RECEIVER SIGNAL PROBING USING A SHARED PROBE POINT
First Claim
Patent Images
1. An integrated circuit, comprising:
- a receiver including a plurality of signal lines extending from a plurality of signal pads on an external surface of the integrated circuit chip for receiving a digital signal;
a multiplexer having a plurality of inputs, a plurality of select lines and an output, wherein each input is internally connected to one of the plurality of signal lines, and wherein the plurality of select lines allow selection of any one of the plurality of inputs; and
an amplifier coupled to the multiplexer output for amplifying a signal carried on the selected signal line of the receiver and communicating the amplified signal to a test pad on the external surface of the integrated circuit.
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Abstract
A device and method are disclosed wherein a receiver signal line within an integrated circuit may be selected for probing. In one embodiment, a plurality of signal pads and a test pad are provided on an external surface of an integrated circuit chip. A plurality of signal lines extends through the integrated circuit chip to the signal pads. A multiplexer on the integrated circuit chip is configured for individually selecting any of the signal lines. An amplifier on the integrated circuit chip amplifies a selected signal and communicates the amplified signal to an externally-accessible test pad to be probed.
28 Citations
16 Claims
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1. An integrated circuit, comprising:
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a receiver including a plurality of signal lines extending from a plurality of signal pads on an external surface of the integrated circuit chip for receiving a digital signal; a multiplexer having a plurality of inputs, a plurality of select lines and an output, wherein each input is internally connected to one of the plurality of signal lines, and wherein the plurality of select lines allow selection of any one of the plurality of inputs; and an amplifier coupled to the multiplexer output for amplifying a signal carried on the selected signal line of the receiver and communicating the amplified signal to a test pad on the external surface of the integrated circuit. - View Dependent Claims (2, 3, 4, 5, 8)
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6. A chip package, comprising:
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an integrated circuit including a receiver, a multiplexer and an amplifier, wherein the receiver has a plurality of signal lines extending from a plurality of signal pads on an external surface of the integrated circuit chip for receiving a digital signal, wherein the multiplexer has a plurality of inputs, a plurality of select lines and an output, wherein each input is internally connected to one of the plurality of signal lines, wherein the plurality of select lines allow selection of any one of the plurality of inputs, and wherein the amplifier coupled to the multiplexer output for amplifying a signal carried on the selected signal line of the receiver and communicating the amplified signal to a test pad on the external surface of the integrated circuit; and a package substrate having a plurality of signal contacts on a chip side of the package substrate contacting the signal pads on the integrated circuit chip, and a test contact on the chip side of the package substrate for contacting the test pad on the supported integrated circuit chip. - View Dependent Claims (7)
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9. A system for testing signals at a receiver within an integrated circuit, comprising:
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an integrated circuit including a receiver, a multiplexer and an amplifier, wherein the receiver has a plurality of signal lines extending from a plurality of signal pads on an external surface of the integrated circuit chip for receiving a digital signal, wherein the multiplexer has a plurality of inputs, a plurality of select lines and an output, wherein each input is internally connected to one of the plurality of signal lines, wherein the plurality of select lines allow selection of any one of the plurality of inputs, and wherein the amplifier coupled to the multiplexer output for amplifying a signal carried on the selected signal line of the receiver and communicating the amplified signal to a test pad on the external surface of the integrated circuit; a package substrate having a plurality of signal contacts on a chip side of the package substrate contacting the signal pads on the integrated circuit chip, a test contact on the chip side of the package substrate for contacting the test pad on the supported integrated circuit chip, a plurality of signal conductors extending through the package substrate from the plurality of signal contacts to a board side of the package substrate, and an externally-accessible probe point on the package substrate in communication with the test contact; a controller coupled through a bus to the plurality of select lines of the multiplexer for selecting one of the plurality of signal lines to test; and a probe for contacting the externally accessible probe point, wherein the probe communicates with an oscilloscope.
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10. A method of testing signals at a receiver within an integrated circuit chip, comprising:
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transmitting signals to the receiver over a plurality of signal lines within the integrated circuit chip; selecting one of the plurality of signal lines as the input to a multiplexer within the integrated circuit chip; amplifying the signal on the selected one of the signal lines; communicating the amplified signal from the integrated circuit chip to an external probe point of a chip package supporting the integrated circuit; and probing the amplified signal at the external probe point. - View Dependent Claims (11, 12, 13, 14, 15, 16)
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Specification