APPARATUS AND METHOD FOR LOW-K DIELECTRIC REPAIR

• US 20110151590A1
• Filed: 07/29/2010
• Published: 06/23/2011
• Est. Priority Date: 08/05/2009
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Tang, Hairong, Armacost, Michael D., Sun, Hui, Gold, Ezra R., Markovsky, Igor, Carducci, James D., Kaya, Iwalani S., Nemani, Srinivas D., Balakrishna, Ajit, Lill, Thorsten B., Collins, Kenneth S., Zhang, Chunlei, Yieh, Ellie Y.
• Application Number:
  US12/846,664
• Publication Number:
  US 20110151590A1
• Time in Patent Office: Days
• US Class Current: 438/4
• CPC Class Codes: H01L 21/3105 After-treatment
• CPC Class Codes: H01L 21/31058 of organic layers
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: H01L 21/76814 post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
• CPC Class Codes: H01L 21/76825 by exposing the layer to particle radiation, e.g. ion implantation, irradiation with UV light or electrons etc. plasma treatment H01L21/76826
• CPC Class Codes: H01L 21/76831 in via holes or trenches, e.g. non-conductive sidewall liners

Abstract

A method, a system and a computer readable medium for integrated in-vacuo repair of low-k dielectric thin films damaged by etch and/or strip processing. A repair chamber is integrated onto a same platform as a plasma etch and/or strip chamber to repair a low-k dielectric thin film without breaking vacuum between the damage event and the repair event. UV radiation may be provided on the integrated etch/repair platform in any combination of before, after, or during the low-k repair treatment to increase efficacy of the repair treatment and/or stability of repair.

Claims

1. A vacuum chamber module for repair of plasma-damaged low-k dielectric thin films, the vacuum chamber module comprising:

a vacuum chamber including a pedestal to support a workpiece, the pedestal surrounded by chamber walls;

a vapor cabinet mechanically coupled to the vacuum chamber by a support frame, the vapor cabinet containing;

a flash vaporizer coupled to a carrier gas mass flow controller (MFC) and coupled to a low-k repair liquid chemical flow meter (LFM); and

a gas stick coupling the flash vaporizer to the low-k repair chamber to inject a vapor-phase low-k repair chemical into the repair chamber, wherein the pedestal, the chamber walls, and the gas stick are controllable to a temperature of at least 60°

C.

2. The vacuum chamber module as in claim 1, further comprising a showerhead disposed between the pedestal and the gas stick outlet, wherein the showerhead is thermally grounded to the chamber walls to be passively heated only by conduction with the chamber walls.

3. The vacuum chamber module as in claim 2, wherein the showerhead comprises bare aluminum.

4. The vacuum chamber module as in claim 1, further comprising a UV source to emit in the 200-280 nm wavelength range, wherein UV source is external to the chamber walls with a chamber wall portion between the UV source and the pedestal is UV transparent.

5. The vacuum chamber module as in claim 4, wherein the UV source has an'"'"'intensity of at least 400 watts per inch (WPI).

6. The vacuum chamber module as in claim 4, wherein the UV transparent chamber wall is disposed above the pedestal and wherein the gas stick is coupled to a chamber wall proximate to an outer perimeter of the pedestal.

7. The vacuum chamber module as in claim 6, wherein the pedestal is rotatable about a central axis of the pedestal.

8. The vacuum chamber module as in claim 1, wherein the MFC is calibrated for Helium (He).

9. The vacuum chamber module as in claim 1, wherein the chamber is controllable to a pressure between 500 mTorr and 500 Torr, wherein the pedestal is controllable to a temperature between 300-350°

C., and wherein the gas stick and chamber walls are controllable to a temperature of 100-110°

C.

10. The vacuum chamber module as in claim 1, further comprising a plasma power source to generate a plasma within the vacuum chamber.

11. A plasma processing platform for integrated in-vacuo repair of plasma-damaged low-k dielectric thin films, the platform comprising:

a plasma etch chamber module; and

a low-k repair chamber module coupled to the plasma etch chamber module by a mainframe transport module to transport a workpiece etched in the plasma etch chamber module to the low-k repair chamber under vacuum, wherein the low-k repair chamber further comprises;

a vacuum chamber including a pedestal to support a workpiece, the pedestal surrounded by chamber walls;

a vapor cabinet mechanically coupled to the vacuum chamber by a support frame, the vapor cabinet containing a flash vaporizer, a carrier gas mass flow controller (MFC) coupled to the flash vaporizer, and a low-k repair liquid chemical flow meter (LFM) coupled to the flash vaporizer; and

a gas stick coupling the flash vaporizer to the low-k repair chamber to inject a vapor-phase low-k repair chemical into the repair chamber, wherein the pedestal, the chamber walls, and the gas stick are controllable to a temperature of at least 60°

C.

12. The plasma processing platform as in claim 11, wherein the low-k repair chamber includes a plasma power source to generate a plasma within the low-k repair chamber prior

13. The plasma processing platform as in claim 12, further comprising plasma resist strip chamber coupled to the transport module to remove photo resist from a workpiece after a plasma etch process and prior to a low-k repair process without breaking vacuum.

14. A method for repair of plasma-damaged low-k dielectric thin films, the method comprising:

loading a workpiece into a vacuum processing platform, the workpiece including a low-k dielectric film having a dielectric constant below 2.5;

exposing the low-k film to a plasma in an etch chamber of the platform;

transporting, under vacuum, the workpiece from the etch chamber to a low-k repair chamber of the platform;

performing a UV treatment of the low-k dielectric film by exposing the workpiece to UV radiation source external to the low-k repair chamber;

performing a silylation treatment of the low-k dielectric film by exposing the workpiece to a vapor phase low-k repair chemistry in the low-k repair chamber; and

unloading the workpiece from the vacuum processing platform.

15. The method as in claim 14, wherein the UV treatment is performed prior to the silylation treatment.

16. The method as in claim 15, wherein the UV treatment comprises exposing the workpiece to at least 400 watts per inch (WPI) of UV radiation in the 200-280 nm wavelength range for at least 20 seconds while the workpiece is heated to 200-225°

C.

17. The methods in claim 14, wherein the vapor phase low-k repair chemistry comprises dimethylaminotrimethylsilane (DMATMS).

18. The method as in claim 17, wherein the vapor phase low-k repair chemistry comprises a carrier gas of helium (He) and wherein the DMATMS is provided at 0.5-1.0 gm/min at a pressure of 3-5 Torr for between 2 and 3 minutes.

19. The method as in claim 14, further comprising:

performing an ashing process in the low-k repair chamber prior to performing the UV treatment, wherein the ashing process comprises exposing the workpiece to a plasma of at least one oxidizing process gas.

20. The method as in claim 19, wherein the oxidizing process gas comprises CO₂.

21. The method as in claim 19, wherein the ashing process further comprises energizing the plasma with a bias power of at least 100 watts.

22. The method as in claim 14, wherein the low-k dielectric film comprises a PECVD organosilicate glass (OSG).