CONTACTLESS OBJECT WITH INTEGRATED CIRCUIT CONNECTED TO CIRCUIT TERMINALS BY CAPACITIVE COUPLIING

• US 20110139878A1
• Filed: 02/13/2009
• Published: 06/16/2011
• Est. Priority Date: 02/13/2008
• Status: Active Grant

• Current Assignee: Yannick Grasset
• Original Assignee: Yannick Grasset
• Inventors: Grasset, Yannick
• Granted Patent: US 9,142,485 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

The invention relates to integrated circuits (1) that comprise, on the active surface thereof, a first dielectric layer defining a passivation layer (6) and contact pads (5) flush through openings (7) in said passivation layer, wherein said integrated circuits are to be incorporated in contactless portable objects (10) for connection by capacitive coupling to the terminals (13) of an antenna-forming circuit (11) mounted on a substrate (12) of said object. The invention also relates to contactless portable objects including such circuits. The invention is characterised in that the capacitive coupling is carried out using connection plates (8) of the integrated circuits, positioned at the surface of the passivation layer and electrically connected to the contact pads. The invention can particularly be used in UHF RFID objects.

Claims

1. A contactless portable object including, on the one hand, an integrated circuit comprising, on its active face, a first dielectric layer forming a passivation layer and contact pads flush with openings of said passivation layer, and, on the other hand, terminals of an antenna circuit borne by a substrate, wherein said circuit also comprises connection plates connected to said terminals of the circuit by capacitive coupling, in which said connection plates are positioned at the surface of the passivation layer and electrically connected to the contact pads.

2. The object according to claim 1, wherein the connection plates are covered with a second dielectric layer of said integrated circuit.

3. The object according to claim 1, wherein the length and width of the connection plates is greater than the length and width of the contact pads.

4. The object according to claim 1, wherein the surface of the connection plates is at least four times greater than the surface of the contact pads.

5. The object according to claim 1, wherein each plate covers, at most, two-fifths of the active face of the integrated circuit.

6. The object according to claim 1, wherein the surface of the integrated circuit is rectangular and has a length-to-width ratio greater than 1.25.

7. The object according to claim 1, wherein the passivation layer has a substantially constant thickness, of between 1 and 7 μ

m.

8. The object according to claim 1, wherein it is a RFID object.

9. The object according to claim 8, wherein it is a RFID UHF object.

10. The object according to claim 2, wherein the thickness of the dielectric layer is substantially constant.

11. The object according to claim 1, wherein said object is capable of near-field communication.

12. An integrated circuit for producing a contactless portable object according to claim 1.

13. A process for producing a contactless portable object, comprising the following steps, according to which:

integrated circuit wafers having a passivation layer equipped with openings with which contact pads are flush are provided;

connection plates are positioned at the surface of the passivation layer, so that said plates are electrically connected to the contact pads; and

the integrated circuits are positioned on the substrates bearing an antenna circuit so that the connection plates are arranged opposite terminals of said antenna circuit.