LIGHT-EMITTING DEVICE

• US 20110149578A1
• Filed: 08/11/2009
• Published: 06/23/2011
• Est. Priority Date: 08/12/2008
• Status: Abandoned Application

• Current Assignee: Heiji Niiyama
• Original Assignee: Heiji Niiyama
• Inventors: Niiyama, Tsubasa, Niiyama, Heiji
• Application Number:
  US13/058,522
• Publication Number:
  US 20110149578A1
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49107 on the semiconductor or solid-state body
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

Disclosed is a heat-resistant light-emitting device wherein luminance is increased by increasing the light emission area. A light-emitting device 1 comprises: a plate-like heat dissipation member 2; a light-emitting body 3 emitting linear or surface light, which is mounted on the heat dissipation member 2 and has a substrate 31 and a semiconductor laminate 32 formed on substrate 31; a fluorescent lens 4 covering the light-emitting body 3 on the heat dissipation member 2; and a light-emitting-body-side vacuum heat insulation layer 5 formed between fluorescent lens 4 and the light-emitting body 3. The light-emitting device 1 secures heat dissipation performance, while increasing the light emission area.

Claims

1. A light-emitting device comprising:

a plate-like heat dissipation member;

a light-emitting body emitting linear or planar light, which is mounted on the heat dissipation member, and which has a substrate, and a semiconductor laminate extending in a predetermined direction and including a first conductivity-type first semiconductor layer, a light-emitting layer, and a second conductivity-type second semiconductor layer;

a fluorescent lens covering the light-emitting body on the heat dissipation member, which emits light with a different wavelength from the light of the light-emitting body when excited by the light;

a light-emitting-body-side vacuum heat insulation layer formed between the fluorescent lens and the light-emitting body;

a diffusion lens covering the outside of fluorescent lens, which diffuses light passing through the fluorescent lens; and

a lens-side vacuum heat insulation layer formed between the diffusion lens and the fluorescent lens;

wherein the heat dissipation member extends in the same direction as the extending direction of the light-emitting body.

2. The light-emitting device according to claim 1, wherein the diffusion lens inhibits external ultraviolet light from penetrating.

3. The light-emitting device according to claim 1, wherein the light-emitting device further comprises a heat insulating material that is provided on the outer edge side of the heat dissipation member'"'"'s upper surface, and the diffusion lens is disposed on the heat dissipation member via the heat insulating material.

4. The light-emitting device according to claim 3, wherein the diffusion lens is welded on the heat insulating material.

5. The light-emitting device according to claim 4, wherein the fluorescent lens is disposed on the heat dissipation member via the heat insulating material.

6. The light-emitting device according to claim 3, wherein the fluorescent lens and the diffusion lens are made of glass.

7. The light-emitting device according to claim 4, wherein the fluorescent lens and diffusion lens are made of glass.

8. The light-emitting device according to claim 5, wherein the fluorescent lens and diffusion lens are made of glass.

9. The light-emitting device according to claim 2, wherein the light-emitting device further comprises a heat insulating material that is provided on the outer edge side of the heat dissipation member'"'"'s upper surface, and the diffusion lens is disposed on the heat dissipation member via the heat insulating material.