ELECTRONIC APPARATUS AND PRINTED WIRING BOARD

• US 20110141707A1
• Filed: 02/22/2011
• Published: 06/16/2011
• Est. Priority Date: 09/10/2008
• Status: Active Grant

• Current Assignee: Toshiba Client Solutions CO., Ltd. (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Hasegawa, Kenji, Kanou, Terunari, Kozai, Tsuyoshi
• Granted Patent: US 8,432,702 B2
• Time in Patent Office: Days
• US Class Current: 361/753
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/116 Lands, clearance holes or other lay-out details concerning the surrounding of a via
• CPC Class Codes: H05K 2201/09463 Partial lands, i.e. lands or conductive rings not completely surrounding the hole
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 3/325 by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor adaptations of leads inserted in holes for press-fit connections H05K3/308
• CPC Class Codes: H05K 5/0247 Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 7/142 Spacers not being card guides
• CPC Class Codes: H05K 9/0064 Earth or grounding circuit

Abstract

According to an aspect of the present invention, there is provided a printed wiring board including: a substrate including an edge and a fixing hole located adjacent to the edge, the fixing hole configured to receive a bolt; and a land formed in a vicinity of the fixing hole and extending in at least a first direction and a second direction, the first direction being a direction from the fixing hole toward a center of the substrate, the second direction being direction along the edge.

Claims

1. An electronic apparatus comprising:

a casing comprising a conductive ground portion formed on an inner surface of the casing;

a printed wiring board housed in the casing; and

a screw that fixes the printed wiring board to the casing and grounds the printed wiring board to the casing,

wherein the printed wiring board comprises;

a substrate body comprising an edge portion and a fixing hole located adjacent to the edge portion, the fixing hole receiving the screw;

a land provided at a position that is in a vicinity of the fixing hole and outside region on the substrate that extends along the edge portion and includes a portion between the fixing hole and the edge portion, the land comprising an area extending from the vicinity of the fixing hole and between a direction heading from the fixing hole to a central portion of the substrate body and a direction toward which the edge portion extends; and

a conductive plating portion and covering an inner surface of the fixing hole, the plating portion being provided to be continuous with the land.

2. The electronic apparatus of claim 1,

wherein the land is disposed at a position outside a second area proximal to the central portion.

3. An electronic apparatus comprising:

a casing comprising a conductive ground layer on an inner surface of the casing;

a printed wiring board in the casing; and

a bolt configured to attach the printed wiring board to the casing and to ground the printed wiring board to the conductive ground layer,

wherein the printed wiring board comprises;

a substrate comprising an edge and a fixing hole next to the edge, the fixing hole configured to receive the bolt; and

a land in a vicinity of the fixing hole and extending in at least a first direction and a second direction, the first direction being a direction from the fixing hole toward a center of the substrate, the second direction being a direction along the edge.

4. The electronic apparatus of claim 3, wherein:

the substrate comprises a first region extending along the edge and comprising a band-shape, and

the land is outside the first region.

5. The electronic apparatus of claim 4, wherein the land comprises a sector shape extending from the fixing hole toward the center of the substrate.

6. The electronic apparatus of claim 5, further comprising a conductive plating on an inner surface of the fixing hole and continuous with the land.

7. The electronic apparatus of claim 4, wherein:

the substrate comprises a second region extending at least between the fixing hole and the center of the substrate, and

the land is outside the second region.

8. The electronic apparatus of claim 7, further comprising a conductive plating on an inner surface of the fixing hole and continuous with the land.