Light Emitting Diode Module and Method for Making the Same

• US 20110157897A1
• Filed: 12/15/2010
• Published: 06/30/2011
• Est. Priority Date: 12/25/2009
• Status: Active Grant

• Current Assignee: Bright LED Electronics Corp.
• Original Assignee: Bright LED Electronics Corp.
• Inventors: Wang, Chung-Kai, Liu, Yuan-Hsin, Liao, Tsung-Jen, Hsu, Yao-Tsung
• Granted Patent: US 8,240,882 B2
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]

Abstract

A light emitting diode module includes: a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer, and a plurality of through holes; a metallic heat sink formed with a plurality of chip-support portions and disposed below the printed circuit board; a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of the chip-support portions and each of which is electrically connected to the upper circuit layer. A method for making the light emitting diode module is also disclosed.

Claims

1. A light emitting diode module, comprising:

a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer disposed between said upper circuit layer and said lower metal layer, and a plurality of through holes each penetrating said upper circuit layer, said lower metal layer and said insulating layer;

a metallic heat sink formed with a plurality of chip-support portions on an upper surface thereof and disposed below said printed circuit board so that said chip-support portions are aligned with said through holes;

a thermal connection layer that has lower and upper surfaces respectively bonded to said heat sink and said lower metal layer of said printed circuit board; and

a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of said chip-support portions and each of which is electrically connected to said upper circuit layer.

2. The light emitting diode module of claim 1, wherein said thermal connection layer is formed by fusion bonding said lower metal layer and said heat sink.

3. The light emitting diode module of claim 1, wherein said thermal connection layer is formed from a solder material to bond together said lower metal layer and said heat sink.

4. The light emitting diode module of claim 3, wherein said solder material includes tin, said lower metal layer includes one of copper and iron, and said upper surface of said heat sink includes one of tin, silver and nickel.

5. The light emitting diode module of claim 3, wherein said solder material includes tin, said lower metal layer includes aluminum, and said upper surface of said heat sink includes nickel.

6. The light emitting diode module of claim 1, wherein said upper surface of said heat sink includes a metal layer made of a metal different from that of said heat sink.

7. The light emitting diode module of claim 1, wherein each of said chip-support portions is a recess dented from said upper surface of said heat sink.

8. The light emitting diode module of claim 1, wherein each of said chip-support portions is a protrusion protruding from said upper surface of said heat sink to extend through a corresponding one of said through holes.

9. The light emitting diode module of claim 1, wherein said chip-support portions and said upper surface of said heat sink are coplanar.

10. The light emitting diode module of claim 1, wherein said printed circuit board has a thickness ranging from 0.15 mm to 1.6 mm.

11. The light emitting diode module of claim 1, wherein said heat sink has a thickness ranging from 0.4 mm to 1.0 mm.

12. The light emitting diode module of claim 1, wherein said heat sink and said printed circuit board are flexible.

13. The light emitting diode module of claim 12, wherein said printed circuit board and said heat sink are formed with a plurality of perforated holes each extending through said printed circuit board and said heat sink to increase flexibility of said light emitting diode module.

14. The light emitting diode module of claim 1, further comprising a plurality of light-transmissive encapsulants each encapsulating a corresponding one of said light emitting diode chip, said upper circuit layer of said printed circuit board further including a plurality of ring-shaped flanges each projecting upwardly around a corresponding one of said through holes, each of said light-transmissive encapsulants having a peripheral end terminating along said flanges.

15. A method for making a light emitting diode module comprising:

(a) providing a printed circuit board that includes an upper circuit layer, a lower metal layer, an insulating layer disposed between the upper circuit layer and the lower metal layer, and a plurality of through holes each penetrating the upper circuit layer, the lower metal layer and the insulating layer;

(b) providing a metallic heat sink that has an upper surface formed with a plurality of chip-support portions;

(c) thermal bonding the lower metal layer to the upper surface of the heat sink;

(d) attaching a plurality of light emitting diode chips respectively to the chip-support portions by placing the light emitting diode chips in contact with the respective chip-support portions; and

(e) electrically connecting the light emitting diode chips to an upper circuit layer of the printed circuit board.

16. The method of claim 15, wherein, after the step (c), the step (d) is conducted by placing the light emitting diode chips onto the respective chip-support portions through the respective through holes.

17. The method of claim 15, wherein the lower metal layer is thermal bonded to the upper surface of the heat sink by fusion bonding the lower metal layer and the heat sink.

18. The method of claim 15, wherein the lower metal layer is thermal bonded to the upper surface of the heat sink by soldering the lower metal layer to the heat sink using a soldering material.

19. The method of claim 15, wherein the chip-support portions are formed by stamping the heat sink.

20. The method of claim 15, wherein the upper surface of the heat sink is formed by depositing a metal layer on the heat sink.

21. A light emitting diode module, comprising:

a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer disposed between said upper circuit layer and said lower metal layer, and a plurality of through holes each penetrating said upper circuit layer, said lower metal layer and said insulating layer;

a metallic heat sink disposed below said printed circuit board; and

a plurality of light emitting diode chips, each of which is placed in contact with and bonded to said heat sink through one of said through holes and each of which has two bonding wires connected directly and electrically to said upper circuit layer.