SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND INVERTED CAVITY IN BUMP

• US 20110163348A1
• Filed: 03/18/2011
• Published: 07/07/2011
• Est. Priority Date: 03/25/2008
• Status: Abandoned Application

• Current Assignee: Bridge Semiconductor Corporation
• Original Assignee: Bridge Semiconductor Corporation
• Inventors: Lin, Charles W.C., Wang, Chia-Chung
• Application Number:
  US13/050,934
• Publication Number:
  US 20110163348A1
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 2201/0352 Differences between the conductors of different layers of a multilayer
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/09054 Raised area or protrusion of metal substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/2018 : Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: H05K 2203/063 : of preperforated insulating layer
• CPC Class Codes: H05K 3/0061 : onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/4084 : by deforming at least one of the conductive layers

Abstract

A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a bump and a base. The conductive trace includes a pad and a terminal. The semiconductor device is mounted on the bump opposite a cavity in the bump, is electrically connected to the conductive trace and is thermally connected to the bump. The bump extends from the base into an opening in the adhesive and the base extends laterally from the bump. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a bump and a base, wherein (i) the bump is adjacent to and integral with the base and extends from the base in a first vertical direction, (ii) the base extends laterally from the bump in lateral directions orthogonal to the first vertical direction, and (iii) a cavity in the bump is covered by the bump in the first vertical direction and is not covered by the bump in a second vertical direction opposite the first vertical direction; and

a conductive trace that includes a pad and a terminal;

wherein the semiconductor device is mounted on the bump, extends beyond the bump in the first vertical direction, is located outside the cavity, extends laterally within a periphery of the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the bump and thereby thermally connected to the base;

wherein the adhesive contacts the bump and the base and extends laterally from the bump to or beyond the terminal;

wherein the conductive trace is located outside the cavity; and

wherein the bump and the cavity extend into the opening.

2. The assembly of claim 1, wherein the semiconductor device is an LED chip.

3. The assembly of claim 1, wherein the semiconductor device is electrically connected to the pad using a wire bond and is thermally connected to the bump using a die attach.

4. The assembly of claim 1, wherein the semiconductor device is electrically connected to the pad using a first solder joint and is thermally connected to the bump using a second solder joint.

5. The assembly of claim 1, wherein the adhesive contacts the pad and the terminal.

6. The assembly of claim 1, wherein the adhesive is spaced from the pad and the terminal and a dielectric layer contacts and is sandwiched between the pad and the adhesive and between the terminal and the adhesive and is spaced from the bump and the base.

7. The assembly of claim 1, wherein the adhesive laterally covers and surrounds and conformally coats a sidewall of the bump.

8. The assembly of claim 1, wherein the adhesive extends to peripheral edges of the assembly.

9. The assembly of claim 1, wherein the bump includes a bent corner that extends to the base.

10. The assembly of claim 1, wherein the bump is bent laterally outward adjacent to the base.

11. The assembly of claim 1, wherein the bump has an irregular thickness characteristic of stamping.

12. The assembly of claim 1, wherein the cavity is exposed in the second vertical direction.

13. The assembly of claim 1, wherein the cavity is covered in the second vertical direction.

14. The assembly of claim 1, wherein the cavity is unsealed and contains a filler that fills most or all of the cavity.

15. The assembly of claim 1, wherein the cavity is sealed and contains a filler that fills most or all of the cavity.

16. The assembly of claim 1, wherein the cavity extends across most of the bump in the vertical and lateral directions.

17. The assembly of claim 1, wherein the base extends to peripheral edges of the assembly.

18. The assembly of claim 1, wherein the pad and the terminal extend beyond the adhesive in the first vertical direction.

19. The assembly of claim 1, wherein the pad extends beyond the adhesive in the first vertical direction and the terminal extends beyond the adhesive in the second vertical direction.

20. The assembly of claim 1, wherein the pad and the terminal are coplanar with one another.

21. The assembly of claim 1, wherein the base and the terminal are coplanar with one another.

22. The assembly of claim 1, wherein the base, the pad and the terminal are the same metals.

23. The assembly of claim 1, wherein the base, the pad and the terminal include a gold, silver or nickel surface layer and a buried copper core and are primarily copper and the bump is primarily or entirely copper.

