Semiconductor Device
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Abstract
It is an object of the present invention to connect a wiring, an electrode, or the like formed with two incompatible films (an ITO film and an aluminum film) without increasing the cross-sectional area of the wiring and to achieve lower power consumption even when the screen size becomes larger. The present invention provides a two-layer structure including an upper layer and a lower layer having a larger width than the upper layer. A first conductive layer is formed with Ti or Mo, and a second conductive layer is formed with aluminum (pure aluminum) having low electric resistance over the first conductive layer. A part of the lower layer projected from the end section of the upper layer is bonded with ITO.
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Citations
70 Claims
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1-14. -14. (canceled)
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15. A semiconductor device comprising:
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a thin film transistor over a substrate; a first conductive layer over the thin film transistor, the first conductive layer being in contact with the semiconductor film; a second conductive layer on the first conductive layer; and a transparent conductive film over the thin film transistor, wherein the transparent conductive film is in contact with a part of the first conductive layer extending from an end portion of the second conductive layer. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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23. A semiconductor device comprising:
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a thin film transistor over a substrate, the thin film transistor comprising a semiconductor film, a gate electrode comprising a first conductive layer and a second conductive layer formed on the first conductive layer, and a gate insulating film interposed between the semiconductor film and the gate electrode; a third conductive layer over the thin film transistor, the third conductive layer being in contact with the semiconductor film; a fourth conductive layer on the third conductive layer; and a transparent conductive film over the thin film transistor, wherein the third conductive layer has a portion projected from an end portion of the fourth conductive layer, wherein the transparent conductive film is in contact with the portion of the third conductive layer projected from the end portion of the fourth conductive layer, wherein the third conductive layer comprises titanium or molybdenum, wherein the fourth conductive layer comprises aluminum, and wherein the fourth conductive layer is not in contact with the transparent conductive film. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30)
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31. A semiconductor device comprising:
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a thin film transistor over a substrate, the thin film transistor comprising a semiconductor film, a gate electrode comprising a first conductive layer and a second conductive layer formed on the first conductive layer, and a gate insulating film interposed between the semiconductor film and the gate electrode; a third conductive layer over the thin film transistor, the third conductive layer being in contact with the semiconductor film; a fourth conductive layer on the third conductive layer; and a transparent conductive film over the thin film transistor, wherein the transparent conductive film is in contact with a side surface portion of the third conductive layer, wherein the side surface portion of the third conductive layer has a smaller tapered angle than a side surface portion of the fourth conductive layer, wherein the third conductive layer comprises titanium or molybdenum, wherein the fourth conductive layer comprises aluminum, and wherein the fourth conductive layer is not in contact with the transparent conductive film. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38)
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39. A semiconductor device comprising:
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a thin film transistor over a substrate, the thin film transistor comprising a semiconductor film, a gate electrode comprising a first conductive layer and a second conductive layer formed on the first conductive layer, and a gate insulating film interposed between the semiconductor film and the gate electrode; a third conductive layer over the thin film transistor, the third conductive layer being in contact with the semiconductor film; a fourth conductive layer on the third conductive layer; and a transparent conductive film over the thin film transistor, wherein the transparent conductive film is in contact with a side surface portion of the third conductive layer, wherein the side surface portion of the third conductive layer has a larger tapered angle than a side surface portion of the fourth conductive layer, wherein the third conductive layer comprises titanium or molybdenum, wherein the fourth conductive layer comprises aluminum, and wherein the fourth conductive layer is not in contact with the transparent conductive film. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46)
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47. A semiconductor device comprising:
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a thin film transistor over a substrate, the thin film transistor comprising a semiconductor film, a gate electrode comprising a first conductive layer and a second conductive layer formed on the first conductive layer, and a gate insulating film interposed between the semiconductor film and the gate electrode; a third conductive layer over the thin film transistor, the third conductive layer being in contact with the semiconductor film; a fourth conductive layer on the third conductive layer; and a transparent conductive film over the thin film transistor, wherein the transparent conductive film is in contact with a side surface portion of the third conductive layer, wherein the side surface portion of the third conductive layer and a side surface portion of the fourth conductive layer have a same tapered angle, wherein the third conductive layer comprises titanium or molybdenum, wherein the fourth conductive layer comprises aluminum, and wherein the fourth conductive layer is not in contact with the transparent conductive film. - View Dependent Claims (48, 49, 50, 51, 52, 53, 54)
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55. A semiconductor device comprising:
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a thin film transistor over a substrate, the thin film transistor comprising a semiconductor film, a gate electrode comprising a first conductive layer and a second conductive layer formed on the first conductive layer, and a gate insulating film interposed between the semiconductor film and the gate electrode; a third conductive layer over the thin film transistor, the third conductive layer being in contact with the semiconductor film; a fourth conductive layer on the third conductive layer; a transparent conductive film over the thin film transistor; and a flattening insulating film over the fourth conductive layer and the transparent conductive film; wherein the transparent conductive film is provided over the flattening insulating film, wherein the third conductive layer has a portion projected from an end portion of the fourth conductive layer, wherein the third conductive layer is in contact with the transparent conductive film through a contact hole provided in the flattening insulating film, wherein the end portion of the third conductive layer is located within the contact hole, wherein the third conductive layer comprises titanium or molybdenum, wherein the fourth conductive layer comprises aluminum, and wherein the fourth conductive layer is not in contact with the transparent conductive film. - View Dependent Claims (56, 57, 58, 59, 60, 61, 62)
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63. A semiconductor device comprising:
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a thin film transistor over a substrate, the thin film transistor comprising a semiconductor film, a gate electrode comprising a first conductive layer and a second conductive layer formed on the first conductive layer, and a gate insulating film interposed between the semiconductor film and the gate electrode; a third conductive layer over the thin film transistor, the third conductive layer being in contact with the semiconductor film; a fourth conductive layer on the third conductive layer; and a transparent conductive film over the thin film transistor, wherein the transparent conductive film is in contact with a part of the third conductive layer extending from an end portion of the fourth conductive layer, wherein the third conductive layer has a larger width than the fourth conductive layer, wherein the first conductive layer comprises titanium, wherein the second conductive layer comprises copper, wherein the third conductive layer comprises titanium, wherein the fourth conductive layer comprises aluminum, and wherein the fourth conductive layer is not in contact with the transparent conductive film. - View Dependent Claims (64, 65, 66, 67, 68, 69, 70)
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Specification