IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT

• US 20110156188A1
• Filed: 11/17/2010
• Published: 06/30/2011
• Est. Priority Date: 12/31/2009
• Status: Active Grant

• Current Assignee: Tong Hsing Electronic Industries, Ltd.
• Original Assignee: Kingpak Technology Inc.
• Inventors: Kuo, Ren-Long, Hsin, Chung-Hsien, Shiao, Young-Houng, Tu, Hsiu-Wen, Lin, Chin-Fu, Chuang, Chun-Hua
• Granted Patent: US 8,928,104 B2
• Time in Patent Office: Days
• US Class Current: 257/432
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/4554 Coating
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48471 the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
• CPC Class Codes: H01L 2224/48479 on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16235 : Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/1815 : Shape

Abstract

An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured.

Claims

1. An image sensor packaging structure with a low transmittance encapsulant, the image sensor packaging structure comprising:

a substrate having a carrying surface and a bottom surface, the carrying surface being disposed thereon with a plurality of first conductive contacts;

a chip having a first surface and a second surface and provided with a plurality of second conductive contacts, the first surface being coupled to the carrying surface, the second surface being defined with a sensitization area, and the second conductive contacts being signal-connected to the first conductive contacts;

a transparent lid having a third surface and a fourth surface and disposed above the sensitization area to thereby form an air cavity; and

a low transmittance encapsulant formed on the substrate to encapsulate the chip and the transparent lid.

2. The image sensor packaging structure of claim 1, wherein the chip is a complementary metal oxide semiconductor (CMOS) image sensing chip or a charge-coupled device (CCD).

3. The image sensor packaging structure of claim 1, wherein the sensitization area comprises a plurality of photosensitive elements.

4. The image sensor packaging structure of claim 1, wherein the low transmittance encapsulant is formed on the substrate by molding or dispensing.

5. The image sensor packaging structure of claim 1, wherein the low transmittance encapsulant is a black encapsulant.

6. The image sensor packaging structure of claim 1, further comprising at least one dam peripherally disposed at a periphery of the fourth surface of the transparent lid, so as to block the low transmittance encapsulant.

7. The image sensor packaging structure of claim 1, further comprising a support having a fifth surface, a sixth surface, and an opening, the fifth surface being adhered to the second surface of the chip by a second adhesive layer, the sixth surface being coupled to the third surface of the transparent lid to cover the opening, and the opening corresponding in position to the sensitization area defined on the second surface of the chip, wherein the second adhesive layer is disposed between the sensitization area and the second conductive contacts.

8. The image sensor packaging structure of claim 7, wherein the low transmittance encapsulant further encapsulates the support.

9. The image sensor packaging structure of claim 7, further comprising at least one dam peripherally disposed at a periphery of the fourth surface of the transparent lid, so as to block the low transmittance encapsulant.

10. The image sensor packaging structure of claim 7, further comprising a first lens coupled to the third surface of the transparent lid and a second lens coupled to the fourth surface of the transparent lid.

11. The image sensor packaging structure of claim 10, wherein at least one of the first lens and the second lens is a non-spherical lens.

12. The image sensor packaging structure of claim 10, wherein the first lens is a spherical lens or a non-spherical lens.

13. The image sensor packaging structure of claim 10, wherein the second lens is a spherical lens or a non-spherical lens.

14. The image sensor packaging structure of claim 10, further comprising at least one dam peripherally disposed at a periphery of the fourth surface of the transparent lid, so as to block the low transmittance encapsulant.

15. The image sensor packaging structure of claim 10, wherein an infrared filtering layer is disposed between the second lens and the fourth surface of the transparent lid.

16. The image sensor packaging structure of claim 15, further comprising a light-blocking layer disposed on the infrared filtering layer and formed therein with a penetration window corresponding in position to the second lens.

17. The image sensor packaging structure of claim 16, further comprising at least one dam peripherally disposed at a periphery of the light-blocking layer, so as to block the low transmittance encapsulant.

18. The image sensor packaging structure of claim 10, wherein an infrared filtering layer is disposed between the first lens and the third surface of the transparent lid.

19. The image sensor packaging structure of claim 18, further comprising a light-blocking layer disposed on the fourth surface of the transparent lid and formed therein with a penetration window corresponding in position to the second lens.

20. The image sensor packaging structure of claim 19, further comprising at least one dam peripherally disposed at a periphery of the light-blocking layer, so as to block the low transmittance encapsulant.