OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

• US 20110147782A1
• Filed: 03/01/2011
• Published: 06/23/2011
• Est. Priority Date: 01/30/2009
• Status: Abandoned Application

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: NAKANO, Takahiro, SANO, Hikari
• Application Number:
  US13/037,626
• Publication Number:
  US 20110147782A1
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2224/02372 connecting to a via connection in the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/03 Manufacturing methods
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05567 the external layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/13022 the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/13024 the bump connector being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14634 Assemblies, i.e. Hybrid structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 : Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 : Wafer level processing
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

Provided is an optical device which has an increased rate of an area occupied by an effective optical region to an light-transmissive substrate and less noise due to reflection from a peripheral end face of the light-transmissive substrate. The optical device includes a semiconductor substrate in which a light-receiving element is formed and a light-transmissive substrate provided above the semiconductor substrate so as to cover the light-receiving element and fixed to the semiconductor substrate with an adhesive layer. The light-transmissive substrate has, in a peripheral end face, a curved surface which slopes so as to flare from an upper surface toward a lower surface.

Claims

1. An optical device comprising:

a semiconductor substrate in which an optical element is formed; and

a light-transmissive substrate provided above said semiconductor substrate so as to cover said optical element,

wherein said light-transmissive substrate has, in a peripheral end face, a curved surface which slopes so as to flare from an upper surface of said light-transmissive substrate toward a lower surface of said light-transmissive substrate.

2. The optical device according to claim 1,

wherein said semiconductor substrate has, in a peripheral end face, a curved surface which forms a continuous curve with the curved surface of said light-transmissive substrate.

3. The optical device according to claim 1,

wherein said light-transmissive substrate has, in a part of the peripheral end face, a surface perpendicular to the lower surface of said light-transmissive substrate, the part being in contact with the lower surface of said light-transmissive substrate.

4. The optical device according to claim 1,

wherein the curved surface in the peripheral end face of said light-transmissive substrate is a round surface.

5. The optical device according to claim 1,

wherein the curved surface is a rough surface.

6. The optical device according to claim 1, further comprising

a light shield film provided on the upper surface of a peripheral region of said light-transmissive substrate and on the curved surface.

7. The optical device according to claim 1, further comprising

a lens tube disposed with reference to an upper surface of a peripheral region of the said light-transmissive substrate,

wherein said lens tube structurally shields the upper surface of the peripheral region and the curved surface of said light-transmissive substrate from light.

8. The optical device according to claim 1,

wherein the lower surface of said light-transmissive substrate is equivalent in area to an upper surface of said semiconductor substrate.

9. The optical device according to claim 1,

wherein said optical element is formed in an upper surface of said semiconductor substrate, and

said optical device further comprises:

an external terminal provided below a lower surface of said semiconductor substrate; and

a through electrode provided through said semiconductor substrate and electrically connecting said optical element and said external terminal.

10. The optical device according to claim 1,

wherein said optical element is formed in a lower surface of said semiconductor substrate, and

said optical device further comprises an external terminal provided below the lower surface of said semiconductor substrate and electrically connected to said optical element.

11. The optical device according to claim 1,

wherein the curved surface is a recessed curved surface.

12. The optical device according to claim 1,

wherein the curved surface is a protruding curved surface.

13. An optical apparatus in which the optical device according to claim 1 is installed.

14. A method of manufacturing an optical device, said method comprising:

providing a light-transmissive substrate above a semiconductor substrate having a plurality of optical elements so as to integrate the semiconductor substrate and the light-transmissive substrate in a manner such that the optical elements are covered with the light-transmissive substrate;

dicing the integrated semiconductor substrate and light-transmissive substrate,

wherein, in said dicing, the integrated semiconductor substrate and light-transmissive substrate are divided in a manner such that a curved surface is formed in a peripheral end face of the light-transmissive substrate, the curved surface sloping so as to flare from an upper surface of the light-transmissive substrate toward a lower surface of the light-transmissive substrate.

15. The method of manufacturing an optical device according to claim 14,

wherein said dicing includes:

forming, in the integrated semiconductor substrate and light-transmissive substrate, a groove which penetrates through the light-transmissive substrate to reach an inside of the semiconductor substrate; and

removing a region located at a bottom of the groove and having a width smaller than a width of the groove.

16. The method of manufacturing an optical device according to claim 14,

wherein said dicing includes:

forming a blind groove in the light-transmissive substrate; and

removing an area located at a bottom of the groove and having a width smaller than a width of the groove.

17. The method of manufacturing an optical device according to claim 14,

wherein, in said dicing, said dividing is performed using a dicing blade tapered toward an edge.