BASE PLATE FOR USE IN A MULTI-CHIP MODULE

• US 20110149539A1
• Filed: 12/23/2009
• Published: 06/23/2011
• Est. Priority Date: 12/23/2009
• Status: Active Grant

• Current Assignee: Oracle America, Inc. (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Nettleton, Nyles, Guenin, Bruce M., Shi, Jing
• Granted Patent: US 8,164,917 B2
• Time in Patent Office: Days
• US Class Current: 361/764
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2225/06531 Non-galvanic coupling, e.g. capacitive coupling
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top and bottom surfaces are electrically coupled to these electrical connectors. Furthermore, a bridge chip is rigidly mechanically coupled to the top surface. This bridge chip includes proximity communication connectors that communicate information via proximity communication with one or more island chips in the MCM. Additionally, spacers are rigidly mechanically coupled to the top surface of the substrate. In conjunction with the bridge chip, the spacers define cavities on the top surface, which include second electrical connectors. These second electrical connectors are electrically coupled to the TSVs, and communicate additional information with and convey power to the one or more island chips.

Claims

1. A base mechanism for use in a multi-chip module (MCM), comprising:

a first substrate having a first surface and a second surface, wherein first electrical connectors that convey power are disposed on the first surface, and wherein the first substrate includes through-substrate vias (TSVs) between the first surface and the second surface which are electrically coupled to the first electrical connectors;

a bridge chip rigidly mechanically coupled to the second surface, wherein proximity communication connectors are disposed on a top surface of the bridge chip to communicate information via proximity communication with one or more island chips in the MCM; and

spacers, rigidly mechanically coupled to the second surface, which in conjunction with the bridge chip define cavities on the second surface that have a depth, wherein second electrical connectors are disposed on the second surface within the cavities to communicate additional information with and convey power to the one or more island chips, and wherein the second electrical connectors are electrically coupled to the TSVs.

2. The base mechanism of claim 1, wherein the first substrate includes a semiconductor, a ceramic material, an organic material or a printed circuit board.

3. The base mechanism of claim 1, wherein the bridge chip includes a second substrate;

wherein the second substrate includes a semiconductor; and

wherein transmit and receive electrical circuits are disposed on the semiconductor.

4. The base mechanism of claim 1, wherein the bridge chip includes a second substrate;

wherein the second substrate includes a material other than a semiconductor; and

wherein the bridge chip is a passive device.

5. The base mechanism of claim 1, wherein the bridge chip is defined on the first substrate.

6. The base mechanism of claim 1, wherein the bridge chip includes additional TSVs that are electrically coupled to the proximity communication connectors and to solder connections to the second surface.

7. The base mechanism of claim 1, wherein the bridge chip is embedded in the first substrate.

8. The base mechanism of claim 7, wherein the first substrate is built up around sides of the bridge chip.

9. The base mechanism of claim 1, wherein the proximity communication includes optical proximity communication, capacitive proximity communication, inductive proximity communication or conductive proximity communication.

10. The base mechanism of claim 1, wherein the spacers are defined using an additive fabrication process.

11. The base mechanism of claim 1, wherein the spacers are defined using a subtractive fabrication process.

12. The base mechanism of claim 1, wherein the second electrical connectors include solder pads, an interposer or microspring inter-component connectors.

13. The base mechanism of claim 12, wherein the microspring inter-component connectors include claw connectors.

14. The base mechanism of claim 1, wherein the second electrical connectors provide mechanical compliance greater than a predefined value in a direction perpendicular to the second surface.

15. The base mechanism of claim 1, wherein the second electrical connectors include additional proximity communication connectors.

16. The base mechanism of claim 1, wherein the proximity communication connectors are arranged in selectable groups that facilitate the use of the base mechanism in different configurations of the MCM in which a given island chip communicates the information with the base mechanism via one or more of the selectable groups.

17. An MCM, comprising:

one or more island chips having first proximity communication connectors disposed on first surfaces of the one or more island chips; and

a base mechanism, including;

a first substrate having a second surface and a third surface, wherein first electrical connectors that convey power are disposed on the second surface, and wherein the first substrate includes through-substrate vias (TSVs) between the second surface and the third surface which are electrically coupled to the first electrical connectors;

a bridge chip rigidly mechanically coupled to the third surface, wherein second proximity communication connectors are disposed on a top surface of the bridge chip to communicate information via proximity communication with the first proximity communication connectors of the one or more island chips; and

spacers, rigidly mechanically coupled to the third surface, which in conjunction with the bridge chip define cavities on the third surface that have a depth, wherein second electrical connectors are disposed on the third surface within the cavities to communicate additional information with and convey power to the one or more island chips, and wherein the second electrical connectors are electrically coupled to the TSVs.

18. A method for assembling an MCM, comprising:

placing one or more island chips proximate to cavities in a base mechanism in the MCM, wherein the cavities are defined by spacers and a bridge chip on a top surface of the base mechanism, wherein the bridge chip is rigidly mechanically coupled to the top surface of the base mechanism, wherein there are electrical connectors disposed on the top surface of the base mechanism within the cavities, and wherein there are proximity communication connectors disposed on a top surface of the bridge chip to communicate information via proximity communication with the one or more island chips; and

applying a pressure, via at least one pressure plate, to top surfaces of one or more island chips in the MCM while rigid mechanical coupling between bottom surfaces of the island chips and the top surface of the base mechanism in the MCM is established via the electrical connectors.

19. The method of claim 18 wherein the method further comprises holding the island chips in place using a pressure less than atmospheric pressure while the rigid mechanical coupling is established.

20. The method of claim 18 wherein there are multiple pressure plates;

and

wherein a given pressure plate in the multiple pressure plates applies pressure to a top surface of a given island chip in the one or more island chips.