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MICRO ELECTRO MECHANICAL SYSTEM

  • US 20110138912A1
  • Filed: 08/05/2009
  • Published: 06/16/2011
  • Est. Priority Date: 08/18/2008
  • Status: Active Grant
First Claim
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1. A micro electro mechanical system having, formed on a first semiconductor chip,(a) a first fixed portion,(b) an elastically deformable first beam, one end of which is connected to the first fixed portion,(c) a second fixed portion,(d) an elastically deformable second beam, one end of which is connected to the second fixed portion, and(e) a displaceable movable body connected to the other end of the first beam and the other end of the second beam,wherein, when the first fixed portion and the second fixed portion are displaced in the same direction by a stress occurring in the first semiconductor chip, a spring constant of the first beam is increased as compared with that when the first fixed portion is not displaced, and a spring constant of the second beam is decreased as compared with that when the second fixed portion is not displaced.

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