FLUOROPOLYMER FILM WITH EPOXY ADHESIVE

• US 20110143136A1
• Filed: 12/14/2010
• Published: 06/16/2011
• Est. Priority Date: 12/15/2009
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: HEBERT, Larry S., Jing, Naiyong
• Application Number:
  US12/967,438
• Publication Number:
  US 20110143136A1
• Time in Patent Office: Days
• US Class Current: 428/355.EP
• CPC Class Codes: B32B 27/322 comprising halogenated polyolefins, e.g. PTFE
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: C08G 59/4021 Ureas; Thioureas; Guanidines; Dicyandiamides
• CPC Class Codes: C08G 59/4064 sulfur containing compounds C08G59/4021, C08G59/4028 take precedence
• CPC Class Codes: C08K 5/31 Guanidine; Derivatives thereof
• CPC Class Codes: C08K 5/3155 Dicyandiamide
• CPC Class Codes: C08K 5/3725 containing nitrogen
• CPC Class Codes: C08K 5/405 Thioureas; Derivatives thereof
• CPC Class Codes: C09J 163/00 Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
• CPC Class Codes: C09J 2301/408 additives as essential feature of the adhesive layer
• CPC Class Codes: C09J 2427/006 in the substrate
• CPC Class Codes: C09J 2463/00 Presence of epoxy resin
• CPC Class Codes: C09J 7/245 Vinyl resins, e.g. polyvinyl chloride [PVC]
• CPC Class Codes: Y10T 428/287 including epoxy group or epoxy polymer

Abstract

Protective articles are provided which include a fluoropolymer film and an epoxy adhesive, borne on at least one surface of the fluoropolymer film. The Protective articles include multilayer articles comprising a) a fluoroplastic layer, in contact with b) at least one curable adhesive layer, comprising a mixture of an uncured epoxide resin and curative agents selected from the group consisting of dicyandiamide, 4,4-aminophenyl disulfide, guanidine carbonate, thiourea and combinations thereof. Most typically, the curative agent includes dicyandiamide and in some embodiments consists essentially of dicyandiamide.

Claims

1. A multilayer article comprising a) a fluoroplastic layer, in contact with b) at least one curable adhesive layer, comprising a mixture of an uncured epoxide resin and curative agents selected from the group consisting of dicyandiamide, 4,4-aminophenyl disulfide, guanidine carbonate, thiourea and combinations thereof.

2. The multilayer article according to claim 1 wherein the curative agent includes dicyandiamide.

3. The multilayer article according to claim 1 wherein the curative agent is consisting essentially of dicyandiamide.

4. The article of claim 1 wherein the fluoroplastic comprises a non-perfluorinated fluoropolymer.

5. The article of claim 4 wherein the non-perfluorinated fluoropolymer is derived at least in part from vinylidene difluoride monomer.

6. The article of claim 1 wherein the fluoroplastic comprises a surface-treated perfluorinated fluoropolymer.

7. The article of claim 3 wherein the fluoroplastic comprises a non-perfluorinated fluoropolymer.

8. The article of claim 7 wherein the non-perfluorinated fluoropolymer is derived at least in part from vinylidene difluoride monomer.

9. The article of claim 3 wherein the fluoroplastic comprises a surface-treated perfluorinated fluoropolymer.

10. The article of claim 1 wherein the epoxide resin is a phenolic compound.

11. The article of claim 1 wherein the epoxide resin has a functionality greater than 2.

12. The article of claim 1 wherein the cure site is selected from a nitrogen, a bromine, a chlorine, or an iodine containing cure site, an olefin, and combinations thereof.

13. The article of claim 1 wherein the epoxide resin is selected from the group consisting of creosol Novolak, epichlorohydrin/tetraphenylol ethane, bisphenol A/epichlorohydrin, Novolak/bisphenol A, epichlorohydrin/phenol-formaldehyde, 9,9 bis-2,3 epoxypropylphenyl fluorine, epoxypropylphenyl fluorene, bisphenol AF/epichlorohydrin, Novolak/bisphenol AF, and combinations thereof.

14. The article of claim 3 wherein the epoxide resin is a phenolic compound.

15. The article of claim 3 wherein the epoxide resin has a functionality greater than 2.

16. The article of claim 3 wherein the cure site is selected from a nitrogen, a bromine, a chlorine, or an iodine containing cure site, an olefin, and combinations thereof.

17. The article of claim 3 wherein the epoxide resin is selected from the group consisting of creosol Novolak, epichlorohydrin/tetraphenylol ethane, bisphenol A/epichlorohydrin, Novolak/bisphenol A, epichlorohydrin/phenol-formaldehyde, 9,9 bis-2,3 epoxypropylphenyl fluorine, epoxypropylphenyl fluorene, bisphenol AF/epichlorohydrin, Novolak/bisphenol AF, and combinations thereof.

18. The article of claim 7 wherein the epoxide resin is a phenolic compound.

19. The article of claim 7 wherein the epoxide resin has a functionality greater than 2.

20. The article of claim 7 wherein the cure site is selected from a nitrogen, a bromine, a chlorine, or an iodine containing cure site, an olefin, and combinations thereof.

21. The article of claim 7 wherein the epoxide resin is selected from the group consisting of creosol Novolak, epichlorohydrin/tetraphenylol ethane, bisphenol A/epichlorohydrin, Novolak/bisphenol A, epichlorohydrin/phenol-formaldehyde, 9,9 bis-2,3 epoxypropylphenyl fluorine, epoxypropylphenyl fluorene, bisphenol AF/epichlorohydrin, Novolak/bisphenol AF, and combinations thereof.