein the conductive pattern forms a diamond pattern for the touch sensors.