METHOD OF MANUFACTURING TRANSFERABLE ELEMENTS INCORPORATING RADIATION ENABLED LIFT OFF FOR ALLOWING TRANSFER FROM HOST SUBSTRATE
First Claim
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1. A method of manufacturing a transferable element, comprising the steps of:
- providing a host substrate of a material exhibiting optical transparency;
forming an epitaxial layer on said host substrate including a layer allowing for radiation lift off;
defining one or more semiconductor die in said epitaxial layer;
adhering a transfer device to one or more of said semiconductor die;
irradiating said radiation lift off layer to weaken the layer; and
moving said transfer device and said substrate apart;
thereby transferring said one or more semiconductor die from said host substrate to said transfer device.
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Abstract
Semiconductor material is formed on a host substrate of a material exhibiting optical transparency with an intervening radiation lift off layer. A transfer device, intermediate substrate or target substrate is brought into adhesive contact with the semiconductor material and the radiation lift off layer is irradiated to weaken it, allowing the semiconductor material to be transferred off the host substrate. Electronic devices may be formed in the semiconductor layer while it is attached to the host substrate or the intermediate substrate.
223 Citations
20 Claims
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1. A method of manufacturing a transferable element, comprising the steps of:
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providing a host substrate of a material exhibiting optical transparency; forming an epitaxial layer on said host substrate including a layer allowing for radiation lift off; defining one or more semiconductor die in said epitaxial layer; adhering a transfer device to one or more of said semiconductor die; irradiating said radiation lift off layer to weaken the layer; and moving said transfer device and said substrate apart; thereby transferring said one or more semiconductor die from said host substrate to said transfer device. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of manufacturing a transferable element, comprising the steps of:
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providing a host substrate of a material exhibiting optical transparency; forming an epitaxial layer on said host substrate including a layer allowing for radiation lift off; defining one or more semiconductor die in said epitaxial layer; adhering a target substrate to one or more of said semiconductor die; irradiating said radiation lift off layer to weaken the layer; and moving said host substrate and said target substrate apart; thereby transferring said one or more semiconductor die from said host substrate to said target substrate. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method of manufacturing a transferable element, comprising the steps of:
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providing a host substrate of a material exhibiting optical transparency; forming an epitaxial layer on said host substrate including a layer allowing for radiation lift off; adhering an intermediate substrate to said epitaxial layer using selectively polymerized and unpolymerized adhesive; irradiating said radiation lift off layer to weaken the layer; removing the host substrate; defining one or more semiconductor die in said epitaxial layer; removing unpolymerized adhesive; adhering a transfer device to one or more of said semiconductor die; and moving said transfer device and said intermediate substrate apart; thereby transferring said one or more semiconductor die from said intermediate substrate to said transfer device. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification