Thin multi-chip flex module

• US 20110138617A1
• Filed: 02/17/2011
• Published: 06/16/2011
• Est. Priority Date: 01/02/2008
• Status: Abandoned Application

• Current Assignee: Microelectronics Assembly Technologies, Inc.
• Original Assignee: Microelectronics Assembly Technologies, Inc.
• Inventors: Clayton, James E., Fathi, Zakaryae
• Application Number:
  US12/932,087
• Publication Number:
  US 20110138617A1
• Time in Patent Office: Days
• US Class Current: 29/829
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/043 Stacked PCBs with their backs attached to each other without electrical connection
• CPC Class Codes: H05K 2201/056 Folded around rigid support or component
• CPC Class Codes: H05K 2201/09109 Locally detached layers, e.g. in multilayer
• CPC Class Codes: H05K 2201/10159 Memory
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49179 by metal fusion bonding

Abstract

A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Claims

1. A method for making a multichip module comprising the steps of:

forming a flexible dielectric substrate having a conductive pattern on at least one surface thereof, said conductive pattern including a plurality of contacts adjacent to one edge of said substrate;

attaching a plurality of microelectronic devices to said substrate so that said microelectronic devices are operably coupled to said conductive pattern;

attaching two substantially rigid frames to said flexible dielectric substrate, said frames extending around the periphery of said substrate, one on each surface thereof, at least one of said frames having external contact pads; and

,

forming electrical connections between said contact pads and respective contacts on said conductive pattern on said substrate.

2. The method of claim 1 wherein said substrate has a conductive pattern on both surfaces thereof, said microelectronic devices are mounted on both of said surfaces, and each of said two frames has external contact pads.

3. The method of claim 2 wherein said dielectric substrate further contains vias connecting at least a portion of said conductive patterns on said first and second surfaces.

4. The method of claim 1 wherein said microelectronic devices are selected from the group consisting of:

memory circuits, logic circuits, buffer devices, interface devices, optoelectronic devices, and microprocessors.

5. The method of claim 1 wherein said frames further include heat spreading covers.

6. The method of claim 1 wherein said external contact pads are configured to engage a mating socket.

7. The method of claim 1 wherein said external contact pads are configured to be solderable to a printed circuit board.

8. The method of claim 1 wherein said frames are attached to said substrate by a substantially continuous layer of adhesive along their perimeters.

9. The method of claim 1 wherein said frames are held together by engaging a mechanical fastener.