CAMERA MODULE

• US 20110157462A1
• Filed: 03/30/2010
• Published: 06/30/2011
• Est. Priority Date: 12/25/2009
• Status: Abandoned Application

• Current Assignee: Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hon Hai Precision Industry Co., Ltd.
• Inventors: HUANG, SSU-HAN
• Application Number:
  US12/749,719
• Publication Number:
  US 20110157462A1
• Time in Patent Office: Days
• US Class Current: 348/374
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

A camera module includes a lens module, a printed circuit board (PCB), and a connection material. The lens module includes two pins. The PCB defines two conductive grooves. The lens module is disposed on the PCB. The pins are received in the conductive grooves and connected to the PCB through the connection material received within the conductive grooves.

Claims

1. A camera module comprising:

a lens module comprising two pins;

a printed circuit board (PCB) defining two conductive grooves, the lens module being disposed on the PCB, the pins being received in the conductive grooves; and

a connection material received within the conductive grooves and electrically connecting the pins to the PCB.

2. The lens module of claim 1, wherein the lens module comprises an electronic element, the pins being configured for connecting the electronic element to the PCB.

3. The camera module of claim 2, wherein the electronic element comprises a voice coil motor (VCM).

4. The camera module of claim 1, wherein the PCB comprises a continuous layer and a plurality of holed layers stacked orderly, the first conductive grooves running through the holed layers.

5. The camera module of claim 4, wherein the continuous layer and the holed layer are separately formed.

6. The camera module of claim 4, wherein each holed layer defines two through holes, the through holes being aligned with each other to form the conductive grooves.

7. The cameral module of claim 1, wherein the connection material is selected from the group consisting of solder and conductive adhesive.

8. The camera module of claim 1, further comprising a shield for shielding the lens module form interference by external electro-magnetic fields.

9. The camera module of claim 8, wherein the PCB defines two grounded grooves, the shield comprising two shield pins received in the grounded grooves and connected to the PCB through the connection material.