24. The assembly of claim 1, wherein the heat spreader includes a copper core shared by the bump and the base.

25. The assembly of claim 1, wherein the conductive trace includes a copper core shared by the pad and the terminal.

26. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a bump, a base and a cap, wherein (i) the bump is adjacent to and integral with the base, extends from the base in a first vertical direction, is adjacent to the cap and extends from the cap in a second vertical direction opposite the first vertical direction, (ii) the base extends laterally from the bump in lateral directions orthogonal to the vertical directions, (iii) the cap covers the bump in the first vertical direction and extends laterally from the bump, and (iv) a cavity in the bump is covered by the bump in the first vertical direction, is not covered by the bump in the second vertical direction, is spaced from the cap by the bump and extends across most of the bump in the vertical and lateral directions; and

a conductive trace that includes a pad and a terminal;

wherein the semiconductor device is mounted on the cap, extends beyond the cap in the first vertical direction, is located outside the cavity, extends laterally within a periphery of the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base;

wherein the adhesive contacts the bump, the base and the cap, is sandwiched between the base and the pad and between the base and the cap and extends laterally from the bump to or beyond the terminal;

wherein the conductive trace is located outside the cavity; and

wherein the bump and the cavity extend into the opening.

27. The assembly of claim 26, wherein the semiconductor device is an LED chip.

28. The assembly of claim 26, wherein the semiconductor device is electrically connected to the pad using a wire bond and is thermally connected to the cap using a die attach.

29. The assembly of claim 26, wherein the semiconductor device is electrically connected to the pad using a first solder joint and is thermally connected to the cap using a second solder joint.

30. The assembly of claim 26, wherein the adhesive contacts the pad and the terminal.

31. The assembly of claim 26, wherein the adhesive is spaced from the pad and the terminal and a dielectric layer contacts and is sandwiched between the pad and the adhesive and between the terminal and the adhesive and is spaced from the bump and the base.

32. The assembly of claim 26, wherein the adhesive laterally covers and surrounds and conformally coats a sidewall of the bump and extends to peripheral edges of the assembly.

33. The assembly of claim 26, wherein the bump is coplanar with the adhesive at the cap.

34. The assembly of claim 26, wherein the bump includes a first bent corner that extends to the base and a second bent corner that extends to the cap and the bent corners are vertically spaced from one another.

35. The assembly of claim 26, wherein the bump is bent laterally outward adjacent to the base and bent laterally inward adjacent to the cap.

36. The assembly of claim 26, wherein the bump is bent laterally outward about 90 degrees adjacent to the base and bent laterally inward about 90 degrees adjacent to the cap.

37. The assembly of claim 26, wherein the bump has an irregular thickness characteristic of stamping.

38. The assembly of claim 26, wherein the cavity is hollow, is exposed in the second vertical direction and exposes the bump in the second vertical direction.

39. The assembly of claim 26, wherein the cavity is unsealed and contains a filler that contacts the bump, is confined to the cavity, fills most or all of the cavity and is exposed in the second vertical direction.

40. The assembly of claim 26, wherein the cavity is sealed and contains a filler that contacts the bump, is confined to the cavity, fills most or all of the cavity and is covered in the second vertical direction.

41. The assembly of claim 26, wherein the cavity contains a filler that contacts the bump, extends across most of the bump in the vertical and lateral directions, is confined to the cavity, fills most or all of the cavity and is exposed in the second vertical direction.

42. The assembly of claim 26, wherein the cavity contains a filler that contacts the bump and the base, extends across most of the bump in the vertical and lateral directions, is confined to the cavity, fills most or all of the cavity and is covered by the base in the second vertical direction.

43. The assembly of claim 26, wherein the base covers the conductive trace in the second vertical direction and extends laterally beyond the cap to peripheral edges of the assembly.

44. The assembly of claim 26, wherein the pad and the terminal extend beyond the adhesive in the first vertical direction and are coplanar with one another at a surface that faces in the first vertical direction and the conductive trace includes a routing line in an electrically conductive path between the pad and the terminal.

45. The assembly of claim 26, wherein the pad extends beyond the adhesive in the first vertical direction, the terminal extends beyond the adhesive in the second vertical direction, the base and the terminal are coplanar with one another at a surface that faces in the second vertical direction and the conductive trace includes a plated through-hole that extends through the adhesive in an electrically conductive path between the pad and the terminal.

46. The assembly of claim 26, wherein the pad and the cap have the same thickness where closest to one another, have different thickness where the cap is adjacent to the bump and are coplanar with one another at a surface that faces in the first vertical direction.

47. The assembly of claim 26, wherein the base, the cap, the pad and the terminal are the same metals.

48. The assembly of claim 26, wherein the base, the cap, the pad and the terminal include a gold, silver or nickel surface layer and a buried copper core and are primarily copper and the bump is primarily or entirely copper.

