SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS
First Claim
1. A semiconductor chip assembly, comprising:
- a semiconductor device;
a first adhesive that includes a first opening;
a second adhesive that includes a second opening;
a heat spreader that includes a first post, a second post and a base, wherein (i) the first post is adjacent to the base, extends vertically from the base in a first vertical direction, is located within a periphery of the second post and has a surface area that is less than one-half of a surface area of the second post, (ii) the second post is adjacent to the base and extends vertically from the base in a second vertical direction opposite the first vertical direction and (iii) the base is sandwiched between the posts and extends laterally from the posts in lateral directions orthogonal to the vertical directions; and
a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein an electrically conductive path between the pad and the terminal includes the electrical interconnect;
wherein the semiconductor device is mounted on the first post, extends vertically beyond the base in the first vertical direction, extends laterally within peripheries of the posts, is electrically connected to the pad and thereby electrically connected to the terminal and is thermally connected to the first post and thereby thermally connected to the second post;
wherein the first adhesive extends vertically beyond the base in the first vertical direction, extends laterally from the first post to or beyond the terminal and is sandwiched between the base and the pad;
wherein the second adhesive extends vertically beyond the base in the second vertical direction, extends laterally from the second post to or beyond the terminal and is sandwiched between the base and the terminal;
wherein the pad extends vertically beyond the base in the first vertical direction, the terminal extends vertically beyond the base in the second vertical direction and the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base; and
wherein the first post extends into the first opening, the second post extends into the second opening and the base is sandwiched between the adhesives and covers the semiconductor device in the second vertical direction.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and first and second adhesives. The heat spreader includes a first post, a second post and a base. The conductive trace includes a pad and a terminal. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The first post extends from the base in a first vertical direction into a first opening in the first adhesive and is located within a periphery of the second post, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts. The conductive trace provides signal routing between the pad and the terminal.
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Citations
50 Claims
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1. A semiconductor chip assembly, comprising:
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a semiconductor device; a first adhesive that includes a first opening; a second adhesive that includes a second opening; a heat spreader that includes a first post, a second post and a base, wherein (i) the first post is adjacent to the base, extends vertically from the base in a first vertical direction, is located within a periphery of the second post and has a surface area that is less than one-half of a surface area of the second post, (ii) the second post is adjacent to the base and extends vertically from the base in a second vertical direction opposite the first vertical direction and (iii) the base is sandwiched between the posts and extends laterally from the posts in lateral directions orthogonal to the vertical directions; and a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein an electrically conductive path between the pad and the terminal includes the electrical interconnect; wherein the semiconductor device is mounted on the first post, extends vertically beyond the base in the first vertical direction, extends laterally within peripheries of the posts, is electrically connected to the pad and thereby electrically connected to the terminal and is thermally connected to the first post and thereby thermally connected to the second post; wherein the first adhesive extends vertically beyond the base in the first vertical direction, extends laterally from the first post to or beyond the terminal and is sandwiched between the base and the pad; wherein the second adhesive extends vertically beyond the base in the second vertical direction, extends laterally from the second post to or beyond the terminal and is sandwiched between the base and the terminal; wherein the pad extends vertically beyond the base in the first vertical direction, the terminal extends vertically beyond the base in the second vertical direction and the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base; and wherein the first post extends into the first opening, the second post extends into the second opening and the base is sandwiched between the adhesives and covers the semiconductor device in the second vertical direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor chip assembly, comprising:
