Cu-Mg-P based copper alloy material and method of producing the same

• US 20110146855A1
• Filed: 06/04/2010
• Published: 06/23/2011
• Est. Priority Date: 12/23/2009
• Status: Active Grant

• Current Assignee: Mitsubishi Shindoh Company Limited (Mitsubishi Materials Corporation)
• Original Assignee: Mitsubishi Shindoh Company Limited (Mitsubishi Materials Corporation)
• Inventors: Abe, Yoshio, Kameyama, Yoshihiro, Sakurai, Takeshi
• Granted Patent: US 9,255,310 B2
• Time in Patent Office: Days
• US Class Current: 148/682
• CPC Class Codes: C22C 9/00 Alloys based on copper
• CPC Class Codes: C22F 1/08 of copper or alloys based thereon

Abstract

A copper alloy material includes, by mass %, Mg of 0.3 to 2%, P of 0.001 to 0.1%, and the balance including Cu and inevitable impurities. An area fraction of such crystal grains that an average misorientation between all the pixels in each crystal grain is less than 4° is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5° or more is considered as a crystal grain boundary, and a tensile strength is 641 to 708 N/mm², and a bending elastic limit value is 472 to 503 N/mm².

Claims

1. A copper alloy material comprising, by mass %:

Mg of 0.3 to 2%;

P of 0.001 to 0.1%; and

the balance including Cu and inevitable impurities,

wherein an area fraction of such crystal grains that an average misorientation between all pixels in each crystal grain is less than 4°

is 45 to 55% of a measured area, when orientations of all the pixels in the measured area of the surface of the copper alloy material are measured in a step size of 0.5 μ

m by an EBSD method with a scanning electron microscope of an electron backscattered diffraction image system and a boundary in which a misorientation between adjacent pixels is 5°

or more is considered as a crystal grain boundary, and wherein a tensile strength is 641 to 708 N/mm², and a bending elastic limit value is 472 to 503 N/mm².

2. The copper alloy material according to claim 1, further comprising, by mass %, Zr of 0.001 to 0.03%.

3. A method of producing the copper alloy material according to claim 1, wherein when a copper alloy is produced by a process including hot rolling, solution treatment, finishing cold rolling, and low temperature annealing in this order, the hot rolling is performed under the conditions that a hot rolling starting temperature is 700°

C. to 800°

C., a total hot rolling reduction ratio is 90% or higher, an average hot rolling reduction ratio per 1 pass is 10% to 35%, a Vickers hardness of a copper alloy plate after the solution treatment is adjusted to be 80 to 100 Hv, and the low temperature annealing is performed at 250°

C. to 450°

C. for 30 to 180 seconds.

4. A method of producing the copper alloy material according to claim 2, wherein when a copper alloy is produced by a process including hot rolling, solution treatment, finishing cold rolling, and low temperature annealing in this order, the hot rolling is performed under the conditions that a hot rolling starting temperature is 700°

C. to 800°

C., a total hot rolling reduction ratio is 90% or higher, an average hot rolling reduction ratio per 1 pass is 10% to 35%, a Vickers hardness of a copper alloy plate after the solution treatment is adjusted to be 80 to 100 Hv, and the low temperature annealing is performed at 250°

C. to 450°

C. for 30 to 180 seconds.