49. The assembly of claim 26, wherein the heat spreader includes a copper core shared by the bump, the base and the cap.

50. The assembly of claim 26, wherein the conductive trace includes a copper core shared by the pad and the terminal.

51. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a bump, a base and a cap, wherein (i) the bump is adjacent to and integral with the base, extends from the base in a first vertical direction, is adjacent to the cap and extends from the cap in a second vertical direction opposite the first vertical direction, (ii) the base extends laterally from the bump in lateral directions orthogonal to the vertical directions, (iii) the cap covers the bump in the first vertical direction and extends laterally from the bump, and (iv) a cavity in the bump is covered by the bump in the first vertical direction, is not covered by the bump in the second vertical direction, is spaced from the cap by the bump and extends across most of the bump in the vertical and lateral directions;

a substrate that includes a dielectric layer, wherein an aperture extends through the substrate; and

a conductive trace that includes a pad and a terminal;

wherein the semiconductor device is mounted on the cap, extends beyond the cap in the first vertical direction, is located outside the cavity, extends laterally within a periphery of the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base;

wherein the adhesive contacts the bump, the base, the cap and the dielectric layer, is spaced from the pad, is sandwiched between the bump and the dielectric layer, between the base and the pad, between the base and the cap and between the base and the dielectric layer and extends laterally from the bump to or beyond the terminal;

wherein the substrate is mounted on the adhesive and the dielectric layer contacts the pad and the cap and is spaced from bump and the base;

wherein the conductive trace is located outside the cavity; and

wherein the bump and the cavity extend into the opening and the aperture, the bump extends beyond the aperture in the vertical directions and the cap covers the opening and the aperture in the first vertical direction.

52. The assembly of claim 51, wherein the semiconductor device is an LED chip.

53. The assembly of claim 51, wherein the semiconductor device is electrically connected to the pad using a wire bond and is thermally connected to the cap using a die attach.

54. The assembly of claim 51, wherein the semiconductor device is electrically connected to the pad using a first solder joint and is thermally connected to the cap using a second solder joint.

55. The assembly of claim 51, wherein the dielectric layer contacts and is sandwiched between the terminal and the adhesive.

56. The assembly of claim 51, wherein the adhesive contacts and is sandwiched between the terminal and the dielectric layer.

57. The assembly of claim 51, wherein the adhesive laterally covers and surrounds and conformally coats a sidewall of the bump and extends to peripheral edges of the assembly.

58. The assembly of claim 51, wherein the bump is coplanar with the adhesive at the cap.

59. The assembly of claim 51, wherein the bump includes a first bent corner that extends to the base and a second bent corner that extends to the cap and the bent corners are vertically spaced from one another.

60. The assembly of claim 51, wherein the bump is bent laterally outward as it extends to the base and bent laterally inward as it extends to the cap.

61. The assembly of claim 51, wherein the bump is bent laterally outward about 90 degrees as it extends to the base and bent laterally inward about 90 degrees as it extends to the cap.

62. The assembly of claim 51, wherein the bump has an irregular thickness characteristic of stamping.

63. The assembly of claim 51, wherein the cavity is hollow, is exposed in the second vertical direction and exposes the bump in the second vertical direction.

64. The assembly of claim 51, wherein the cavity is unsealed and contains a filler that contacts the bump, is confined to the cavity, fills most or all of the cavity and is exposed in the second vertical direction.

65. The assembly of claim 51, wherein the cavity is sealed and contains a filler that contacts the bump, is confined to the cavity, fills most or all of the cavity and is covered in the second vertical direction.

66. The assembly of claim 51, wherein the cavity contains a filler that contacts the bump, extends across most of the bump in the vertical and lateral directions, is confined to the cavity, fills most or all of the cavity and is exposed in the second vertical direction.

67. The assembly of claim 51, wherein the cavity contains a filler that contacts the bump and the base, extends across most of the bump in the vertical and lateral directions, is confined to the cavity, fills most or all of the cavity and is covered by the base in the second vertical direction.

68. The assembly of claim 51, wherein the base supports the substrate and the adhesive, covers the conductive trace and the substrate in the second vertical direction and extends laterally beyond the cap to peripheral edges of the assembly.

69. The assembly of claim 51, wherein the pad and the terminal extend beyond the adhesive and the dielectric layer in the first vertical direction and are coplanar with one another at a surface that faces in the first vertical direction and the conductive trace includes a routing line in an electrically conductive path between the pad and the terminal.

70. The assembly of claim 51, wherein the pad extends beyond the adhesive and the dielectric layer in the first vertical direction, the terminal extends beyond the adhesive and the dielectric layer in the second vertical direction, the base and the terminal and are coplanar with one another at a surface that faces in the second vertical direction and the conductive trace includes a plated through-hole that extends through the adhesive and the dielectric layer in an electrically conductive path between the pad and the terminal.

71. The assembly of claim 51, wherein the pad and the cap have the same thickness where closest to one another, have different thickness where the cap is adjacent to the bump and are coplanar with one another at a surface that faces in the first vertical direction.

72. The assembly of claim 51, wherein the base, the cap, the pad and the terminal are the same metals.

73. The assembly of claim 51, wherein the base, the cap, the pad and the terminal include a gold, silver or nickel surface layer and a buried copper core and are primarily copper and the bump is primarily or entirely copper.

