Light Emitting Diode Module and Method for Making the Same
First Claim
1. A light emitting diode module, comprising:
- a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer disposed between said upper circuit layer and said lower metal layer, and a plurality of through holes each penetrating said upper circuit layer, said lower metal layer and said insulating layer;
a metallic heat sink formed with a plurality of chip-support portions on an upper surface thereof and disposed below said printed circuit board so that said chip-support portions are aligned with said through holes;
a thermal connection layer that has lower and upper surfaces respectively bonded to said heat sink and said lower metal layer of said printed circuit board; and
a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of said chip-support portions and each of which is electrically connected to said upper circuit layer.
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Accused Products
Abstract
A light emitting diode module includes: a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer, and a plurality of through holes; a metallic heat sink formed with a plurality of chip-support portions and disposed below the printed circuit board; a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of the chip-support portions and each of which is electrically connected to the upper circuit layer. A method for making the light emitting diode module is also disclosed.
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Citations
21 Claims
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1. A light emitting diode module, comprising:
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a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer disposed between said upper circuit layer and said lower metal layer, and a plurality of through holes each penetrating said upper circuit layer, said lower metal layer and said insulating layer; a metallic heat sink formed with a plurality of chip-support portions on an upper surface thereof and disposed below said printed circuit board so that said chip-support portions are aligned with said through holes; a thermal connection layer that has lower and upper surfaces respectively bonded to said heat sink and said lower metal layer of said printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of said chip-support portions and each of which is electrically connected to said upper circuit layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for making a light emitting diode module comprising:
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(a) providing a printed circuit board that includes an upper circuit layer, a lower metal layer, an insulating layer disposed between the upper circuit layer and the lower metal layer, and a plurality of through holes each penetrating the upper circuit layer, the lower metal layer and the insulating layer; (b) providing a metallic heat sink that has an upper surface formed with a plurality of chip-support portions; (c) thermal bonding the lower metal layer to the upper surface of the heat sink; (d) attaching a plurality of light emitting diode chips respectively to the chip-support portions by placing the light emitting diode chips in contact with the respective chip-support portions; and (e) electrically connecting the light emitting diode chips to an upper circuit layer of the printed circuit board. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A light emitting diode module, comprising:
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a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer disposed between said upper circuit layer and said lower metal layer, and a plurality of through holes each penetrating said upper circuit layer, said lower metal layer and said insulating layer; a metallic heat sink disposed below said printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to said heat sink through one of said through holes and each of which has two bonding wires connected directly and electrically to said upper circuit layer.
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Specification