Glass core substrate for integrated circuit devices and methods of making the same
First Claim
1. A substrate comprising:
- a core comprised of glass, the glass core having a first surface and an opposing second surface;
a number of conductors extending through the glass core from the first surface to the second surface;
at least one dielectric layer and at least one metal layer disposed at the first surface of the glass core, wherein the at least one metal layer at the first surface is electrically coupled with at least one of the conductors;
at least one dielectric layer and a least one metal layer disposed at the second surface of the glass core, wherein the at least one metal layer at the second surface is electrically coupled with at least one of the conductors.
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Accused Products
Abstract
Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.
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Citations
26 Claims
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1. A substrate comprising:
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a core comprised of glass, the glass core having a first surface and an opposing second surface; a number of conductors extending through the glass core from the first surface to the second surface; at least one dielectric layer and at least one metal layer disposed at the first surface of the glass core, wherein the at least one metal layer at the first surface is electrically coupled with at least one of the conductors; at least one dielectric layer and a least one metal layer disposed at the second surface of the glass core, wherein the at least one metal layer at the second surface is electrically coupled with at least one of the conductors. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method comprising;
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forming a number of holes in a glass plate, the glass plate having a first surface and an opposing second surface substantially parallel with the first surface, each hole extending from the first surface to the second surface, wherein the holes are formed by a process selected from a group comprising imprinting, sand blasting, and casting; disposing an electrically conductive material in each of the holes to form a conductor in each hole; disposing at least one dielectric layer and at least one metal layer at the first surface of the glass plate and electrically coupling the at least one metal layer at the first surface with at least one of the conductors; and disposing at least one dielectric layer and a least one metal layer at the second surface of the glass core and electrically coupling the at least one metal layer at the second surface with at least one of the conductors. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A method comprising
providing a glass body having a number of embedded conductive wires; - and
cutting slices from the glass body, each slice having a first surface and an opposing second surface substantially parallel with the first surface, wherein a portion of each embedded wire remains in each of the slices and extends from the first surface to the second surface of the slice, each embedded wire portion providing one of a corresponding number of a conductors; wherein one or more of the slices provides a glass core for a substrate. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification