Method And Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure
First Claim
1. An apparatus comprising:
- a porous mesh; and
a plurality of electronic modules connected to the porous mesh.
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Abstract
According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
37 Citations
22 Claims
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1. An apparatus comprising:
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a porous mesh; and a plurality of electronic modules connected to the porous mesh. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for cooling electronics disposed in an environment having an ambient pressure, the method comprising:
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providing a coolant comprising one of pure water or pure methanol; and bringing the electronics into direct contact with the coolant so that the coolant boils and vaporizes to thereby absorb heat from the electronics. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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15. An apparatus for cooling electronics disposed in an environment having an ambient pressure, the apparatus comprising:
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a coolant comprising one of pure water or pure methanol; and an assembly operable to bring the electronics into direct contact with the coolant such that heat from the electronics causes the coolant to boil and vaporize so that the coolant absorbs heat from the electronics as the coolant changes state. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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Specification