External storage device and method of manufacturing external storage device
First Claim
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1. An external storage device comprising:
- an interconnect substrate;
at least one semiconductor chip disposed over a first surface of said interconnect substrate;
a storage element provided in at least said one semiconductor chip;
an inductor which is provided in at least said one semiconductor chip and which communicates information stored in said storage element to the outside;
a driver circuit which is provided in at least said one semiconductor chip in order to drive said inductor;
a contact type external terminal provided in said interconnect substrate; and
a sealing resin layer which is formed over said first surface of said interconnect substrate and which seals at least said one semiconductor chip and does not cover said external terminal,wherein said inductor is formed at a surface of said semiconductor chip not facing said interconnect substrate.
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Abstract
A storage element is provided in a semiconductor chip, and an inductor and a driver circuit are provided in another semiconductor chip. An external terminal is a contact type terminal, and at least some external terminals are a power supply terminal and a ground terminal. A sealing resin layer is formed over a first surface of an interconnect substrate and seals the semiconductor chips but does not cover the external terminal. The inductor is formed at a surface of the semiconductor chip not facing the interconnect substrate.
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Citations
18 Claims
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1. An external storage device comprising:
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an interconnect substrate; at least one semiconductor chip disposed over a first surface of said interconnect substrate; a storage element provided in at least said one semiconductor chip; an inductor which is provided in at least said one semiconductor chip and which communicates information stored in said storage element to the outside; a driver circuit which is provided in at least said one semiconductor chip in order to drive said inductor; a contact type external terminal provided in said interconnect substrate; and a sealing resin layer which is formed over said first surface of said interconnect substrate and which seals at least said one semiconductor chip and does not cover said external terminal, wherein said inductor is formed at a surface of said semiconductor chip not facing said interconnect substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of manufacturing an external storage device, comprising:
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disposing at least one semiconductor chip over a first surface of an interconnect substrate having a contact type external terminal; and forming a sealing resin layer over said first surface of said interconnect substrate such that at least said one semiconductor chip is sealed and said external terminal is not covered, wherein a storage element is provided in at least said one semiconductor chip, an inductor which communicates information stored in said storage element to the outside is provided in at least said one semiconductor chip, and a driver circuit of said inductor is provided in at least said one semiconductor chip. - View Dependent Claims (17, 18)
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Specification