74. The assembly of claim 51, wherein the heat spreader includes a copper core shared by the bump, the base and the cap.

75. The assembly of claim 51, wherein the conductive trace includes a copper core shared by the pad and the terminal.

76. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a bump, a base and a cap, wherein (i) the bump is adjacent to and integral with the base, extends from the base in a first vertical direction, is adjacent to the cap, extends from the cap in a second vertical direction opposite the first vertical direction and includes first and second bent corners that are vertically spaced from one another, (ii) the base extends laterally from the bump in lateral directions orthogonal to the vertical directions, (iii) the cap covers the bump in the first vertical direction and extends laterally from the bump, and (iv) a cavity in the bump is covered by the bump in the first vertical direction, is not covered by the bump in the second vertical direction, is spaced from the cap by the bump and extends across most of the bump in the vertical and lateral directions; and

a conductive trace that includes a pad and a terminal;

wherein the semiconductor device is mounted on the cap, extends beyond the cap in the first vertical direction, is located outside the cavity, extends laterally within a periphery of the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base;

wherein the adhesive contacts the bump, the base and the cap, is sandwiched between the base and the pad and between the base and the cap, extends laterally from the bump to or beyond the terminal and extends to peripheral edges of the assembly;

wherein the conductive trace is located outside the cavity;

wherein the pad and the cap are coplanar with one another at a surface that faces in the first vertical direction; and

wherein the bump and the cavity extend into the opening and the cap covers the opening in the first vertical direction.

77. The assembly of claim 76, wherein the semiconductor device is an LED device, is electrically connected to the pad using a wire bond and is thermally connected to the cap using a die attach.

78. The assembly of claim 76, wherein the bump is coplanar with the adhesive at the cap.

79. The assembly of claim 76, wherein the pad, the terminal and the cap are coplanar with one another at a surface that faces in the first vertical direction and extend beyond the adhesive in the first vertical direction and the base covers the conductive trace in the second vertical direction and extends laterally beyond the cap to peripheral edges of the assembly.

80. The assembly of claim 76, wherein the base, the cap, the pad and the terminal are the same metals and include a gold, silver or nickel surface layer and are primarily copper, the bump is primarily or entirely copper, the heat spreader includes a copper core shared by the bump, the base and the cap and the conductive trace includes a copper core shared by the pad and the terminal.

81. A semiconductor chip assembly, comprising:

a semiconductor device;

an adhesive that includes an opening;

a heat spreader that includes a bump, a base and a cap, wherein (i) the bump is adjacent to and integral with the base, extends from the base in a first vertical direction, is adjacent to the cap, extends from the cap in a second vertical direction opposite the first vertical direction and includes first and second bent corners that are vertically spaced from one another, (ii) the base extends laterally from the bump in lateral directions orthogonal to the vertical directions, (iii) the cap covers the bump in the first vertical direction and extends laterally from the bump, and (iv) a cavity in the bump is covered by the bump in the first vertical direction, is exposed in the second vertical direction, is spaced from the cap by the bump, extends across most of the bump in the vertical and lateral directions, is hollow and exposes the bump in the second vertical direction where the cavity is defined by the bump; and

a conductive trace that includes a pad and a terminal;

wherein the semiconductor device is mounted on the cap, extends beyond the cap in the first vertical direction, is located outside the cavity, extends laterally within a periphery of the cavity, is electrically connected to the pad and thereby electrically connected to the terminal, and is thermally connected to the cap and thereby thermally connected to the base;

wherein the adhesive contacts the bump, the base and the cap, is sandwiched between the base and the pad and between the base and the cap, extends laterally from the bump to or beyond the terminal and extends to peripheral edges of the assembly;

wherein the conductive trace is located outside the cavity;

wherein the pad and the cap are coplanar with one another at a surface that faces in the first vertical direction; and

wherein the bump and the cavity extend into the opening and the cap covers the opening in the first vertical direction.

82. The assembly of claim 81, wherein the semiconductor device is an LED device, is electrically connected to the pad using a wire bond and is thermally connected to the cap using a die attach.

83. The assembly of claim 81, wherein the bump is coplanar with the adhesive at the cap.

84. The assembly of claim 81, wherein the pad, the terminal and the cap are coplanar with one another at a surface that faces in the first vertical direction and extend beyond the adhesive in the first vertical direction and the base covers the conductive trace in the second vertical direction and extends laterally beyond the cap to peripheral edges of the assembly.

85. The assembly of claim 81, wherein the bump, the base, the cap, the pad and the terminal are the same metals and include a gold, silver or nickel surface layer and are primarily copper, the heat spreader includes a copper core shared by the bump, the base and the cap and the conductive trace includes a copper core shared by the pad and the terminal.