Telemetry System for Use With Microstimulator

• US 20110137378A1
• Filed: 01/28/2011
• Published: 06/09/2011
• Est. Priority Date: 06/28/2002
• Status: Active Grant

• Current Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Original Assignee: Boston Scientific Neuromodulation Corporation (Boston Scientific Corporation)
• Inventors: Haller, Matthew I., McClure, Kelly H., Park, Rudolph V., Marnfeldt, Goran N., Klosterman, Daniel J., Parramon, Jordi
• Granted Patent: US 8,655,451 B2
• Time in Patent Office: Days
• US Class Current: 607/60
• CPC Class Codes: A61N 1/36007 of urogenital or gastrointestinal organs, e.g. for incontinence control
• CPC Class Codes: A61N 1/3605 Implantable neurostimulators for stimulating central or peripheral nerve system
• CPC Class Codes: A61N 1/37205 Microstimulators, e.g. implantable through a cannula
• CPC Class Codes: A61N 1/37217 characterised by the communication link, e.g. acoustic or tactile
• CPC Class Codes: A61N 1/37223 Circuits for electromagnetic coupling
• CPC Class Codes: A61N 1/37229 Shape or location of the implanted or external antenna
• CPC Class Codes: A61N 1/37235 Aspects of the external programmer
• CPC Class Codes: A61N 1/3727 characterised by the modulation technique
• CPC Class Codes: A61N 1/37276 characterised by means for reducing power consumption during telemetry
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3787 from an external energy source
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H02J 2310/23 : The load being a medical device, a medical implant, or a life supporting device
• CPC Class Codes: H02J 50/10 : using inductive coupling
• CPC Class Codes: H02J 7/345 : using capacitors as storage or buffering devices
• CPC Class Codes: H04B 5/0037 : for power transfer
• CPC Class Codes: H04B 5/0081 : with antenna coils loop aerials H01Q7/00
• CPC Class Codes: H04B 5/26 : using coils
• CPC Class Codes: H04B 5/79 : for data transfer in combination with power transfer
• CPC Class Codes: H04L 27/02 : Amplitude-modulated carrier systems, e.g. using on-off keying; Single sideband or vestigial sideband modulation H04L27/32 takes precedence
• CPC Class Codes: H04L 27/10 : Frequency-modulated carrier systems, i.e. using frequency-shift keying H04L27/32 takes precedence
• CPC Class Codes: Y10T 29/4902 : Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 : by winding or coiling
• CPC Class Codes: Y10T 29/49073 : by assembling coil and core
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/49945 : by driven force fit
• CPC Class Codes: Y10T 29/49968 : Metal fusion joining
• CPC Class Codes: Y10T 428/12264 : having outward flange, gripping means or interlocking feature
• CPC Class Codes: Y10T 428/12271 : having discrete fastener, marginal fastening, taper, or end structure
• CPC Class Codes: Y10T 428/12347 : Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
• CPC Class Codes: Y10T 428/12375 : having member which crosses the plane of another member [e.g., T or X cross section, etc.]
• CPC Class Codes: Y10T 428/12396 : Discontinuous surface component
• CPC Class Codes: Y10T 428/12535 : with additional, spatially distinct nonmetal component
• CPC Class Codes: Y10T 428/12806 : Refractory [Group IVB, VB, or VIB] metal-base component

Abstract

An implantable microstimulator configured to be implanted beneath a patient'"'"'s skin for tissue stimulation employs a bi-directional RF telemetry link for allowing data-containing signals to be sent to and from the implantable microstimulator from at least two external devices. Further, a separate electromagnetic inductive telemetry link allows data containing signals to be sent to the implantable microstimulator from at least one of the two external devices. The RF bidirectional telemetry link allows the microstimulator to inform the patient or clinician regarding the status of the microstimulator device, including the charge level of a power source, and stimulation parameter states. The microstimulator has a cylindrical hermetically sealed case having a length no greater than about 27 mm and a diameter no greater than about 3.3 mm. A reference electrode is located on one end of the case and an active electrode is located on the other end of the case.

Claims

1. A neurostimulator system comprising:

a first external device;

a second external device; and

an implantable microstimulator having an antenna for generating stimulation pulses in accordance with programmed parameters,

wherein the first external device communicates with the antenna in the implantable microstimulator in accordance with a first communication protocol, and

wherein the second external device communicates with the antenna in the implantable microstimulator in accordance with at least a second communication protocol different from the first protocol.

2. The neurostimulator system of claim 1, wherein the first and second external devices can communicate with each other.

3. The neurostimulation system of claim 1, wherein the first communication protocol comprises a binary frequency shift key (BFSK) communication protocol, and the second communication protocol comprises an ON-OFF-KEY Pulse Width Modulation (OOK-PWM) communication protocol.

4. The neurostimulation system of claim 1, wherein the first external device comprises an external programmer, and wherein the second external device comprises an external charger.

5. The neurostimulation system of claim 4, wherein the external charger comprises a base station.

6. The neurostimulation system of claim 4, wherein the external charger comprises a chair pad.

7. A neurostimulator system, comprising:

an implantable microstimulator, wherein the microstimulator generates stimulation pulses;

a remote control for wirelessly communicating data to the microstimulator; and

a base station for wirelessly providing operational power and information to the microstimulator;

wherein the remote control unit and base station communicate with each other via a wireless telemetry link.

8. The neurostimulator system of claim 7, wherein the data is communicated to the microstimulator in accordance with a frequency shift key modulation scheme.

9. The neurostimulator system of claim 7, wherein the base station includes a coil for producing the power and the information.

10. The neurostimulator system of claim 7, further comprising a clinician'"'"'s programmer for wirelessly communicating with the base station and the remote control.

11. The neurostimulator system of claim 7, wherein the implantable microstimulator comprises:

an hermetically-sealed housing;

first and second electrodes external to the hermetically-sealed housing; and

telemetry circuitry for receiving the data communicated by the remote control, the power provided by the base station, and the information provided by the base station.

12. The neurostimulator system of claim 11, wherein the implantable microstimulator further comprises a power source within the hermetically-sealed housing which is charged by the power provided by the base station.

13. A neurostimulator system, comprising:

a remote control unit;

a base station; and

an implantable microstimulator for generating stimulation pulses in accordance with programmed parameters;

wherein the remote control unit communicates with the implantable microstimulator via a first radio frequency telemetry link;

wherein the base station communicates with the implantable microstimulator via either of a second radio frequency telemetry link or an electromagnetic inductive telemetry link; and

wherein the remote control unit and base station communicate with each other via a wireless communication link.

14. The neurostimulator system of claim 13, wherein the first radio frequency telemetry link operates in accordance with a frequency shift key modulation scheme.

15. The neurostimulator system of claim 14, wherein the electromagnetic inductive telemetry link operates in accordance with an On-Off-Key Pulse Width Modulation scheme.

16. The neurostimulator system of claim 13, wherein the implantable microstimulator comprises:

an hermetically-sealed housing;

first and second electrodes external to the hermetically-sealed housing; and

telemetry circuitry for receiving the first radio frequency telemetry link and the either of the second radio frequency telemetry link or the electromagnetic inductive telemetry link.

17. The neurostimulator system of claim 16, wherein the implantable microstimulator further comprises a power source within the hermetically-sealed housing which is charged by the electromagnetic inductive telemetry link.