LIQUID THERMAL INTERFACE MATERIAL DISPENSE AND REMOVAL SYSTEM

• US 20110155348A1
• Filed: 12/24/2009
• Published: 06/30/2011
• Est. Priority Date: 12/24/2009
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Prstic, Suzana, GUPTA, Ashish, Garcia, Jerome L., Abazarnia, Nader N., Hastings, James R.
• Granted Patent: US 8,410,802 B2
• Time in Patent Office: Days
• US Class Current: 165/104.21
• CPC Class Codes: F28F 23/00 Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions heat-transfer, heat-exchange or heat-storage materials C09K5/00
• CPC Class Codes: G01R 31/2874 related to temperature
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Systems and methods including testing of electronic components are described. One system relates to a system including a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing. The system includes at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid. The at least one conduit is positioned so that the thermal interface material can be delivered through the conduit and onto the electronic component. The system also includes a device adapted to control the flow of the thermal interface material through the conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component. Other embodiments are described and claimed.

Claims

1. A system comprising:

a thermal control unit adapted to control the temperature of at least a portion of an electronic component during testing;

at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a thermal interface material therethrough, the thermal interface material comprising a liquid; and

a device adapted to control the flow of the thermal interface material through the at least one conduit, wherein the flow can be controlled to deliver the thermal interface material to the electronic component and to remove the thermal interface material from the electronic component.

2. The system of claim 1, wherein the device includes a first pump and a second pump, the first pump adapted to transmit the dispense the liquid thermal interface material onto the electronic component, the second pump adapted to remove a quantity of the liquid thermal interface material from the electronic component.

3. The system of claim 1, wherein the device includes a single pump adapted to dispense the liquid thermal interface material onto the electronic component and to remove a quantity of the liquid thermal interface material from the electronic component.

4. The system of claim 1, the thermal control unit including a surface adapted to make thermal contact with the electronic component, the surface including a plurality of grooves therein.

5. The system of claim 1, further comprising a supply of thermal interface material in fluid connection with the at least one conduit.

6. The system of claim 1, wherein the thermal control unit includes a pedestal, the pedestal including a surface adapted to make thermal contact with the electronic component, the surface including a plurality of openings through which the liquid thermal interface material may flow.

7. The system of claim 1, wherein the thermal control unit includes a pedestal through which the liquid thermal interface material may flow, the pedestal including a surface adapted to make thermal contact with the electronic component, the surface including a plurality of grooves therein.

8. The system of claim 7, wherein the plurality of grooves are in a criss-cross pattern.

9. The system of claim 2, wherein the at least one conduits includes at least a first conduit and a second conduit, the first conduit in communication with the first pump, and the second conduit in communication with the second pump.

10. The system of claim 1, wherein the system including a first conduit, and wherein the system further includes a tube positioned in the first conduit.

11. A method comprising:

delivering a liquid thermal interface material through a thermal control unit and onto an electronic component, the thermal control unit including at least one conduit through which the liquid thermal interface material may flow;

performing a test operation of the electronic component having the thermal interface material thereon; and

after the performing a test operation, removing at least a portion of the liquid thermal interface material from the electronic component through the thermal control unit.

12. The method of claim 11, wherein the at least one conduit includes at least a first conduit and a second conduit, wherein the delivering the liquid thermal interface material onto the electronic component is carried out through the first conduit, and wherein the removing at least a portion of the liquid thermal interface material is carried out through the second conduit.

13. The method of claim 11, the thermal control unit including a surface adapted to make thermal contact with the electronic component, the surface including a plurality of grooves therein, further comprising transmitting the thermal interface material along the grooves in the surface.

14. The method of claim 11, further comprising a pump, wherein the delivering the thermal interface material and the removing at least a portion of the thermal interface material are carried out using the pump.

15. The method of claim 11, further comprising delivering additional liquid thermal interface material through the thermal control unit to the device during the test operation, when an amount of the liquid thermal interface material has evaporated during the test operation.

16. The method of claim 11, further comprising sensing an amount of evaporation of liquid thermal interface material during the test operation and then delivering additional liquid thermal interface material through the thermal control unit to the electronic component during the test operation.

17. The method of claim 11, wherein the at least one conduit includes a first conduit, wherein the delivering the liquid thermal interface material and the removing at least a portion of the liquid thermal interface material are both carried out through the first conduit.

18. A system comprising:

a thermal control unit adapted to control the temperature of at least a portion of an component during testing; and

at least one conduit extending through a portion of the thermal control unit, the conduit sized to permit the flow of a liquid thermal interface material therethrough;

the at least one conduit including a first opening and a second opening;

the thermal control unit including a pedestal, the second opening on the pedestal, the second opening positioned to be aligned with a portion of the component to permit the flow of the liquid thermal interface material onto the component.

19. The system of claim 18, further comprising a supply of liquid thermal interface material in fluid communication with the conduit.

20. The system of claim 19, further comprising a pump adapted to apply a force to deliver the liquid thermal interface material from the supply into the conduit through the first opening and out of the conduit through the second opening and onto the component.