METHOD OF PLACING RFID TAG FOR UNDERGROUND USE UNDER GROUND SURFACE

• US 20110148584A1
• Filed: 06/29/2010
• Published: 06/23/2011
• Est. Priority Date: 12/18/2009
• Status: Abandoned Application

• Current Assignee: Electronics and Telecommunications Research Institute, Industrial Cooperation Foundation Chonbuk National University
• Original Assignee: Electronics and Telecommunications Research Institute, Industrial Cooperation Foundation Chonbuk National University
• Inventors: PARK, Jeong-Ho, LEE, KYONG HEE, SON, Hae Won, MIN, Kyoung-Wook, JIN, Gwang Ja, KIM, Ju Wan, LEE, Seung Yong, PARK, Jong-Hyun
• Application Number:
  US12/825,561
• Publication Number:
  US 20110148584A1
• Time in Patent Office: Days
• US Class Current: 340/10.1
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs

Abstract

A method includes: placing a Radio Frequency Identification (RFID) tag for underground use under a ground surface, wherein a ground plate which has a diameter greater than that of the RFID tag or a tag antenna and on a top of which the RFID tag is mounted is placed underground such that the RFID tag protrudes above the ground surface or a bottom of the RFID tag is aligned with the ground surface.

Claims

1. A method, comprising:

placing a Radio Frequency Identification (RFID) tag for underground use under a ground surface, wherein a ground plate which has a diameter greater than that of the RFID tag or a tag antenna and on a top of which the RFID tag is mounted is placed underground such that the RFID tag protrudes above the ground surface or a bottom of the RFID tag is aligned with the ground surface.

2. The method of claim 1, wherein the ground plate has a circular or square column shape.

3. The method of claim 1, wherein the ground plate is made of metal.

4. The method of claim 3, wherein an inside of the ground plate is empty or is filled with an insulating material.

5. The method of claim 4, wherein the insulating material is plastic.

6. The method of claim 1, wherein the ground plate is formed by plating an insulating material with a metallic material or by attaching a metallic tape to the insulating material.

7. A method, comprising:

placing an RFID tag for underground use under a ground surface, wherein a ground plate which has a diameter greater than that of the RFID tag or a tag antenna, on a top of which the RFID tag is mounted, and a bottom of which is provided with one or more metallic protrusions is placed underground such that part or all of the RFID tag is placed under the ground surface.

8. The method of claim 7, wherein the ground plate is made of metal.

9. The method of claim 7, wherein the ground plate is formed by plating an insulating material with a metallic material or by attaching a metallic tape to the insulating material.

10. The method of claim 7, wherein the metallic protrusions are formed by bending the ground plate at right and left ends thereof.