LED PACKAGE HAVING AN ARRAY OF LIGHT EMITTING CELLS COUPLED IN SERIES

• US 20110140135A1
• Filed: 02/24/2011
• Published: 06/16/2011
• Est. Priority Date: 03/11/2005
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Seoul Semiconductor Co., Ltd.
• Inventors: LEE, Keon Young, CHOI, Hyuck Jung, KIM, Hong San, LEE, Chung Hoon, KIM, Dae Won
• Granted Patent: US 8,937,326 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/36 characterised by the electrodes
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.

Claims

1. A light emitting diode (LED) package, comprising:

a package body comprising an opening;

a first lead electrode and a second lead electrode arranged in the opening and being spaced apart from each other; and

a light emitting device arranged in the opening and electrically connected to the first lead electrode and the second lead electrode;

wherein the LED package is configured to be driven by an alternating current (AC) and by a voltage higher than that for driving one light emitting diode.

2. The LED package of claim 1, wherein the light emitting device is spaced apart from the first lead electrode and the second lead electrode.

3. The LED package of claim 2, further comprising:

a first wire and a second wire electrically connecting the light emitting device to the first lead electrode and the second lead electrode, respectively.

4. The LED package of claim 3, further comprising:

a heat conductor arranged in the opening,

wherein the light emitting device is arranged on the heat conductor.

5. The LED package of claim 4, wherein the heat conductor comprises a metallic material.

6. The LED package of claim 1, further comprising:

a first molding member configured to convert a direction of light and/or a wavelength of light emitted from the light emitting device.

7. The LED package of claim 6, wherein the first molding member comprises a phosphor.

8. The LED package of claim 7, wherein the first molding member is arranged in the opening, the first molding member encapsulating the light emitting device.

9. The LED package of claim 7, further comprising:

a phosphor-free second molding member.

10. The LED package of claim 9, wherein the second molding member comprises a diffuser.

11. The LED package of claim 10, further comprising:

a third molding member arranged above the first molding member and the second molding member, the third molding member comprising a lens shape.

12. The LED package of claim 1, wherein a sidewall of the package body comprises an inclined surface.

13. The LED package of claim 1, wherein the light emitting device is flip bonded.

14. The LED package of claim 1, wherein the light emitting device comprises a plurality of light emitting cells electrically connected to one another in series.

15. The LED package of claim 1, further comprising:

a bridge rectifier, the bridge rectifier to rectify the AC.

16. A light emitting diode (LED) package, comprising:

a package body comprising a recessed portion;

a first lead electrode and a second lead electrode spaced apart from each other; and

a light emitting device arranged in the recessed portion and electrically connected to the first lead electrode and the second lead electrode;

wherein the LED package is configured to be driven by an alternating current (AC) and by a voltage higher than that for driving one light emitting diode.

17. The LED package of claim 16, wherein the package body comprises a substrate, the light emitting device is arranged on a first side of the substrate, and the first lead electrode and the second lead electrode are arranged on a second side of the substrate that is opposite the first side of the substrate.

18. The LED package of claim 16, wherein the package body comprises a substrate and a reflector, the reflector being arranged on the substrate to surround the light emitting device, and the reflector protruding from the substrate to form the recessed portion together with the substrate.

19. The LED package of claim 16, wherein the light emitting device comprises a plurality of light emitting devices.

20. The LED package of claim 19, wherein the light emitting devices are connected in series.

21. The LED package of claim 16, wherein the package body comprises a substrate comprising a groove forming the recessed portion, and the light emitting device is arranged in the groove.

22. The LED package of claim 16, wherein the first lead electrode and the second lead electrode are arranged in the recessed portion.

23. The LED package of claim 16, wherein the first lead electrode and the second lead electrode are not arranged in the recessed portion.

24. A light emitting diode (LED) package, comprising:

a package body comprising a substrate comprising a first side, a second side, and an opening, the first and second sides being opposite sides of the substrate;

a metallic portion arranged in the opening, the metallic portion being exposed at the second side of the substrate;

a first lead electrode and a second lead electrode spaced apart from each other and the metallic portion; and

a light emitting device arranged on the metallic portion and electrically connected to the first lead electrode and the second lead electrode,

wherein the light emitting device is arranged on the first side of the substrate, and the first lead electrode and the second lead electrode are arranged on the second side of the substrate, and wherein the LED package is configured to be driven by an alternating current (AC) and by a voltage higher than that for driving one light emitting diode.

25. The LED package of claim 24, wherein the first lead electrode and the second lead electrode extend from the second side of the substrate to the first side of the substrate, and the metallic portion is exposed at the first side of the substrate.

26. The LED package of claim 24, wherein the metallic portion comprises a recessed portion, and the light emitting device is arranged in the recessed portion.