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a semiconductor device; a first adhesive that includes a first opening; a second adhesive that includes a second opening; a heat spreader that includes a first post, a second post, a first cap, a second cap and a base, wherein (i) the first post is adjacent to and integral with the base, extends vertically from the base in a first vertical direction, is sandwiched between the base and the first cap, is located within a periphery of the second post and has a surface area that is less than one-half of a surface area of the second post, (ii) the second post is adjacent to and integral with the base, extends vertically from the base in a second vertical direction opposite the first vertical direction and is sandwiched between the base and the second cap, (iii) the base is sandwiched between the posts and extends laterally from the posts in lateral directions orthogonal to the vertical directions, (iv) the first cap is adjacent to the first post, covers the first post in the first vertical direction and extends laterally from the first post and (v) the second cap is adjacent to the second post, covers the second post in the second vertical direction and extends laterally from the second post; and a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein an electrically conductive path between the pad and the terminal includes the electrical interconnect; wherein the semiconductor device is mounted on the first cap, extends vertically beyond the first cap in the first vertical direction, extends laterally within peripheries of the posts and the caps, is located within peripheries of the second post and the second cap, is electrically connected to the pad and thereby electrically connected to the terminal and is thermally connected to the first cap and thereby thermally connected to the second cap; wherein the first adhesive contacts the first post and the base, is spaced from the second post, extends vertically beyond the base in the first vertical direction, extends laterally from the first post to or beyond the terminal and is sandwiched between the base and the pad; wherein the second adhesive contacts the second post and the base, is spaced from the first post, extends vertically beyond the base in the second vertical direction, extends laterally from the second post to or beyond the terminal and is sandwiched between the base and the terminal; wherein the pad extends vertically beyond the first adhesive in the first vertical direction, the terminal extends vertically beyond the second adhesive in the second vertical direction and the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base; and wherein the first post extends into the first opening, the second post extends into the second opening, the first cap extends vertically beyond the first adhesive in the first vertical direction, the second cap extends vertically beyond the second adhesive in the second vertical direction and the base is sandwiched between the adhesives and covers the semiconductor device in the second vertical direction. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A semiconductor chip assembly, comprising:
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a semiconductor device; a first adhesive that includes a first opening; a second adhesive that includes a second opening; a heat spreader that includes a first post, a second post, a first cap, a second cap and a base, wherein (i) the first post is adjacent to and integral with the base, extends vertically from the base in a first vertical direction, is sandwiched between the base and the first cap, is located within a periphery of the second post and has a surface area that is less than one-half of a surface area of the second post, (ii) the second post is adjacent to and integral with the base, extends vertically from the base in a second vertical direction opposite the first vertical direction and is sandwiched between the base and the second cap, (iii) the base is sandwiched between the posts and extends laterally from the posts and laterally beyond the caps in lateral directions orthogonal to the vertical directions, (iv) the first cap is adjacent to the first post, covers the first post in the first vertical direction, extends laterally from the first post and is located within a periphery of the second post and (v) the second cap is adjacent to the second post, covers the second post in the second vertical direction and extends laterally from the second post; and a conductive trace that includes a pad, a terminal and an electrical interconnect, wherein the electrical interconnect is a plated through-hole and an electrically conductive path between the pad and the terminal includes the electrical interconnect; wherein the semiconductor device is mounted on the first cap, extends vertically beyond the first cap in the first vertical direction, extends laterally within peripheries of the posts and the caps, is located within peripheries of the second post and the second cap, is electrically connected to the pad and thereby electrically connected to the terminal and is thermally connected to the first cap and thereby thermally connected to the second cap; wherein the first adhesive contacts the first post and the base, is spaced from the second post, the second adhesive and the terminal, extends vertically beyond the base in the first vertical direction, extends laterally from the first post to or beyond the terminal and is sandwiched between the base and the pad; wherein the second adhesive contacts the second post and the base, is spaced from the first post and the pad, extends vertically beyond the base in the second vertical direction, extends laterally from the second post to or beyond the terminal and is sandwiched between the base and the terminal; wherein the pad extends vertically beyond the first adhesive in the first vertical direction and is located within the periphery of the second post, the terminal extends vertically beyond the second adhesive in the second vertical direction and is located outside the periphery of the second post and the electrical interconnect extends through the adhesives and the base and is spaced from and electrically isolated from the base and is located outside the periphery of the second post; and wherein the first post extends into the first opening, the second post extends into the second opening, the first cap extends vertically beyond the first adhesive in the first vertical direction, the second cap extends vertically beyond the second adhesive in the second vertical direction and the base is sandwiched between the adhesives, covers the semiconductor device in the second vertical direction and extends to peripheral edges of the assembly. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49, 50)
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Specification