SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD FOR FORMING THE SAME

• US 20110156078A1
• Filed: 03/10/2011
• Published: 06/30/2011
• Est. Priority Date: 07/15/2002
• Status: Active Grant

• Current Assignee: Chia-Fen Tsai, Min-Hsun Hsieh
• Original Assignee: Chia-Fen Tsai, Min-Hsun Hsieh
• Inventors: HSIEH, Min-Hsun, Tsai, Chia-Fen
• Granted Patent: US 8,853,722 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil

Abstract

A semiconductor light-emitting device includes a light-impervious substrate, a bonding structure, a semiconductor light-emitting stack, and a fluorescent material structure overlaying the semiconductor light-emitting stack. The semiconductor light-emitting stack is separated from a growth substrate and bonded to the light-impervious substrate via the bonding structure. A method for producing the semiconductor light-emitting device includes separating a semiconductor light-emitting stack from a growth substrate, bonding the semiconductor light-emitting stack to a light-impervious substrate, and forming a fluorescent material structure over the semiconductor light-emitting stack.

Claims

1. A method of applying a fluorescent material to a surface, comprising:

lumping the fluorescent material to provide a lumped fluorescent material containing no binder;

providing a semiconductor light-emitting stack having a first surface having a first portion and a second portion, and a second surface opposite to the first surface;

applying the lumped fluorescent material to the first portion;

providing a substrate; and

bonding the substrate to the second surface.

2. The method of claim 1, further comprising:

forming a first electrical connection on the second portion.

3. The method of claim 1, further comprising:

forming a second electrical connection on the substrate.

4. The method of claim 1, further comprising:

forming a bonding structure between the substrate and the second surface.

5. The method of claim 1, further comprising:

forming an ohmic contact between the substrate and the semiconductor light-emitting stack.

6. The method of claim 1, further comprising:

providing a protection layer or an optical layer between the lumped fluorescent material and the semiconductor light-emitting stack.

7. The method of claim 1, further comprising:

heating the fluorescent material.

8. The method of claim 1, further comprising:

compressing the fluorescent material.

9. The method of claim 1, wherein the step of providing the semiconductor light-emitting stack comprises forming the semiconductor light-emitting stack on a growth substrate.

10. The method of claim 9, further comprising:

separating the growth substrate from the semiconductor light-emitting stack.

11. A method of applying a fluorescent material to a surface, comprising:

lumping the fluorescent material to provide a lumped fluorescent material containing no binder;

providing one or more semiconductor light-emitting stacks;

providing a first electrical connection;

applying the lumped fluorescent material on the one or more semiconductor light-emitting stacks and next to the first electrical connection.

12. The method of claim 11, further comprising:

dicing the semiconductor light-emitting stacks.

13. The method of claim 11, further comprising:

providing a binder between the lumped fluorescent material and the one or more semiconductor light-emitting stacks.

14. The method of claim 11, further comprising:

providing a wafer before providing the one or more semiconductor light-emitting stacks.

15. The method of claim 14, further comprising:

providing a trench on the wafer for partitioning the semiconductor light-emitting stacks.

16. The method of claim 11, further comprising:

providing a substrate; and

bonding the substrate to the one or more semiconductor light-emitting stacks.

17. The method of claim 16, further comprising:

forming a bonding structure between the substrate and the one or more semiconductor light-emitting stacks.

18. A structure having a fluorescent material, comprising:

a lumped fluorescent material containing no binder;

one or more semiconductor light-emitting stacks on a side of the lumped fluorescent material;

a substrate; and

a bonding structure between the one or more semiconductor light-emitting stacks and the substrate.

19. The structure of claim 18, further comprising:

a binder between the lumped fluorescent material and the one or more semiconductor light-emitting stacks

20. The structure of claim 18, further comprising:

an electrical connection being close to the lumped fluorescent material.