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APPARATUS AND METHOD FOR LOW-K DIELECTRIC REPAIR

  • US 20110151590A1
  • Filed: 07/29/2010
  • Published: 06/23/2011
  • Est. Priority Date: 08/05/2009
  • Status: Abandoned Application
First Claim
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1. A vacuum chamber module for repair of plasma-damaged low-k dielectric thin films, the vacuum chamber module comprising:

  • a vacuum chamber including a pedestal to support a workpiece, the pedestal surrounded by chamber walls;

    a vapor cabinet mechanically coupled to the vacuum chamber by a support frame, the vapor cabinet containing;

    a flash vaporizer coupled to a carrier gas mass flow controller (MFC) and coupled to a low-k repair liquid chemical flow meter (LFM); and

    a gas stick coupling the flash vaporizer to the low-k repair chamber to inject a vapor-phase low-k repair chemical into the repair chamber, wherein the pedestal, the chamber walls, and the gas stick are controllable to a temperature of at least 60°

    C.

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