MANUFACTURING METHOD FOR AN AXIALLY SYMMETRIC LIGHT-EMITTING DIODE ASSEMBLY

• US 20110165715A1
• Filed: 09/23/2008
• Published: 07/07/2011
• Est. Priority Date: 09/23/2008
• Status: Active Grant

• Current Assignee: Helio Optoelectronics Corporation
• Original Assignee: Helio Optoelectronics Corporation
• Inventors: Chen, Jing-Yi, Chen, Ming-Hung
• Granted Patent: US 8,207,001 B2
• Time in Patent Office: Days
• US Class Current: 438/34
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A manufacturing method for an axially symmetric light-emitting diode assembly disclosed herein includes steps of: providing a substrate; and forming a plurality of light-emitting areas on the substrate. The substrate has a central axis. The light-emitting areas are arranged with axial symmetry around the central axis while being insulated from each other. Each of the light-emitting areas has at least one light-emitting diode, and the light-emitting diodes are electrically connected to each other. Since the light-emitting areas are formed on the substrate with the axially symmetric arrangement, the axially symmetric light-emitting diode assembly can present a well symmetric light pattern.

Claims

1. A manufacturing method for an axially symmetric light-emitting diode assembly, the method comprising steps of:

providing a substrate, which has an central axis; and

forming a plurality of light-emitting areas on the substrate, wherein the light-emitting areas are arranged with axial symmetry around the central axis and insulated from each other, each said light-emitting area having at least one light-emitting diode, and the light-emitting diodes being electrically connected to each other.

2. The manufacturing method of claim 1, wherein the light-emitting areas are a plurality of round light-emitting areas.

3. The manufacturing method of claim 1, wherein the light-emitting area is further divided into a plurality of equal-area, equidistant sub light-emitting areas, and the sub light-emitting areas have a same number of the light-emitting diodes.

4. The manufacturing method of claim 3, wherein the sub light-emitting areas are a plurality of non-rectangular sub light-emitting areas.