TRANSCAPACITIVE SENSOR DEVICES WITH OHMIC SEAMS

• US 20110148435A1
• Filed: 12/16/2010
• Published: 06/23/2011
• Est. Priority Date: 12/18/2009
• Status: Active Grant

• Current Assignee: Synaptics Incorporated
• Original Assignee: Synaptics Incorporated
• Inventors: Schwartz, Adam, Schediwy, Richard R., Hargreaves, Kirk, Reynolds, Joseph Kurth
• Granted Patent: US 8,638,107 B2
• Time in Patent Office: Days
• US Class Current: 324/658
• CPC Class Codes: G01R 27/2605 Measuring capacitance capacitive sensors G01D5/24
• CPC Class Codes: G06F 3/04166 Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving Synchronisation with the driving of the display or the backlighting unit to avoid interferences generated internally G06F3/04184
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

A transcapacitive sensing device has and ohmic seam which sections a plurality of transmitter electrodes and also sections a plurality of receiver electrodes. A processing system is communicatively coupled with the transmitter electrodes and the receiver electrodes and configured to: transmit a first transmitter signal with a first transmitter electrode disposed on a first side of the ohmic seam; transmit a second transmitter signal with a second transmitter electrode disposed on a second side of the ohmic seam; receive a first response corresponding to said first transmitter signal with a first receiver electrode disposed on the first side of the ohmic seam; and receive a second response corresponding to said second transmitter signal with a second receiver electrode disposed on the second side of the ohmic seam.

Claims

1. A transcapacitive sensing device having an ohmic seam, said transcapacitive sensing device comprising:

a plurality of transmitter electrodes, wherein said plurality of transmitter electrodes is sectioned by said ohmic seam;

a plurality of receiver electrodes, wherein said plurality of receiver electrodes is sectioned by said ohmic seam; and

a processing system communicatively coupled with said plurality of transmitter electrodes and said plurality of receiver electrodes, said processing system configured to;

transmit a first transmitter signal with a first transmitter electrode of said plurality of transmitter electrodes, wherein said first transmitter electrode is disposed on a first side of said ohmic seam;

transmit a second transmitter signal with a second transmitter electrode of said plurality of transmitter electrodes, wherein said second transmitter electrode is disposed on a second side of said ohmic seam;

receive a first response corresponding to said first transmitter signal with a first receiver electrode of said plurality of receiver electrodes, wherein said first receiver electrode is disposed on said first side of said ohmic seam; and

receive a second response corresponding to said second transmitter signal with a second receiver electrode of said plurality of receiver electrodes, wherein said second receiver electrode is disposed on said second side of said ohmic seam.

2. The transcapacitive sensing device of claim 1, wherein said processing system comprises:

a first receiver circuit configured to provide a first value proportional to said first response;

a second receiver circuit configured to provide a second value proportional to said second response; and

memory configured for storing calibration information, said calibration information configured for adjusting said first value to produce a first adjusted value, wherein a first proportionality of said first adjusted value to said first response is substantially equal to a second proportionality of said second value or an adjusted second value to said second response.

3. The transcapacitive sensing device of claim 1, wherein said processing system comprises:

a first receiver circuit disposed in a first integrated circuit, said first receiver circuit configured for receiving said first response from said first receiver electrode;

a second receiver circuit disposed in a second integrated circuit, said second receiver circuit configured for receiving said second response from said second receiver electrode, wherein said second integrated circuit is physically separate from said first integrated circuit; and

analysis circuitry configured to receive information based on said first response from said first receiver circuit and information based on said second response from said second receiver circuit.

4. The transcapacitive sensing device of claim 1, wherein said processing system comprises:

a coding component configured for uniquely encoding transmitter signals concurrently transmitted with at least two of said plurality of transmitter electrodes.

5. The transcapacitive sensing device of claim 1, wherein said processing system is further configured to:

suspend transmissions with said plurality of transmitter electrodes during a non-transmitting period.

