COLOR FILTER USING SURFACE PLASMON, LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME

• US 20110149217A1
• Filed: 11/08/2010
• Published: 06/23/2011
• Est. Priority Date: 12/18/2009
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Yoon, Min-Sung
• Granted Patent: US 8,749,736 B2
• Time in Patent Office: Days
• US Class Current: 349/106
• CPC Class Codes: G02B 5/008 Surface plasmon devices diffractive gratings with a pitch less than or comparable to the wavelength G02B5/1809; surface plasmons in integrated optics G02B6/1226; optical analysis of materials by means of surface plasmons G01N21/553
• CPC Class Codes: G02B 5/201 in the form of arrays
• CPC Class Codes: G02F 1/133514 Colour filters
• CPC Class Codes: G02F 1/1343 Electrodes reflective electrodes G02F1/133553
• CPC Class Codes: G02F 2201/121 common or background
• CPC Class Codes: G02F 2203/055 wavelength filtering
• CPC Class Codes: G02F 2203/10 plasmon
• CPC Class Codes: G02F 2203/34 Colour display without the use of colour mosaic filters

Abstract

Discussed are a color filter using a surface plasmon, a liquid crystal display (LCD) device and a method for fabricating the same, capable of enhancing a transmittance rate of an LC panel, by forming a transmissive pattern having a plurality of sub-wavelength holes having a period at a metal layer so that light of a specific wavelength can be selectively transmitted, and capable of simplifying the entire processed.

Claims

1. A color filter using a surface plasmon, comprising:

a metal layer;

a transmissive pattern formed in the metal layer, and including a plurality of sub-wavelength holes having a period; and

a plurality of non-penetrating grooves formed at a region encompassing the plurality of holes,

wherein a desired color is implemented by selectively transmitting light of a specific wavelength by using a surface plasmon.

2. The color filter using a surface plasmon of claim 1, wherein the plurality of holes have a period.

3. The color filter using a surface plasmon of claim 2, further comprising a plurality of non-penetrating grooves having a period and formed near the plurality of holes having a period.

4. The color filter using a surface plasmon of claim 1, wherein a horizontal sectional surface of the hole has one of a circular shape, a quadrangular shape, a triangular shape, an oval shape, and a slit shape having an aspect ratio more than one.

5. The color filter using a surface plasmon of claim 1, wherein a horizontal sectional surface of the groove has one of a circular shape, a quadrangular shape, a triangular shape, an oval shape, and a slit shape having an aspect ratio more than one.

6. The color filter using a surface plasmon of claim 1, wherein the metal layer is formed of a conductive material including at least one selected from a group consisting of aluminum (Al), gold (Au), silver (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd), zinc (Zn), iron (Fe), chrome (Cr), molybdenum (Mo), a doped semiconductor device, carbon nanotube, fullerene, conductive plastic, and electrical conductive composite material, or a mixture thereof.

7. The color filter using a surface plasmon of claim 1, wherein the hole has a size of 50 nm˜

10 μ

m.

8. The color filter using a surface plasmon of claim 1, wherein the groove has a size of 50 nm˜

10 μ

m.

9. The color filter using a surface plasmon of claim 1, wherein the holes have a period of 50 nm˜

10 μ

m.

10. The color filter using a surface plasmon of claim 1, wherein the grooves have a period of 50 nm˜

10 μ

m.

11. The color filter using a surface plasmon of claim 1, wherein the transmissive pattern is divided into a plurality of regions having different hole periods.

12. A liquid crystal display (LCD) device, comprising:

a color filter formed on a first substrate, having a transmissive pattern formed in a metal layer and including a plurality of sub-wavelength holes having a period, and having a plurality of non-penetrating grooves formed at a region encompassing the plurality of holes, for implementing a desired color by selectively transmitting light of a specific wavelength;

a thin film transistor (TFT) formed on the color filter; and

a second substrate bonded to the first substrate with facing the first substrate, wherein the second substrate includes no color filter and no black matrix.

13. A liquid crystal display (LCD) device, comprising:

a color filter formed on an outer surface of a first substrate, having a transmissive pattern formed in a metal layer and including a plurality of sub-wavelength holes having a period, and having a plurality of non-penetrating grooves formed at a region encompassing the plurality of holes, for implementing a desired color by selectively transmitting light of a specific wavelength;

a thin film transistor (TFT) formed on an inner surface of the first substrate; and

a second substrate bonded to the first substrate with facing the first substrate, wherein the second substrate includes no color filter and no black matrix.

14. A liquid crystal display (LCD) device, comprising:

a thin film transistor (TFT) formed on a first substrate; and

a color filter formed on a second substrate, having a transmissive pattern formed in a metal layer and including a plurality of sub-wavelength holes having a period, and having a plurality of non-penetrating grooves formed at a region encompassing the plurality of holes, for implementing a desired color by selectively transmitting light of a specific wavelength,

wherein the first substrate is bonded to the second substrate with facing the second substrate, and the color filter replaces a common electrode or a back electrode.

15. The LCD device of claim 14, wherein the plurality of holes have a period.

16. The LCD device of claim 15, further comprising a plurality of non-penetrating grooves having a period and formed near the plurality of holes having a period.

17. The LCD device of claim 15, wherein a horizontal sectional surface of the hole has one of a circular shape, a quadrangular shape, a triangular shape, an oval shape, and a slit shape having an aspect ratio more than one.

