THERMAL SENSORS HAVING FLEXIBLE SUBSTRATES AND USE THEREOF

• US 20110150030A1
• Filed: 12/23/2009
• Published: 06/23/2011
• Est. Priority Date: 12/23/2009
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Kaysen, David A., ABDELMONEUM, MOHAMED A.
• Granted Patent: US 8,821,009 B2
• Time in Patent Office: Days
• US Class Current: 374/117
• CPC Class Codes: G01K 7/32 using change of resonant frequency of a crystal

Abstract

Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor the platform temperature. Fabricating the resonator on a relatively low cost flexible polymer substrate rather than silicon provides mechanical flexibility as well as design flexibility with respect to sensor placement. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.

Claims

1. An apparatus comprising:

a flexible substrate; and

a micro-electro-mechanical system (MEMS) resonator structure disposed on the flexible substrate, the resonator structure to provide an output signal corresponding to a temperature detected by the resonator structure.

2. The apparatus of claim 1 further comprising a circuit to receive the output signal from the resonator structure and to analyze the output signal to determine the temperature detected by the resonator structure.

3. The apparatus of claim 1 wherein the output signal from the resonator structure comprises a current that corresponds to a change in capacitance when the resonator vibrates at one of its natural frequencies, the change in the frequency of the output current capacitance corresponding to a change in temperature.

4. The apparatus of claim 1 wherein the resonator structure comprises at least a copper resonator.

5. The apparatus of claim 1 further comprising an extension portion of the flexible substrate having a plurality of conductors thereon with contacts at one end of the conductors.

6. The apparatus of claim 1 further comprising a connector disposed on a printed circuit board, the connector to receive the contacts.

7. The apparatus of claim 6 wherein the connector comprises a zero insertion force (ZIF) connector.

8. A system comprising:

a flexible substrate having a body portion and an extension portion;

a micro-electro-mechanical system (MEMS) resonator structure disposed on the body portion of the flexible substrate and a plurality of conductors with contacts at one end of the conductors on the extension portion, the resonator structure to provide an output signal over one or more of the conductors corresponding to a temperature detected by the resonator structure;

a connector disposed on a printed circuit board, the connector to receive the contacts; and

a circuit coupled with the connector to receive the output signal from the resonator structure and to analyze the output signal to determine the temperature detected by the resonator structure.

9. The system of claim 8 wherein the output signal from the resonator structure comprises a current having a frequency changes as the resonator structure natural frequency changes with temperature of the resonator structure, wherein a voltage applied to the resonator structure results in a proportional change in output current amplitude.

10. The system of claim 9 wherein the oscillator circuit generates a digital output signal with a frequency equal to the frequency of the output current generated from the resonator structure.

11. The system of claim 8 wherein the resonator structure comprises at least a copper resonator.

12. The system of claim 8 wherein the connector comprises a zero insertion force (ZIF) connector.

13. A thermal management system comprising:

a plurality of thermal sensors, each thermal sensor comprising a flexible substrate and a micro-electro-mechanical system (MEMS) resonator structure disposed on the body portion of the flexible substrate and a plurality of conductors with contacts at one end of the conductors on the extension portion, the resonator structure to provide an output signal over one or more of the conductors corresponding to a temperature detected by the resonator structure;

a plurality of connectors disposed on a printed circuit board, the plurality of connectors to receive the contacts from one of the plurality of thermal sensors;

a thermal management circuit coupled with the plurality of connectors, the thermal management circuit to monitor the signals from the plurality of thermal sensors, to calculate thermal condition data, and to store the thermal condition data in a memory.

14. The thermal management system of claim 13 wherein the output signals from the resonator structures comprises a current having a frequency changes as the resonator structure natural frequency changes with temperature of the resonator structure, wherein a voltage applied to the resonator structure results in a proportional change in output current amplitude.

15. The thermal management system of claim 14 wherein the oscillator circuit generates a digital output signal with a frequency equal to the frequency of the output current generated from the resonator structure.

16. The thermal management system of claim 14 wherein the resonator structures comprises copper resonator structures.

17. The thermal management system of claim 14 wherein the plurality of connectors comprises a zero insertion force (ZIF) connectors.