6. The transcapacitive sensing device of claim 1, wherein said ohmic seam is a receiver seam, and wherein said second receiver electrode is disposed opposite said first receiver electrode, and wherein said first transmitter electrode is disposed adjacent to said second transmitter electrode.

7. The transcapacitive sensing device of claim 1, wherein said ohmic seam is a transmitter seam, and wherein said second transmitter electrode is disposed opposite said first transmitter electrode, and wherein said second receiver electrode is disposed adjacent to said first receiver electrode.

8. The transcapacitive sensing device of claim 1, wherein said ohmic seam is a transmitter seam, wherein said second transmitter electrode is disposed opposite to said first transmitter electrode, and wherein said processing system is configured to:

concurrently transmit said first transmitter signal with said first transmitter electrode and said second transmitter signal with said second transmitter electrode.

9. The transcapacitive sensing device of claim 1, wherein said ohmic seam is a receiver seam, wherein said second transmitter electrode is disposed non-adjacent to said first transmitter electrode, and wherein said processing system is configured to:

concurrently transmit said first transmitter signal with said first transmitter electrode and said second transmitter signal with said second transmitter electrode.

10. The transcapacitive sensing device of claim 1, wherein said plurality of transmitter electrodes is further sectioned by a second ohmic seam, and wherein said plurality of receiver electrodes is further sectioned by said second ohmic seam.

11. The transcapacitive sensing device of claim 10, wherein said ohmic seam is a first receiver seam, and wherein said second ohmic seam is a second receiver seam.

12. The transcapacitive sensing device of claim 10, wherein said ohmic seam is a transmitter seam, and wherein said second ohmic seam is a receiver seam.

13. A method of capacitive sensing with a capacitive sensing device comprising a plurality of transmitter electrodes sectioned by an ohmic seam and a plurality of receiver electrodes sectioned by said ohmic seam, said method comprising:

transmitting a first transmitter signal with a first transmitter electrode of said plurality of transmitter electrodes, wherein said first transmitter electrode is disposed on a first side of said ohmic seam;

transmitting a second transmitter signal with a second transmitter electrode of said plurality of transmitter electrodes, wherein said second transmitter electrode is disposed on a second side of said ohmic seam;

receiving a first response corresponding to said first transmitter signal with a first receiver electrode of said plurality of receiver electrodes, wherein said first receiver electrode is disposed on said first side of said ohmic seam; and

receiving a second response corresponding to said second transmitter signal with a second receiver electrode of said plurality of receiver electrodes, wherein said second receiver electrode is on said second side of said ohmic seam.

14. The method as recited in claim 13, wherein said ohmic seam is a receiver seam, wherein a third transmitter electrode of said plurality of transmitter electrodes is disposed on said first side and farther from said receiver seam than said first transmitter electrode, and wherein a fourth transmitter electrode of said plurality of transmitter electrodes is disposed on said second side and farther from said receiver seam than said second transmitter electrode, said method further comprising:

transmitting transmitter signals in a sequence spatially moving relative to said receiver seam, wherein said sequence is selected from the group consisting of;

a first sequence moving away from said receiver seam, and a second sequence moving towards said receiver seam;

wherein said first sequence corresponds to;

transmitting a third transmitter signal with said third transmitter electrode after said transmitting said first transmitter signal with said first transmitter electrode; and

transmitting a fourth transmitter signal with said fourth transmitter electrode after said transmitting said second transmitter signal with said second transmitter electrode; and

wherein said second sequence corresponds to;

transmitting a third transmitter signal with said third transmitter electrode before said transmitting said first transmitter signal with said first transmitter electrode; and

transmitting a fourth transmitter signal with said fourth transmitter electrode before said transmitting said second transmitter signal with said second transmitter electrode.

