Modular multichannel microelectrode array and methods of making same

• US 20110154655A1
• Filed: 01/06/2011
• Published: 06/30/2011
• Est. Priority Date: 10/07/2005
• Status: Active Grant

• Current Assignee: Neuronexus Technologies Incorporated (NEL Group, Inc.)
• Original Assignee: Neuronexus Technologies Incorporated (NEL Group, Inc.)
• Inventors: Anderson, David J., Kipke, Daryl R., Hetke, Jamille F., Pellinen, David S.
• Granted Patent: US 8,800,140 B2
• Time in Patent Office: Days
• US Class Current: 29/825
• CPC Class Codes: A61B 2562/043 in a linear array
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61N 1/0476 Array electrodes (including any electrode arrangement with more than one electrode for at least one of the polarities)
• CPC Class Codes: A61N 1/0534 Electrodes for deep brain stimulation
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49211 of fused material

Abstract

Some embodiments of the invention comprise a customizable multichannel microelectrode array with a modular planar microfabricated electrode array attached to a carrier and a high density of recording and/or stimulation electrode sites disposed thereon. Novel methods of making and using same are also disclosed.

Claims

1. A method of making a neuroprobe system, comprising the steps of:

providing a carrier;

providing a flexible planar microelectrode array including;

providing a substrate including a plurality of conductive interconnects disposed on the substrate and disposed between layers of dielectrics;

forming a plurality of electrode sites on the substrate such that at least some electrode sites are in contact with a corresponding interconnect, and

forming a plurality of bond pads, at least some of which are in contact with a respective interconnect;

folding the planar microelectrode array; and

coupling the planar microelectrode array to the carrier.

2. The method of claim 1, wherein providing a carrier includes providing a carrier with a lumen.

3. The method of claim 2, wherein providing a carrier with a lumen includes configuring the lumen to carry fluid.

4. The method of claim 2, further including inserting a stylet into the lumen.

5. The method of claim 2, further including inserting a wire microelectrode into the lumen.

6. The method of claim 1, wherein providing a flexible planar microelectrode array includes providing a substrate with a lateral projection having an electrode site disposed thereon.

7. The method of claim 6, wherein coupling the planar microelectrode array to the carrier includes attaching the lateral projection radially to the carrier.

8. The method of claim 7, wherein folding the planar microelectrode array includes wrapping the lateral projection of the planar microelectrode array around the carrier.

9. The method of claim 1, wherein providing a substrate includes providing multiple layers of conductive interconnects, each layer being separated by a dielectric layer.

10. The method of claim 1, wherein forming a plurality of electrode sites includes opening an aperture in a dielectric layer to form a recess and filling the recess with a first metal.

11. The method of claim 10, wherein forming a plurality of electrode sites further includes depositing a second metal and patterning the second metal to form at least one electrode site.

12. The method of claim 11, wherein patterning the second metal includes patterning at least one electrode site such that the electrode site is larger than the aperture.

13. The method of claim 1, wherein providing a flexible planar microelectrode array includes providing a flexible planar microelectrode array in a serpentine shape.

14. The method of claim 13, wherein folding the planar microelectrode array includes folding the planar microelectrode array from the serpentine shape into a straight shape.

15. The method of claim 14, wherein folding the planar microelectrode array includes crimping the planar microelectrode array at one or more fold lines.

16. The method of claim 14, wherein folding the planar microelectrode array includes folding a first segment of the serpentine shape away from a second segment of the serpentine shape at a first fold line.

17. The method of claim 16, wherein folding the planar microelectrode array includes folding the first segment of the serpentine shape towards the second segment of the serpentine shape at a second fold line approximately perpendicular to the first fold line, thereby aligning the first and second segments in a straight shape.

18. The method of claim 1, wherein forming a plurality of electrode sites includes configuring a plurality of electrode sites to operate as a composite electrode site.

19. The method of claim 18, wherein configuring a plurality of electrode sites to operate as a composite electrode site includes grouping a plurality of electrode sites through connections between electrode sites.

20. The method of claim 1, wherein coupling the planar microelectrode array to the carrier includes applying an adhesive to the carrier.