PROCESS FOR PRODUCING TRANSPARENT CONDUCTIVE TRANSFER PLATE, TRANSPARENT CONDUCTIVE TRANSFER PLATE, PROCESS FOR PRODUCING TRANSPARENT CONDUCTIVE SUBSTRATE USING THE TRANSPARENT CONDUCTIVE TRANSFER PLATE, TRANSPARENT CONDUCTIVE SUBSTRATE, AND MOLDED PRODUCT USING THE TRANSPARENT CONDUCTIVE SUBSTRATE

• US 20110143077A1
• Filed: 06/30/2009
• Published: 06/16/2011
• Est. Priority Date: 07/04/2008
• Status: Active Grant

• Current Assignee: Fujicopian Co., Ltd., TODA Kogyo Corporation
• Original Assignee: Fujicopian Co., Ltd., TODA Kogyo Corporation
• Inventors: Kyoto, Michihisa, Suzuki, Kyoichi, Kakihara, Yasuo
• Granted Patent: US 8,846,182 B2
• Time in Patent Office: Days
• US Class Current: 428/67
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H05K 9/0096 for television displays, e.g. plasma display panel
• CPC Class Codes: Y10S 428/914 Transfer or decalcomania
• CPC Class Codes: Y10T 428/22 Nonparticulate element embedded or inlaid in substrate and visible
• CPC Class Codes: Y10T 428/24612 Composite web or sheet
• CPC Class Codes: Y10T 428/24843 with heat sealable or heat releasable adhesive layer
• CPC Class Codes: Y10T 428/24909 Free metal or mineral containing

Abstract

The present invention provides a process for producing a transparent conductive substrate which is capable of readily producing the transparent conductive substrate having a low resistance, a high transmittance and an excellent anti-moire property without using a special apparatus and can be applied to production of various extensive substrates; a transparent conductive substrate having a sufficiently high optical transparency and electromagnetic shielding property which can be readily subjected to molding process as well as a process for producing the transparent conductive substrate; and a transparent conductive molded product. According to the present invention, it is possible to readily produce a transparent conductive substrate having a low resistance, a high transmittance and an excellent anti-moire property which can be applied to extensive substrates by applying a dispersion solution of metal fine particles capable of forming a self-organized film on a support, drying the obtained coating layer and then subjecting the resulting dried material to heat treatment and/or chemical treatment or applying a solution of a precursor of the metal fine particles on a support, drying the obtained coating layer and then reducing and precipitating the precursor of the metal fine particles, to previously form a transparent conductive film exhibiting a low resistance, a high transmittance and an excellent anti-moire property and having a conductive random network structure on the support; and then bonding a substrate to the support to transfer the transparent conductive film onto the substrate directly or through a heat-sensitive adhesive layer or a pressure-sensitive adhesive layer and releasing the support from the transparent conductive film is laminated on a substrate.

Claims

1. A process for producing a transparent conductive transfer plate, comprising the steps of:

applying a dispersion solution of metal fine particles capable of forming a self-organized film on a support having a heat resistance and/or a chemical resistance and then drying the obtained coating layer; and

subjecting the resulting dried material to heat treatment and/or chemical treatment to form a transparent conductive film exhibiting a low resistance, a high transmittance and an excellent anti-moire property and having a conductive random network structure on the support.

3. A process for producing a transparent conductive transfer plate according to claim 1, wherein prior to applying the dispersion solution of the metal fine particles or the solution of the metal salt on the support, the support is subjected to surface treatment.

4. A transparent conductive transfer plate produced by the process for producing a transparent conductive transfer plate as defined in claim 1.

5. A process for producing a transparent conductive substrate, comprising the steps of:

locating the transparent conductive transfer plate as defined in claim 4 and a substrate such that the transparent conductive film formed on the transparent conductive transfer plate is opposite to one surface of the substrate each other;

subjecting the transparent conductive transfer plate and the substrate to compression-bonding or thermocompression-bonding to each other to transfer the transparent conductive film onto the substrate; and

releasing the support from the transparent conductive transfer plate.

6. A process for producing a transparent conductive substrate, comprising the steps of:

forming a heat-sensitive adhesive layer, a pressure-sensitive adhesive layer, a coupling agent layer or an organic gel layer on at least one of the surface of the transparent conductive transfer plate as defined in claim 4 on which the transparent conductive film is formed, and one surface of a substrate;

subjecting the transparent conductive transfer plate and the substrate to compression-bonding or thermocompression-bonding to each other to transfer the transparent conductive film onto the substrate; and

releasing the support from the transparent conductive transfer plate.

7. A transparent conductive substrate produced by the process for producing a transparent conductive substrate as defined in claim 5.

8. A transparent conductive substrate according to claim 7, wherein the transparent conductive film is embedded in either the substrate only, both the substrate and the heat-sensitive adhesive layer, both the substrate and the pressure-sensitive layer, both the substrate and the coupling agent layer or both the substrate and the organic gel layer, or not embedded in the substrate but embedded in any of the layers by itself such that the surface of the transparent conductive film is aligned with a surface of the substrate, the heat-sensitive adhesive layer, the pressure-sensitive adhesive layer, the coupling agent layer or the organic gel layer on the same plane.

9. A transparent conductive substrate according to claim 7, wherein the substrate is a thermoplastic resin substrate.

10. A transparent conductive substrate according to claim 9, wherein the metal fine particles are formed of at least one metal element selected from the group consisting of Au, Ag, Cu, Ni, Co, Fe, Cr, Zn, Al, Sn, Pd, Ti, Ta, W, Mo, In, Pt and Ru, or an alloy comprising at least two of the metal elements.

11. A transparent conductive substrate according to claim 9, wherein the heat-sensitive adhesive layer or the pressure-sensitive adhesive layer is a layer of a heat-sensitive adhesive or a pressure-sensitive adhesive which is formed of a thermoplastic resin.

12. A transparent conductive substrate according to claim 9, wherein the thermoplastic resin substrate is a resin substrate selected from the group consisting of an acrylic substrate, a polycarbonate substrate, a polypropylene substrate, a polyvinyl chloride substrate, an amorphous polyethylene terephthalate substrate, an ABS substrate, a polystyrene substrate and a laminated substrate of any two or more of these substrates.

13. A transparent conductive molded product produced by molding the transparent conductive substrate as defined in claim 9.

2. A process for producing a transparent conductive transfer plate, comprising the steps of:

applying a solution of a metal salt as a precursor of metal fine particles capable of forming a self-organized film on a support having a heat resistance and/or a chemical resistance and then drying the obtained coating layer; and

reducing and precipitating the precursor of the metal fine particles by heating, irradiation with an ultraviolet ray or a reducing gas to form a transparent conductive film exhibiting a low resistance, a high transmittance and an excellent anti-moire property and having a conductive random network structure on the support.