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Method of Bonding a Film to a Curved Substrate

  • US 20110146893A1
  • Filed: 06/07/2007
  • Published: 06/23/2011
  • Est. Priority Date: 06/13/2006
  • Status: Active Grant
First Claim
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1. Method of bonding a film (2) having a substantially plane initial shape to a curved face of a substrate (1), the method comprising the following steps:

  • a) when the film is at a temperature above 40°

    C., a peripheral edge of the film (2) is held firmly and a pneumatic pressure difference is applied between two sides of the film until an application face (S2) of said film becomes curved with a curvature greater than an average curvature of the face (S1) of the substrate;

    b) when the temperature of the film has dropped below 40°

    C., the pneumatic pressure difference applied between the two sides of the film is adjusted so that the curvature of the application face (S2) of the film becomes approximately equal to or less than the curvature of the face (S1) of the substrate; and

    c) while maintaining the pneumatic pressure difference adjusted at step b), the face (S1) of the substrate is pressed against the application face (S2) of the film until complete contact is established between the film and the face of the substrate, a layer of an adhesive (3) being placed between the film (2) and the substrate (1).

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