ILLUMINATION SYSTEM USING PHOSPHOR REMOTE FORM LIGHT SOURCE

• US 20110134626A1
• Filed: 02/15/2011
• Published: 06/09/2011
• Est. Priority Date: 10/17/2005
• Status: Abandoned Application

• Current Assignee: Lumileds Lighting US LLC (Apollo Global Management, Inc.)
• Original Assignee: Lumileds Lighting US LLC (Apollo Global Management, Inc.)
• Inventors: PUGH, Mark, HARBERS, Gerard
• Application Number:
  US13/027,298
• Publication Number:
  US 20110134626A1
• Time in Patent Office: Days
• US Class Current: 362/84
• CPC Class Codes: G02B 6/0023 provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
• CPC Class Codes: G02B 6/0036 2-D arrangement of prisms, protrusions, indentations or roughened surfaces
• CPC Class Codes: G02B 6/0038 Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
• CPC Class Codes: G02B 6/0043 provided on the surface of the light guide

Abstract

The invention provides an illumination system and a method for illumination. The illumination system includes one or more light sources that produce a primary light, a light-mixing zone that homogenizes the primary light, a wavelength-converting layer that converts the primary light to a secondary light, and a light-transmitting zone that receives the secondary light and transmits the secondary light to, for example, a Liquid Crystal Display (LCD).

Claims

1-26. -26. (canceled)

27. A lighting device comprising:

a first substrate;

a plurality of non-packaged light emitting dies, each die having at least a first die electrode and a second die electrode; and

a second substrate,

wherein the plurality of dies are sandwiched between the first substrate and the second substrate to encapsulate the dies, wherein at least one of the first substrate and second substrate generally conforms to a thickness of the dies without any intermediate substrate layer needed for a spacer, wherein electrical connections between at least some of the dies are formed by conductors supported by at least one of the first substrate and second substrate, and wherein at least one of the first substrate and second substrate has light passing locations for emitting light.

28. The device of claim 27 wherein,

the first substrate has first connection locations electrically connected to first conductors formed on the first substrate,

wherein the first die electrode of associated dies are aligned with and electrically connected to an associated first connection location on the first substrate without wire bonds,

wherein the second substrate has second connection locations electrically connected to second conductors formed on the second substrate, the second die electrode of associated dies being aligned with and electrically connected to an associated second connection location on the second substrate without wire bonds, and

wherein portions of the first conductors and portions of the second conductors overlap and electrically connect when the first substrate and the second substrate are brought together to create a series connection of the dies without using wire bonds.

29. The device of claim 28 wherein the first connection locations are connected to the first die electrodes of associated dies by a conductive paste.

30. The device of claim 28 wherein the first conductors extend to first areas away from the dies and the second conductors extend to second areas away from the dies so that, when the first substrate and the second substrate are brought together, the first areas and the second areas are aligned, and electrical contact is made between the first conductors and second conductors.

31. The device of claim 28 wherein the dies are vertical diodes having a cathode electrode on a first surface and an anode electrode on an opposite surface, wherein at least some of the first conductors are connected to the cathode electrodes and at least some of the second conductors are connected to the anode electrodes, wherein the first conductors align with the second conductors when the dies are sandwiched between the first substrate and the second substrate to connect an anode of a first die to a cathode of an adjacent second die to connect the first die and the second die in series.

32. The device of claim 27 wherein at least one of the first substrate and second substrate is formed of a deformable material that deforms when conforming to the thickness of the dies.

33. The device of claim 27 further comprising an adhesive layer between the first substrate and the second substrate.

34. The device of claim 27 wherein the thickness of the dies is equal to or less than 200 microns.

35. The device of claim 27 wherein the second substrate has lenses formed in it.

36. The device of claim 27 wherein the second substrate has a flat light emitting surface.

37. The device of claim 27 wherein the first substrate and the second substrate are flexible.

38. The device of claim 27 wherein at least one of the first substrate and second substrate is less than 2 mm thick.

39. The device of claim 27 further comprising an encapsulant that fills any voids around the dies to encapsulate the dies.

40. The device of claim 27 further comprising a phosphor over a surface of the second substrate for creating white light.

41. The device of claim 27 wherein the first substrate comprises at least one reflector for reflecting light through the second substrate.

42. The device of claim 27 wherein a first edge of the first substrate and a second edge of the second substrate are connected together so that the first substrate and the second substrate are aligned when they are brought together for sandwiching the dies between the first substrate and the second substrate.

43. The device of claim 27 further comprising an electrical connection causing a plurality of strings of series-connected dies to be connected in parallel.