SUBSTRATE HOLDING MEMBER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD

• US 20110159200A1
• Filed: 09/01/2009
• Published: 06/30/2011
• Est. Priority Date: 09/08/2008
• Status: Active Grant

• Current Assignee: Shibaura Mechatronics Corporation
• Original Assignee: Shibaura Mechatronics Corporation
• Inventors: Kogure, Kimio
• Granted Patent: US 9,099,513 B2
• Time in Patent Office: Days
• US Class Current: 427/458
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/50 Substrate holders
• CPC Class Codes: H01L 21/68721 characterised by edge clamping, e.g. clamping ring
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile

Abstract

A substrate processing apparatus includes a tray, a mask and a rotary stage. The tray includes a substrate support configured to support an outer edge portion of a substrate, a mask support provided on an outer periphery side of the substrate support and projected above the substrate support, and a recess provided between the substrate support and the mask support. The mask covers the recess and the substrate support of the tray. The rotary stage includes an electrostatic adsorption surface and a tray mounting portion provided on an outer periphery side of the electrostatic adsorption surface and below the electrostatic adsorption surface. The outer edge portion of the substrate is projected toward the tray mounting portion side from the electrostatic adsorption surface. The substrate support is spaced below the outer edge portion of the substrate. The mask is spaced above the outer edge portion of the substrate.

Claims

1-5. -5. (canceled)

6. A substrate processing apparatus comprising:

a ring-shaped tray including a substrate support configured to support an outer edge portion of a substrate, a mask support provided on an outer periphery side of the substrate support and projected above the substrate support, and a recess provided between the substrate support and the mask support;

a ring-shaped mask covering the recess and the substrate support of the tray with the mask being superposed on the mask support of the tray; and

a rotary stage including an electrostatic adsorption surface and a tray mounting portion provided on an outer periphery side of the electrostatic adsorption surface and below the electrostatic adsorption surface,

the outer edge portion of the substrate being projected toward the tray mounting portion side from the electrostatic adsorption surface, the substrate support being spaced below the outer edge portion of the substrate and the mask being spaced above the outer edge portion of the substrate with the substrate being adsorbed onto the electrostatic adsorption surface and the tray being mounted on the tray mounting portion.

7. The substrate processing apparatus according to claim 6, wherein the recess is provided continuously throughout a periphery of the ring-shaped tray.

8. The substrate processing apparatus according to claim 6, wherein the tray mounting portion includes a restriction mechanism configured to restrict sliding motion of the tray during rotation of the rotary stage.

9. The substrate processing apparatus according to claim 6, wherein

the rotary stage is provided in a processing chamber enclosed by a chamber wall including a transfer port, and

the substrate is transferred into and out of the processing chamber through the transfer port with the substrate being supported on the tray and the mask being superposed on the tray.

10. The substrate processing apparatus according to claim 6, further comprising a lift mechanism configured to lift the tray and the mask supporting the substrate up and down above the rotary stage.

11. The substrate processing apparatus according to claim 6, wherein the substrate is processed on the rotary stage under a vacuum.

12. A substrate processing method comprising:

transferring a ring-shaped tray and a ring-shaped mask toward a rotary stage, the tray including a substrate support and a mask support provided on an outer periphery side of the substrate support and projected above the substrate support, an outer edge portion of a substrate being supported on the substrate support, the mask being superposed on the mask support and covering the outer edge portion of the substrate, the rotary stage including an electrostatic adsorption surface and a tray mounting portion provided on an outer periphery side of the electrostatic adsorption surface and below the electrostatic adsorption surface;

processing on the substrate while rotating the rotary stage, with the substrate being adsorbed onto the electrostatic adsorption surface, the tray being mounted on the tray mounting portion, the substrate support being spaced below the outer edge portion projected toward the tray mounting portion side from the electrostatic adsorption surface and the mask being spaced above the outer edge portion; and

after the processing of the substrate, canceling an electrostatic adsorption force acting on the substrate while maintain a state where the tray is mounted on the tray mounting portion and the mask is superposed on the mask support.

13. The substrate processing method according to claim 12, wherein the substrate is transferred into and out of a processing chamber including the rotary stage with the substrate being supported on the tray and the mask being superposed on the tray.

14. The substrate processing method according to claim 12, wherein the tray and the mask supporting the substrate are transferred toward the rotary stage by a lift mechanism configured to support a lower surface of the tray.

15. The substrate processing method according to claim 12, wherein the substrate is processed on the rotary stage under a vacuum.