15. The method as recited in claim 13, wherein said ohmic seam is a transmitter seam, wherein said second transmitter electrode is disposed opposite said first transmitter electrode, and wherein said transmitting said second transmitter signal with a second transmitter electrode comprises:

transmitting said second transmitter signal with said second transmitter electrode during a second time period which overlaps at least partially with a first time period during which said first transmitter signal is transmitted with said first transmitter electrode.

16. The method as recited in claim 13, wherein said ohmic seam is a receiver seam, wherein said second receiver electrode is disposed opposite said first receiver electrode, wherein said second transmitter electrode is disposed non-adjacent to the first transmitter electrode, and wherein said transmitting said second transmitter signal with a second transmitter electrode comprises:

transmitting said second transmitter signal with said second transmitter electrode during a second time period which overlaps at least partially with a first time period during which said first transmitter signal is transmitted with said first transmitter electrode.

17. The method as recited in claim 13, wherein said ohmic seam is a receiver seam, wherein said second receiver electrode is disposed opposite said first receiver electrode, wherein said second transmitter electrode is disposed adjacent to said first transmitter electrode, and wherein said transmitting said second transmitter signal with a second transmitter electrode comprises:

transmitting said second transmitter signal with said second transmitter electrode during a second time period which non-overlaps at least partially with a first time period during which said first transmitter signal is transmitted with said first transmitter electrode.

18. The method as recited in claim 13, wherein a third transmitter electrode is disposed on said first side of said ohmic seam, said method further comprising:

transmitting a third transmitter signal with said third transmitter electrode concurrently with said transmitting a first transmitter signal with said first transmitter electrode, such that said first receiver electrode receives a resulting signal that combines said first response and a third response corresponding to said third transmitter signal; and

determining independent results associated with said first response and said third response using said resulting signal.

19. A transcapacitive sensor electrode arrangement comprising:

a plurality of transmitter electrodes aligned along a first direction and sectioned by an ohmic seam; and

a plurality of receiver electrodes aligned along a second direction non-parallel to said first direction and sectioned by said ohmic seam, wherein said plurality of transmitter electrodes and said plurality of receiver electrodes form a plurality of split pixels coinciding with said ohmic seam.

20. The transcapacitive sensor electrode arrangement of claim 19, wherein said ohmic seam is a receiver seam overlapping a first transmitter electrode of said plurality of transmitter electrodes, and wherein each of said plurality of split pixels is formed from said first transmitter electrode and at least two receiver electrodes of said plurality of receiver electrodes.

21. The transcapacitive sensor electrode arrangement of claim 19, wherein said ohmic seam is a transmitter seam overlapping a first receiver electrode of said plurality of receiver electrodes, and wherein each of said plurality of split pixels is formed from said first receiver electrode and at least two transmitter electrodes of said plurality of transmitter electrodes.

22. A processing system configured for operating a capacitive sensing device, the processing system comprising:

transmitter circuitry configured to transmit with a plurality of transmitter electrodes of said capacitive sensing device, said plurality of transmitter electrodes disposed along a first axis and sectioned by an ohmic seam;

receiver circuitry configured to receive with a plurality of receiver electrodes of said capacitive sensing device, said plurality of receiver electrodes disposed along a second axis non-parallel to said first axis and sectioned by said ohmic seam, wherein said plurality of transmitter electrodes and said plurality of receiver electrodes form a plurality of split pixels coinciding with said ohmic seam; and

analysis circuitry configured to estimate an amount of capacitive coupling associated with each split pixel of said plurality of split pixels.

23. The processing system of claim 22, wherein said analysis circuitry is configured to estimate an amount of capacitive coupling associated with each split pixel of said plurality of split pixels by:

for each split pixel of said plurality of split pixels, combining associated partial pixel measurements obtained using said plurality of receiver electrodes.

24. The processing system of claim 22, wherein said analysis circuitry is configured to estimate an amount of capacitive coupling associated with each split pixel of said plurality of split pixels by:

applying a weighting for at least one partial pixel of said plurality of split pixels based on an amount of signal amplification associated with said at least one partial pixel.