18. The LCD device of claim 15, wherein a horizontal sectional surface of the groove has one of a circular shape, a quadrangular shape, a triangular shape, an oval shape, and a slit shape having an aspect ratio more than one.

19. The LCD device of claim 15, wherein the metal layer is formed of a conductive material including at least one selected from a group consisting of aluminum (Al), gold (Au), silver (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd), zinc (Zn), iron (Fe), chrome (Cr), molybdenum (Mo), a doped semiconductor device, carbon nanotube, fullerene, conductive plastic, and electrical conductive composite material, or a mixture thereof.

20. The LCD device of claim 15, wherein the hole has a size of 50 nm˜

10 μ

m.

21. The LCD device of claim 15, wherein the groove has a size of 50 nm˜

10 μ

m.

22. The LCD device of claim 15, wherein the holes have a period of 50 nm˜

10 μ

m.

23. The LCD device of claim 15, wherein the grooves have a period of 50 nm˜

10 μ

m.

24. The LCD device of claim 15, wherein the transmissive pattern is divided into a plurality of regions having different hole periods.

25. The LCD device of claim 15, further comprising an insulating layer formed on the metal layer and inside the plurality of holes and grooves, and formed with the same dielectric material as the first and second substrates.

26. A method for fabricating a liquid crystal display (LCD) device, the method comprising:

providing first and second substrates;

forming, on the first substrate, a color filter having a transmissive pattern formed in a metal layer and consisting of a plurality of sub-wavelength holes having a period, the color filter for implementing a desired color by selectively transmitting light of a specific wavelength;

forming a plurality of non-penetrating grooves formed at a region encompassing the plurality of holes;

forming a thin film transistor (TFT) on the color filter; and

bonding the first substrate and the second substrate to each other, wherein the second substrate includes no color filter and no black matrix.

27. A method for fabricating a liquid crystal display (LCD) device, the method comprising:

providing first and second substrates;

forming, on an outer surface of the first substrate, a color filter having a transmissive pattern formed in a metal layer and consisting of a plurality of sub-wavelength holes having a period, the color filter for implementing a desired color by selectively transmitting light of a specific wavelength;

forming a plurality of non-penetrating grooves formed at a region encompassing the plurality of holes;

forming a thin film transistor (TFT) on an inner surface of the first substrate; and

bonding the first substrate and the second substrate to each other, wherein the second substrate includes no color filter and no black matrix.

28. A method for fabricating a liquid crystal display (LCD) device, the method comprising:

providing first and second substrates;

forming a thin film transistor on the first substrate;

forming, on the second substrate, a color filter having a transmissive pattern formed in a metal layer and consisting of a plurality of sub-wavelength holes having a period, the color filter for implementing a desired color by selectively transmitting light of a specific wavelength;

forming a plurality of non-penetrating grooves formed at a region encompassing the plurality of holes; and

bonding the first substrate and the second substrate to each other, wherein the color filter replaces a common electrode or a back electrode.

29. The method of claim 28, wherein the plurality of holes have a period.

30. The method of claim 29, further comprising forming a plurality of non-penetrating grooves near the plurality of holes having a period.

31. The method of claim 29, wherein a horizontal sectional surface of the hole has one of a circular shape, a quadrangular shape, a triangular shape, an oval shape, and a slit shape having an aspect ratio more than one.

32. The method of claim 29, wherein a horizontal sectional surface of the groove has one of a circular shape, a quadrangular shape, a triangular shape, an oval shape, and a slit shape having an aspect ratio more than one.

33. The method of claim 29, wherein the metal layer is formed of a conductive material including at least one selected from a group consisting of aluminum (Al), gold (Au), silver (Ag), platinum (Pt), copper (Cu), nickel (Ni), palladium (Pd), zinc (Zn), iron (Fe), chrome (Cr), molybdenum (Mo), a doped semiconductor device, carbon nanotube, fullerene, conductive plastic, and electrical conductive composite material, or a mixture thereof.

34. The method of claim 29, wherein the hole has a size of 50 nm˜

10 μ

m.

35. The method of claim 29, wherein the groove has a size of 50 nm˜

10 μ

m.

36. The method of claim 29, wherein the holes have a period of 50 nm˜

10 μ

m.

37. The method of claim 29, wherein the grooves have a period of 50 nm˜

10 μ

m.

38. The method of claim 29, further comprising forming an insulating layer, on the metal layer and inside the plurality of holes and grooves, with the same dielectric material as the first and second substrates.

39. The method of claim 38, wherein in case of using glass substrates as the first and second substrates, the insulating layer is formed of SiO₂.

40. The method of claim 38, wherein the insulating layer is formed to have a thickness of 10 nm˜

100 μ

m.

41. The method of claim 29, wherein the metal layer is formed by using one of a gas phase method, a liquid phase method, a solid phase method, and a nanosol coating method.

42. The method of claim 29, wherein the transmissive pattern is formed by using one of an e-beam lithography, an ion beam milling, a nanosphere lithography, a nano imprinting, a photolithography, and a laser interference lithography.

43. The method of claim 29, wherein the transmissive pattern is divided into a plurality of regions having different hole periods.

44. The method of claim 29, wherein the grooves are formed by one of an etching process, a milling process, and a metal deposition process.