METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING MAGNETIC TRANSFER PRINTING TECHNIQUES
First Claim
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1. A method for transferring semiconductor dice from a host substrate to a target substrate, comprising the steps of:
- providing a host substrate with semiconductor dice having magnetic portions;
magnetizing regions of a selected one of a transfer stamp or a target substrate; and
transferring the semiconductor dice from the host substrate to the magnetized regions of the selected one of the transfer stamp or target substrate by a magnetic force between the magnetized regions and portions when the host substrate is positioned adjacent to the selected one of the transfer stamp or target substrate,wherein said transferring, when the selected one is the transfer stamp, also includes releasing the semiconductor dice from the transfer stamp to the target substrate.
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Abstract
Releasable semiconductor dice are deposited with a magnetic layer and held by magnetic forces to a magnetic or electromagnetic transfer stamp for the transfer of the dice from a host substrate directly or indirectly to a target substrate.
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Citations
21 Claims
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1. A method for transferring semiconductor dice from a host substrate to a target substrate, comprising the steps of:
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providing a host substrate with semiconductor dice having magnetic portions; magnetizing regions of a selected one of a transfer stamp or a target substrate; and transferring the semiconductor dice from the host substrate to the magnetized regions of the selected one of the transfer stamp or target substrate by a magnetic force between the magnetized regions and portions when the host substrate is positioned adjacent to the selected one of the transfer stamp or target substrate, wherein said transferring, when the selected one is the transfer stamp, also includes releasing the semiconductor dice from the transfer stamp to the target substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for transferring semiconductor dice from a host substrate to a target substrate, comprising the steps of:
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providing a host substrate with semiconductor dice having magnetic portions; magnetizing regions of a transfer stamp; removing semiconductor dice from a host substrate using the magnetized regions of the transfer stamp; and releasing the semiconductor dice from the transfer stamp onto a target substrate by at least removing the transfer stamp or providing an adhesive force between the semiconductor dice and the target substrate that is greater than the magnetic force between the semiconductor dice and the transfer stamp. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A transfer stamp for transferring semiconductor dice from a host substrate to a target substrate comprising:
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a substrate; and an array of magnetized regions thereon. - View Dependent Claims (18, 19, 20, 21)
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Specification