OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
First Claim
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1. An optical device comprising:
- a semiconductor substrate in which an optical element is formed; and
a light-transmissive substrate provided above said semiconductor substrate so as to cover said optical element,wherein said light-transmissive substrate has, in a peripheral end face, a curved surface which slopes so as to flare from an upper surface of said light-transmissive substrate toward a lower surface of said light-transmissive substrate.
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Abstract
Provided is an optical device which has an increased rate of an area occupied by an effective optical region to an light-transmissive substrate and less noise due to reflection from a peripheral end face of the light-transmissive substrate. The optical device includes a semiconductor substrate in which a light-receiving element is formed and a light-transmissive substrate provided above the semiconductor substrate so as to cover the light-receiving element and fixed to the semiconductor substrate with an adhesive layer. The light-transmissive substrate has, in a peripheral end face, a curved surface which slopes so as to flare from an upper surface toward a lower surface.
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Citations
17 Claims
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1. An optical device comprising:
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a semiconductor substrate in which an optical element is formed; and a light-transmissive substrate provided above said semiconductor substrate so as to cover said optical element, wherein said light-transmissive substrate has, in a peripheral end face, a curved surface which slopes so as to flare from an upper surface of said light-transmissive substrate toward a lower surface of said light-transmissive substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of manufacturing an optical device, said method comprising:
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providing a light-transmissive substrate above a semiconductor substrate having a plurality of optical elements so as to integrate the semiconductor substrate and the light-transmissive substrate in a manner such that the optical elements are covered with the light-transmissive substrate; dicing the integrated semiconductor substrate and light-transmissive substrate, wherein, in said dicing, the integrated semiconductor substrate and light-transmissive substrate are divided in a manner such that a curved surface is formed in a peripheral end face of the light-transmissive substrate, the curved surface sloping so as to flare from an upper surface of the light-transmissive substrate toward a lower surface of the light-transmissive substrate. - View Dependent Claims (15, 16, 17)
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Specification