POLYMER SUBSTRATE AND METHOD OF FORMING THE SAME AND DISPLAY DEVICE INCLUDING THE POLYMER SUBSTRATE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE

• US 20110156041A1
• Filed: 12/15/2010
• Published: 06/30/2011
• Est. Priority Date: 12/24/2009
• Status: Abandoned Application

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Kim, Tae-Woong, Jin, Dong-Un, Seo, Sang-Joon, An, Sung-Guk, Lee, Jae-Seob, Nam, Kie Hyun
• Application Number:
  US12/968,688
• Publication Number:
  US 20110156041A1
• Time in Patent Office: Days
• US Class Current: 257/59
• CPC Class Codes: H10K 2101/00 Properties of the organic materials covered by group H10K85/00
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 59/87 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A polymer substrate having a weight loss of less than about 1% based on an initial weight at a temperature ranging from about 420° C. to about 600° C., a method for forming the polymer substrate, a display device including the polymer substrate, and a method for manufacturing the display device. The method for forming the polymer substrate includes preparing the polymer layer and performing an annealing process to the polymer layer at a temperature greater than about 350° C.

Claims

1. A polymer substrate having a weight loss of less than about 1% based on an initial weight at a temperature ranging from about 420°

C. to about 600°

C.

2. The polymer substrate of claim 1, wherein the weight loss ranges from about 0.000001% to about 0.95% based on an initial weight.

3. The polymer substrate of claim 1, wherein the polymer substrate has a thermal expansion coefficient ranging from about 1 ppm/°

C. to about 50 ppm/°

C.

4. A method of producing a polymer substrate, comprising:

preparing a polymer layer; and

annealing the polymer layer at a temperature higher than about 350°

C.

5. The method of claim 4, wherein the annealing of the polymer layer is performed at a temperature ranging from about 350°

C. to about 500°

C.

6. The method of claim 4, wherein the annealed polymer layer has a thermal expansion coefficient ranging from about 1 ppm/°

C. to about 50 ppm/°

C.

7. The method of claim 4, wherein the annealed polymer layer has a weight loss of less than about 1% based on an initial weight at a temperature ranging from about 420°

C. to about 600°

C.

8. The method of claim 4, further comprising forming a substrate protective layer on the polymer layer after the annealing of the polymer layer.

9. A display device, comprising:

a polymer substrate having a weight loss of less than about 1% based on an initial weight at a temperature ranging from about 420°

C. to about 600°

C.; and

an electronic device arranged on the polymer substrate.

10. The display device of claim 9, wherein the weight loss ranges from about 0.000001% to about 0.95% based on an initial weight.

11. The display device of claim 9, wherein the polymer substrate has a thermal expansion coefficient of about 1 ppm/°

C. to about 50 ppm/°

C.

12. The display device of claim 9, wherein the electronic device includes at least one of a thin film transistor and an organic light emitting element.

13. The display device of claim 12, wherein the thin film transistor comprises:

a control electrode;

a semiconductor overlapping the control electrode;

a gate insulating layer arranged between the control electrode and the semiconductor; and

an input electrode and an output electrode electrically connected to the semiconductor, wherein the gate insulating layer comprises tetraethyl orthosilicate (TEOS).

14. A method for manufacturing a display device, comprising:

preparing a polymer substrate;

annealing the polymer substrate at a temperature greater than about 350°

C.; and

forming an electronic device on the annealed polymer substrate.

15. The method of claim 14, wherein the annealing of the polymer substrate is performed at a temperature ranging from about 350°

C. to about 500°

C.

16. The method of claim 14, wherein the electronic device is produced at a temperature greater than about 350°

C.

17. The method of claim 16, wherein the forming the electronic device comprises forming a gate insulating layer, the gate insulating layer comprises tetraethyl orthosilicate (TEOS) at a temperature greater than about 350°

C.

18. The method of claim 14, further comprising forming a substrate protective layer on the polymer substrate after the annealing of the polymer substrate.

19. A display device, comprising:

a polymer substrate having a thermal expansion coefficient ranging from 1 ppm/°

C. to 50 ppm/°

C.,

a thin film transistor formed on the polymer substrate, and

an organic light emitting element electrically connected to the thin film transistor.

20. The display device of claim 19, wherein the thin film transistor comprises:

a control electrode;

a semiconductor overlapping the control electrode;

a gate insulating layer arranged between the control electrode and the semiconductor; and

an input electrode and an output electrode electrically connected to the semiconductor.

21. The display device of claim 20, wherein the gate insulating layer comprises tetraethyl orthosilicate (TEOS).