PINNING AND AFFIXING NANO-ACTIVE MATERIAL

• US 20110143915A1
• Filed: 12/07/2010
• Published: 06/16/2011
• Est. Priority Date: 12/15/2009
• Status: Active Grant

• Current Assignee: Umicore AG & Company KG (Umicore S.A.)
• Original Assignee: SDC Materials,Inc.
• Inventors: Ruiz, Eliseo, Yin, Qinghua, Qi, Xiwang
• Granted Patent: US 8,652,992 B2
• Time in Patent Office: Days
• US Class Current: 502/5
• CPC Class Codes: B01J 23/42 Platinum
• CPC Class Codes: B01J 23/8926 Copper and noble metals
• CPC Class Codes: B01J 35/23 in a colloidal state
• CPC Class Codes: B01J 37/00 Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
• CPC Class Codes: B01J 37/009 Preparation by separation, e.g. by filtration, decantation, screening
• CPC Class Codes: B01J 37/0211 using a colloidal suspension
• CPC Class Codes: B01J 37/32 Freeze drying, i.e. lyophilisation
• CPC Class Codes: B01J 37/349 making use of flames, plasmas or lasers
• CPC Class Codes: B28B 23/0087 Lightweight aggregates for making lightweight articles
• CPC Class Codes: B32B 37/14 characterised by the properties of the layers
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: C23C 4/134 Plasma spraying

Abstract

A nanoparticle comprises a nano-active material and a nano-support. In some embodiments, the nano-active material is platinum and the nano-support is alumina. Pinning and affixing the nano-active material to the nano-support is achieved by using a high temperature condensation technology. In some embodiments, the high temperature condensation technology is plasma. Typically, a quantity of platinum and a quantity of alumina are loaded into a plasma gun. When the nano-active material bonds with the nano-support, an interface between the nano-active material and the nano-support forms. The interface is a platinum alumina metallic compound, which dramatically changes an ability for the nano-active material to move around on the surface of the nano-support, providing a better bond than that of a wet catalyst. Alternatively, a quantity of carbon is also loaded into the plasma gun. When the nano-active material bonds with the nano-support, the interface formed comprises a platinum copper intermetallic compound, which provides an even stronger bond.

Claims

1. An interface for pinning nano-active material to nano-support comprising a compound configured to limit movement of the nano-active material on a surface of the nano-support, wherein the compound is formed by a reaction of the nano-active material and the surface of the nano-support.

2. The interface of claim 1 wherein the nano-active material is platinum.

3. The interface of claim 1 wherein the nano-support is alumina.

4. The interface of claim 1 wherein the nano-support comprises a partially reduced alumina surface.

5. The interface of claim 1 wherein the compound is a platinum alumina metallic compound or a platinum copper intermetallic compound.

6. A pinning method to affix nano-active materials to nano-supports by using a high temperature condensation technology comprising:

a. gathering the nano-active materials and the nano-supports;

b. increasing metallic properties on surfaces of the nano-supports; and

c. forming an interface between each nano-active material and a nano-support, wherein the interface is configured to limit movement of the nano-active material on the surface of the nano-support.

7. The pinning method of claim 6 wherein the high temperature condensation technology is eBeam, microwave, RF or DC plasma.

8. The pinning method of claim 6 wherein the gathering includes:

a. loading a quantity of catalyst material and a quantity of carrier material into a chamber; and

b. vaporizing the quantity of catalyst material and the quantity of carrier material, thereby creating the nano-active materials and the nano-supports.

9. The pinning method of claim 8 wherein the vaporizing includes:

a. supplying working gas into the chamber; and

b. delivering energy to the working gas.

10. The pinning method of claim 8 wherein the gathering further includes loading a quantity of copper into the chamber.

11. The pinning method of claim 6 wherein each of the plurality of nano-active materials is platinum.

12. The pinning method of claim 6 wherein each of the plurality of nano-supports is alumina.

13. The pinning method of claim 6 wherein each of the plurality of nano-supports comprises a partially reduce alumina surface.

14. The pinning method of claim 13 wherein the interface comprises a platinum alumina metallic compound or a platinum copper intermetallic compound.

15. A method of affixing a nano-active material to a nano-support comprising using high temperature condensation technology to form a layer between the nano-active material and the nano-support material.

16. The method of claim 15 wherein the high temperature condensation technology is eBeam, microwave, RF or DC plasma.

17. The method of claim 15 wherein the using comprises:

a. loading catalyst material and carrier material into a chamber; and

b. vaporizing the catalyst material and the carrier material to create the nano-active material and the nano-support.

18. The method of claim 17 wherein the using further comprising loading copper into the chamber.

19. The method of claim 15 wherein the layer is configured to limit movement of the nano-active material on a surface of the nano-support.

20. The method of claim 19 wherein the layer comprises a platinum alumina metallic compound or comprises a platinum copper intermetallic compound.