APPARATUS AND METHOD OF FABRICATING FLAT PLATE DISPLAY

• US 20110147990A1
• Filed: 10/27/2010
• Published: 06/23/2011
• Est. Priority Date: 12/23/2009
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: KIM, Ju-Hyuk, Song, Tae-Joon, Cho, Seong-Pil
• Granted Patent: US 8,961,851 B2
• Time in Patent Office: Days
• US Class Current: 264/293
• CPC Class Codes: B29C 2043/025 forming a microstructure, i.e. fine patterning
• CPC Class Codes: B29C 2059/023 Microembossing
• CPC Class Codes: B29C 59/022 characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
• CPC Class Codes: B29C 59/026 of layered or coated substantially flat surfaces
• CPC Class Codes: B29K 2075/00 Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
• CPC Class Codes: B29L 2007/001 having irregular or rough surfaces treads for tyres B29L2030/002
• CPC Class Codes: B29L 2009/00 Layered products
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• CPC Class Codes: G09F 9/30 in which the desired character or characters are formed by combining individual elements panels comprising a number of electrodes in a single cell controlling light arriving from an independent light source, e.g. electro-optical or magneto-optical cell, G02F1/00

Abstract

A fabricating apparatus and a method of a flat plate display are disclosed. A fabricating apparatus of a flat plate display includes a stage on which a substrate having liquid resin formed thereon is seated, a imprinting mold bonded with the liquid resin of the substrate to form a thin film pattern on the substrate, the imprinting mold comprises projections and grooves, and a planarization layer formed between the stage and the substrate to planarize a surface of the stage.

Claims

1. A fabricating apparatus of a flat plate display comprising:

a stage on which a substrate having liquid resin formed thereon is seated;

an imprinting mold bonded with the liquid resin of the substrate to form a thin film pattern on the substrate, the imprinting mold comprises projections and grooves; and

a planarization layer formed between the stage and the substrate to planarize a surface of the stage.

2. The fabricating apparatus of claim 1, the planarization layer comprises a buffer layer formed of Poly Urethane.

3. The fabricating apparatus of claim 2, wherein the planarization layer further comprises a slip layer formed between the buffer layer and the substrate.

4. The fabricating apparatus of claim 3, wherein the planarization layer further comprises an adhesive layer formed between the buffer layer and the stage and between the buffer layer and the slip layer.

5. The fabricating apparatus of claim 4, wherein shore hardness of the buffer layer is 20˜

90 or less and coefficient of static friction of the slip layer is 1 or less.

6. A fabricating method of a flat plate display comprising steps of:

forming a planarization layer on a stage to planarize a surface of the stage;

seating a substrate having liquid resin formed thereon on the planarization layer;

bonding a imprinting mold and the substrate with each other for the imprinting mold comprising grooves and projections to press the liquid polymeric precursor; and

separating the substrate and the imprinting mold from each other.

7. The fabricating method of claim 6, wherein the step of forming the planarization layer forms a buffer layer formed of Poly Urethane on the stage.

8. The fabricating method of claim 7, wherein the step of forming the planarization layer further comprises a step of forming a slip layer between the buffer layer and the substrate.

9. The fabricating method of claim 8, wherein the step of forming the planarization layer further comprises a step of forming an adhesive layer between the buffer layer and the stage and between the buffer layer and the slip layer.

10. The fabricating method of claim 9, wherein shore hardness of the buffer layer is 20˜

90 or less and coefficient of static friction of the slip layer is 1 or less.