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METHOD OF MANUFACTURING BACK SIDE ILLUMINATED IMAGING DEVICE

  • US 20110159634A1
  • Filed: 09/21/2010
  • Published: 06/30/2011
  • Est. Priority Date: 12/24/2009
  • Status: Active Grant
First Claim
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1. A method of manufacturing a back side illuminated imaging device, the method comprising:

  • forming a semiconductor detection device and a peripheral circuit device on a semiconductor substrate;

    bonding the semiconductor substrate onto a holding substrate via the semiconductor detection device and the peripheral circuit device;

    removing the semiconductor substrate from the holding substrate to transfer the semiconductor detection device and the peripheral circuit device onto the holding substrate;

    forming an amorphous semiconductor layer in which impurities are introduced, on the semiconductor detection device transferred onto the holding substrate; and

    annealing the amorphous semiconductor layer by using a microwave.

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