Method for the Cutting Machining of Workpieces Using a Laser Beam

• US 20110155708A1
• Filed: 05/28/2009
• Published: 06/30/2011
• Est. Priority Date: 05/29/2008
• Status: Active Grant

• Current Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Original Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Inventors: Himmer, Thomas, Luetke, Matthias, Beyer, Eckhard, Morgenthal, Lothar
• Granted Patent: US 9,522,442 B2
• Time in Patent Office: Days
• US Class Current: 219/121.72
• CPC Class Codes: B23K 2103/40 Paper
• CPC Class Codes: B23K 2103/42 Plastics B23K2103/16 takes precedence
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/402 involving non-metallic material, e.g. isolators

Abstract

A method is for cutting machining of a workpiece using a laser beam. The method includes (a) directing the focused laser beam onto a surface of the workpiece for a formation of a kerf; and (b) removing a material exclusively by ablation. The laser beam has a power density in a focal point of at least 1*107 W/cm². The laser beam has a feed speed taking account of an absorption capability of the material to be removed of at least 150 m/min up to a maximum of 1200 m/min.

Claims

1-10. -10. (canceled)

11. A method for cutting machining of a workpiece using a laser beam, comprising:

directing the focused laser beam onto a surface of the workpiece for a formation of a kerf; and

removing a material exclusively by ablation,

wherein the laser beam has a power density in a focal point of at least 1*107 W/cm², the laser beam has a feed speed taking account of an absorption capability of the material to be removed of at least 150 m/min up to a maximum of 1200 m/min.

12. The method of claim 11, wherein the laser beam is directed a multiple of times to the same positions of the material surface for a successive material removal along a cutting contour to be formed.

13. The method of claim 11, wherein the laser beam is focused so that the focal point has a diameter less than 100 μ

m.

14. The method of claim 11, wherein the workpiece formed from at least two materials areally connected to one another is machined and in this respect only a material removal at the material present at the workpiece surface is carried out.

15. The method of claim 14, wherein sections are formed during the cutting, the sections being removed from the machined workpiece.

16. The method of claim 14, wherein the machining is carried out at the workpiece in which the at least two materials forming the workpiece are connected to one another with material continuity.

17. The method of claim 14, wherein the machining is carried out at a workpiece which has a material absorbing the respective laser radiation and a material not absorbing the laser radiation so that only the material absorbing the laser radiation is removed in the region of kerfs to be formed.

18. The method of claim 11, wherein a feed speed of at least 700 m/min is maintained.

19. The method of claim 11, wherein the laser beam is operated in a cw mode.

20. The method of claim 11, wherein a profiling is set in the laser beam cross-section with higher intensities in an outer marginal region than in its interior.