TOP BOND PAD FOR TRANSDUCING HEAD INTERCONNECT

• US 20110157750A1
• Filed: 03/11/2011
• Published: 06/30/2011
• Est. Priority Date: 05/23/2006
• Status: Active Grant

• Current Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Original Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Inventors: Sluzewski, David A., Schulz, Kevin J., Hoehn, Joel W., Stover, Lance E., Zhu, Jianxin
• Granted Patent: US 8,351,158 B2
• Time in Patent Office: Days
• US Class Current: 360/245.8
• CPC Class Codes: G11B 5/102 Manufacture of housing
• CPC Class Codes: G11B 5/4853 Constructional details of the electrical connection between head and arm

Abstract

A slider includes a slider body having a first side and edges defined adjacent to the first side, at least two separate insulators each adjacent to the first side of the slider body and supported by the slider body, and a conductive trace adjacent to each of the at least two separate insulators and opposite the first side of the slider body. The at least two separate insulators each are in physical contact with the slider body along the first side of the slider body such that the at least two separate insulators are physically attached to the slider body to electrically insulate each conductive trace from the slider body.

Claims

1. A slider comprising:

a slider body having a first side and edges defined adjacent to the first side;

at least two separate insulators each adjacent to the first side of the slider body and supported by the slider body; and

a conductive trace adjacent to each of the at least two separate insulators and opposite the first side of the slider body, wherein the at least two separate insulators each are in physical contact with the slider body along the first side of the slider body such that the at least two separate insulators are physically attached to the slider body to electrically insulate each conductive trace from the slider body.

2. The slider of claim 1 and further comprising a bond pad structure adjacent one of the conductive traces.

3. The slider of claim 1 and further comprising a wick-stop layer located adjacent one of the conductive traces and opposite the adjacent insulator.

4. The slider of claim 1, wherein each insulator has a first dimension that is greater than a corresponding first dimension of the adjacent conductive trace, wherein the first dimensions are defined in a direction that is generally parallel to the first side of the slider body.

5. The slider of claim 1, wherein at least one of the conductive traces extends to a trailing edge of the slider.

6. A multiple layer electrical connection structure adjacent a substrate having a leading edge, a trailing edge, a first side and a second side, wherein the first and second sides are each adjacent to both the leading and trailing edges, the connection structure comprising:

an insulator layer located adjacent the first side of the substrate;

a conductor layer adjacent to the insulator layer;

a first barrier layer located between the insulator layer and the conductor layer; and

a bonding layer adjacent the conductor layer and opposite the insulator layer, wherein the bonding layer is electrically connected to the conductor layer, and wherein at least a portion of the conductor layer is located between the bonding layer and the insulator layer.

7. The connection structure of claim 6 and further comprising:

a wick-stop layer adjacent to the conductor layer, wherein the wick-stop layer extends along a first surface of the first barrier layer opposite the insulator layer and along opposing sides of the conductor layer.

8. The connection structure of claim 7 and further comprising:

a second wick-stop layer adjacent to the conductor layer and opposite the first barrier layer.

9. The connection structure of claim 6 and further comprising:

a barrier layer adjacent to the conductor layer and opposite the insulator layer, wherein the barrier layer is in direct contact with the conductor layer.

10. The connection structure of claim 9, wherein the barrier layer comprises Ni.

11. A slider assembly comprising:

a slider body having a first side;

an overcoat portion adjacent to and supported by the slider body that has a first side substantially parallel to the first side of the slider body, wherein the overcoat portion defines an edge of the slider assembly;

an insulator layer extending along a portion of the first side of the slider body and supported by the slider body;

a first electrically conductive trace extending along a portion of the insulator layer and supported by the slider body;

an electrical lead embedded in the overcoat portion and electrically connected to the first electrically conductive trace;

a second electrically conductive trace extending from the first trace and electrically connected to the electrical lead; and

a first bond pad adjacent the first electrically conductive trace and supported by the slider body, the first bond pad being electrically connected to the first electrically conductive trace.

12. The slider assembly of claim 11, wherein an outer portion of the stud is located at the edge of the slider assembly.

13. The slider assembly of claim 11, wherein the second electrically conductive trace contacts the overcoat.

14. The slider assembly of claim 11 and further comprising:

a second bond pad located adjacent to the electrical lead and relative to the edge of the slider assembly, wherein the second bond pad is electrically connected to the electrical lead.

15. The slider assembly of claim 11 and further comprising:

a seed layer trace located at the edge of the slider assembly, wherein the seed layer trace is electrically connected between the electrical lead and the second electrically conductive trace.

16. The slider assembly of claim 11 and further comprising:

a seed layer trace that is electrically connected between the electrical lead and the first electrically conductive trace.

17. A multiple layer electrical connection structure adjacent a substrate having a leading edge, a trailing edge, a first side and a second side, wherein the first and second sides are adjacent to both the leading and trailing edges, the connection structure comprising:

an insulator layer located adjacent the first side of the substrate;

a conductor layer adjacent to the insulator layer;

a bonding layer adjacent the conductor layer and opposite the insulator layer, wherein the bonding layer is electrically connected to the conductor layer;

a first barrier layer located between the insulator layer and the conductor layer; and

a wick-stop layer adjacent to the conductor layer, wherein the wick-stop layer extends along a first surface of the first barrier layer opposite the insulator layer and along opposing sides of the conductor layer.

18. The connection structure of claim 17 and further comprising:

a second wick-stop layer adjacent to the conductor layer and opposite the first barrier layer.

19. A multiple layer electrical connection structure adjacent a substrate forming part of a slider having a leading edge, a trailing edge, a first side and a second side, wherein the first and second sides are adjacent to both the leading and trailing edges, the connection structure comprising:

an insulator layer located adjacent the first side of the substrate;

a conductor layer adjacent to the insulator layer;

a first barrier layer located between the insulator layer and the conductor layer;

a second barrier layer adjacent to the conductor layer and opposite the insulator layer, wherein the second barrier layer is in direct contact with the conductor layer; and

a bonding layer adjacent the conductor layer and opposite the insulator layer, wherein the bonding layer is electrically connected to the conductor layer.

20. A slider assembly comprising:

a slider body having a first side;

an overcoat portion adjacent to and supported by the slider body that has a first side substantially parallel to the first side of the slider body, wherein the overcoat portion defines an edge of the slider assembly;

an insulator layer extending along a portion of the first side of the slider body and extending over part of the overcoat portion;

a first electrically conductive trace extending along a portion of the insulator layer and supported by the slider body, wherein the first electrically conductive trace extends beyond the insulator layer at a location adjacent to the overcoat portion;

an electrical lead embedded in the overcoat portion and electrically connected to the first electrically conductive trace at or near the first side of the overcoat portion; and

a first bond pad adjacent the first electrically conductive trace and supported by the slider body, the first bond pad being electrically connected to the first electrically conductive trace.